sony_MZ-B100_service_manual 维修电路图.pdf

PORTABLE MINIDISC RECORDER MZ-B100 SERVICE MANUALTourist Model Ver 1.0 2001.10 9-873-341-01 2001J0200-1 2001.10 Sony Corporation Personal Audio Company Published by Sony Engineering Corporation SPECIFICATIONS Model Name Using Similar MechanismNEW Mechanism TypeMT-MZB100-171 Optical Pick-up NameLCX-4R US and foreign patents licensed from Dolby Laboratories Licensing Corporation Continued on next page System Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs Wavelength: = 790 nm Emission duration: continuous Laser output: less than 44.6 W (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Recording and playback time When using MDW-80 Maximum 160 min. in monaural. Maximum 320 min. in stereo Revolutions 350 rpm to 2,800 rpm (CLV) Error correction ACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Sampling rate converter Input: 32 kHz/44.1 kHz/48 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3 LP2/LP4 Modulation system EFM (Eight to Fourteen Modulation) Speaker 28 mm (1 1/8 in.) dia. Frequency response (digital/analog input) 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Inputs Microphone: stereo mini-jack (minimum input level 0.25 mV) Line in1): stereo mini-jack for analog input (minimum input level 39 mV) optical (digital) mini-jack for optical (digital) input Outputs i : stereo mini-jack (dedicated remote control jack) Maximum output (DC)2) Headphones: 5 mW + 5 mW (16 ohm) Speaker: 70 mW 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MZ-B100 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. 1. SERVICING NOTES.3 2. GENERAL.4 3. DISASSEMBLY 3-1. Panel (Lower) ASSY. 6 3-2. Main Board .6 3-3. Cabinet (Belt) Section.7 3-4. Key Board Unit. 7 3-5. Mechanism Deck .8 3-6. Optical Pick-up Block (LCX-4R) . 9 3-7. Holder ASSY . 10 3-8. Motor, DC (Sled) (M602) . 10 3-9. “Motor, DC (Spindle) (M601)”, “Motor, DC (Over Write Head Up/Down) (M603)”. 11 4. TEST MODE. 12 5. ELECTRICAL ADJUSTMENTS. 19 6. DIAGRAMS 6-1. Explanation of IC Terminals . 24 6-2. Block Diagrams (Main Section (1/3). 30 6-3. Block Diagrams (Main Section (2/3). 31 6-4. Block Diagrams (Main Section (3/3). 32 6-5. Printed Wiring Board (Main Section (1/2) . 33 6-6. Printed Wiring Board (Main Section (2/2) . 34 6-7. Schematic Diagram (Main Section (1/4). 35 6-8. Schematic Diagram (Main Section (2/4). 36 6-9. Schematic Diagram (Main Section (3/4). 37 6-10. Schematic Diagram (Main Section (4/4). 38 7. EXPLODED VIEW 7-1. Panel (Lower) Section. 42 7-2. Panel (Upper Lid) Section . 43 7-3. Cabinet (Belt) Section. 44 7-4. Mechanism Deck Section (MT-MZB100-171). 45 8. ELECTRICAL PARTS LIST. 46 TABLE OF CONTENTS General Power requirements DC 3V LR6 (size AA) alkaline dry battery (world model only) Battery operation time Battery life1) When recording2)3)(Unit: approx.hours) (JEITA4) Recording modeApprox. hours Stereo9 LP2 Stereo12.5 LP4 Stereo15 MONO12 1)The battery life may be shorter due to operating conditions and the temperature of the location. 2)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Recording time may differ according to the alkaline batteries. 3)When recorded with the built-in microphones. 4)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. When playing1)(Unit: approx.hours) (JEITA2) Recording modeSpeaker3)Headphones4) Stereo25.534.5 LP2 Stereo2739.5 LP4 Stereo3043 MONO3043 1)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). 2)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. 3)When played using the built-in speaker. 3)When played using headphones. Dimensions Approx. 105.7 80.0 24.9 mm (w/h/d) (4 1/4 3 1/8 1 in.) not incl. projecting parts and controls. Mass Approx. 160 g (5.7 oz) (main unit only) Supplied accessories Remote control (1) Headphones (1) Carrying pouch (1) Hand strap (1) Sony LR6 (size AA) alkaline dry battery (1) 1)The LINE IN (OPTICAL) jack is used to connect either a digital (optical) cable or a line (analog) cable. 2)Measured in accordance with JEITA. Design and specifications are subject to change without notice. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MZ-B100 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4R) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD SECTION 1 SERVICING NOTES When repairing this device with the power on, if you remove the MAIN board or open the upper panel assy, this device stops work- ing. In this case, you can work without the device stopping by fasten- ing the hook of the open/close detect switch (S804). This set is designed to perform automatic adjustment for each adjustment and write its value to EEPROM. Therefore, when EEPROM (IC802) has been replaced in service, be sure to per- form automatic adjustment and write resultant values to the new EEPROM. (Refer to Section 5 Electrical Adjustment. (page 19) Replacement of CXD 2671-209GA (IC801) used in this set re- quires a special tool. laser-tap S804 z UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-B100 SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS Front of the recorder Back of the recorder This section is extracted from instruction manual. 1 SPEED CONTROL dial 2 .REVIEW/AMS/CUE/AMS (search /AMS) buttons 3 VOR indicator 4 DISPLAY button 5 PLAY MODE button 6 EDIT/ENTER button 7 EASY SEARCH +/ buttons 8 Display window 9 x STOP button 0 N PLAY (play) button The N PLAY button has a tactile dot. qa X PAUSE button qs z REC button qd REC indicator 1 Battery compartment 2 CLOCK SET button 3 SOUND button 4 LINE IN (OPTICAL) jack 12 9q;qaqsqdqfqgqhw;wawswd wfwgwh 3456 78qjqkql How to attach the hand strap. 2 1 3 4 5 6 qf TRACK MARK button qg REC MODE switch qh GROUP button qj Speaker qk DC IN 3V jack ql Microphones w; i (headphones) jack wa OPEN switch ws HOLD switch wd VOL control The VOL control has a tactile dot. wf VOR button wg SYNCHRO REC ON/OFF switch wh ERASE button 5 MIC (PLUG IN POWER) jack The MIC (PLUG IN POWER) jack has a tactile dot. 6 MIC SENS (H/L) switch 5 MZ-B100 1 Character information display Displays the disc and track names, date, error messages, track numbers, recording level, etc. 2 Group indication 3 Play mode indication 4 Disc indication Shows that the disc is rotating for recording, playing or editing an MD. 5 VOR indication 1 Stereo mini plug 2 SOUND button 3 TRACK MARK button 4 HOLD switch Slide to lock the controls of the remote control. 5 X (pause) button The display window The remote control 124567 qdqsqaq;98 3 A B C D E G F H I J 6 Battery level indication 7 SYNC (synchro-recording) indication 8 Playback level meter 9 V-UP indication 0 STEREO (stereo), LP2 (LP2 stereo), LP4 (LP4 stereo), MONO (monaural) indication qa Pause indication qs SOUND indication qd REC indication 6 Headphones 7 x (stop) button 8 N buttons The N buttons has a tactile dot. 9 .REVIEW/AMS 0 VOL control The VOL control has a tactile dot. 6 MZ-B100 SECTION 3 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 3-1. PANEL (LOWER) ASSY 3-2. MAIN BOARD z The equipment can be removed using the following procedure. Panel (lower) ASSY Optical pick-up blockHolder ASSYMotor, DC (sled) (M602)Motor, DC (spindle) (M601) , Motor, DC (over write head up/down) (M603) SetMain boardCabinet (belt) sectionKey board unit Mechanism deck 2 Screws (ES lock) 2 Screws (ES lock) 1 Screws (B1.7x4) S301 S809 Panel (upper lid) ASSY 3 MIC SENS knobSYNCHRO REC knob Panel (lower) ASSY z Caution during assembly Position the SYNCHRO REC knob and the S809, position the MIC SENS knob and the S301 respectively. 3 Remove solder (4 places) 1 Screws 1 Screws 6 CN501 2 CN801 4 CN701 Panel (upper lid) ASSY Hold knob Main board 5 z Caution during assembly Position the hold knob and the S801 respectively 7 MZ-B100 3-3. CABINET (BELT) SECTION 3-4. KEY BOARD UNIT 1 Screws (ES lock) 2 Open 1 Screws (ES lock) Panel (upper lid) ASSY 3 Cabinet (belt) section 6 Remove solder (4 places) 8 Remove solder (2 places) 7 Remove solder (2 places) 9 Claws 5 Screws 3 Screws (B2.0) 5 Screw 1 Screws 2 Cover (REC) 4 Speaker Panel (upper lid) ASSY MIC101 MIC201 Key board unit 0 8 MZ-B100 3-5. MECHANISM DECK 4 Screws (ES lock) 3 Screws (ES lock) 5 Screw (ES lock) 1 Screws (ES lock) Mechanism deck (MT-MZB100-171) 9 8 Screws (ES lock) 2 6 7 Screws (ES lock) Cabinet (front) Set chassis ASSY Cabinet (belt) 9 MZ-B100 3-6. OPTICAL PICK-UP BLOCK (LCX-4R) 4spring, rack 3screw (M1.4) 1washer (0.8-2.5) 2gear (SA) 5screw (M1.4) 6spring, thrust detent 8Pull off “screw, lead” 7 over write head section Optical pick-up block (LCX-4R) 9Opening the over write head toward the direction A, remove the optical pick-up block (LCX-4R) toward the direction B. A B Note: Do not open the entire assy forcibly, when opening the over write head. 10 MZ-B100 2Push the convex portion toward the direction B and open the holder assy toward the direction A to erect uprightly. 3Remove the concave portion in the direction of arrow C. 5Remove the holder assy in the direction of arrow D. D C B A 1Open the holder assy. 4boss 5motor, DC (sled) (M602) 4two screws (M1.4) 1Remove six solders of motor flexible board. 2washer (0.8-2.5) 3gear (SA) 3-7. HOLDER ASSY 3-8. MOTOR, DC (SLED) (M602) 11 MZ-B100 5motor, DC (spindle) (M601) 4three screws (M1.4) 1Remove six solders of motor flexible board. qamotor, DC (over write head up/down) (M603) 6two screws (M1.4) qschassis assy, gear 9screw (M1.2) 0gear (HA) gear (HA) chassis assy, gear 2.65 mm motor, DC (over write head up/down) (M603) 8gear (HB) 7washer (0.8-2.5) 2washer (0.8-2.5) 3gear (HC) Note: Press-fit the gear (HA) up to the position of the “motor, DC (over write head up/down) (M603) as shown below. 3-9. “MOTOR, DC (SPINDLE) (M601)”, “MOTOR, DC (OVER WRITE HEAD UP/DOWN) (M603)” 12 MZ-B100 2 In the normal mode, turn on the HOLD switch on the set. While pressing theNkey on the set, press the following set keys in the following order: tt.t.tt.t t.tXtX Operation in Setting the Test Mode When the test mode becomes active, first the display check mode is selected. (Pressxkey once, when the display check mode is not active.) Other mode can be selected from the display check mode. When the test mode is set, the LCD repeats the following dis- play. LCD display When theXkey is pressed and hold down, the display at that time is held so that display can be checked. Releasing the Test Mode For test mode set with the method 1: Turn off the power and open the solder bridge on SL801 (TEST) on the MAIN board. Note: Remove the solders completely. Remaining could be shorted with the chassis, etc. For test mode set with the method 2: Turn off the power. Note: If electrical adjustment (see page 19) has not been finished com- pletely, always start in the test mode. (The set cannot start in nor- mal mode.) SECTION 4 TEST MODE Outline This set provides the Overall adjustment mode (Assy mode) that allows CD and MO disc to be automatically adjus