SONY MZ-DH10P_sm 维修电路图.pdf

SERVICE MANUAL PORTABLE MD PLAYER MZ-DH10P Ver. 1.2 2005.05 SPECIFICATIONS 9-879-552-03 2005E05-1 2005.05 Sony Corporation Personal Communications Business Division Published by Sony Engineering Corporation US and foreign patents licensed from Dolby Laboratories. Model Name Using Similar MechanismNEW MD Mechanism TypeMT-MZDH10P-181 Optical Pick-up NameABX-UJ US Model AEP Model UK Model Chinese Model Tourist Model SonicStage is trademark or registered trademark of Sony Corporation. MD Simple Burner, OpenMG, “MagicGate”, “MagicGate Memory Stick”, “Memory Stick”, Hi-MD, Net MD, ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks of Sony Corporation. Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft Corporation in the United States and /or other countries. IBM and PC/AT are registered trademarks of International Business Machines Corporation. Macintosh is a trademark of Apple Computer, Inc. in the United States and/ or other countries. Pentium is a trademark or registered trademark of Intel Corporation. All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders. and marks are omitted in this manual. CD and music-related data from Gracenote, Inc., copyright 2000-2004 Gracenote. Gracenote CDDB Client Software, copyright 2000-2004 Gracenote. This product and service may practice one or more of the following U.S. Patents: #5,987,525; #6,061,680; #6,154,773, #6,161,132, #6,230,192, #6,230,207, #6,240,459, #6,330,593, and other patents issued or pending. Services supplied and/or device manufactured under license for following Open Globe, Inc. United States Patent 6,304,523. Gracenote is a registered trademarks of Gracenote. The Gracenote logo and logotype, and the “Powered by Gracenote” logo are trademarks of Gracenote. Program 2001, 2002, 2003, 2004, 2005 Sony Corporation Documentation 2005 Sony Corporation ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?* ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?* ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 收音机爱好者资料库 Ra d i o Fa n s .CN For other Service and User Manuals, go to www.ManualD MZ-DH10P 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? Supplied Accessories AC power adaptor Remote control 1) USB cradle Earphones Dedicated USB cable2) LIP-4WM Lithium-ion rechargeable battery Rechargeable battery case Carrying pouch Ferrite core (for the remote cord, AEP and UK models only) CD-ROM3) (SonicStage/MD Simple Burner) Operating Instructions 1) For US model, remote control with a ferrite core is supplied. 2) For Chinese and Tourist models, the ferrite core is not attached to the dedicated USB cable. 3) Do not play a CD-ROM on an audio CD player. Ver. 1.2 ? ? ? ? ? ? ? ? ? 120V AC, 60Hz (US model) 220V AC, 50Hz (Chinese model) 收音机爱好者资料库 Ra d i o Fa n s .CN MZ-DH10P 3 TABLE OF CONTENTS 1.SERVICING NOTES.4 2.GENERAL.5 3.DISASSEMBLY 3-1.Disassembly Flow .6 3-2.Panel (Bottom) Block .7 3-3.Camera Module .7 3-4.MAIN Board.8 3-5.Panel (Upper) Block .8 3-6.Ornamental Belt .9 3-7.Mechanism Deck (MT-MZDH10P-181), Battery Case .9 3-8.Gear (SA), Gear (SB) . 10 3-9.OP Service Assy . 10 3-10. DC Motor SSM18D/C-NP (Spindle) (M701), DC Motor SSM21A/C-NP (Sled) (M702), DC Motor Unit (Over Write Head Up/Down) (M703) . 11 3-11. Holder Assy . 11 3-12. Position Of Ferrite Core . 12 4.TEST MODE. 13 5.ELECTRICAL ADJUSTMENTS. 17 6.DIAGRAMS 6-1.Block Diagram MD SERVO Section . 21 6-2.Block Diagram AUDIO/CAMERA Section . 22 6-3.Block Diagram POWER SUPPLY Section . 23 6-4.Schematic Diagram MAIN Board (1/9) . 25 6-5.Schematic Diagram MAIN Board (2/9) . 26 6-6.Schematic Diagram MAIN Board (3/9) . 27 6-7.Schematic Diagram MAIN Board (4/9) . 28 6-8.Schematic Diagram MAIN Board (5/9) . 29 6-9.Schematic Diagram MAIN Board (6/9) . 30 6-10. Schematic Diagram MAIN Board (7/9) . 31 6-11. Schematic Diagram MAIN Board (8/9) . 32 6-12. Schematic Diagram MAIN Board (9/9) . 33 6-13. Printed Wiring Board MAIN Board (Component Side) . 34 6-14. Printed Wiring Board MAIN Board (Conductor Side) . 35 6-15. Printed Wiring Boards PANEL Section . 36 6-16. Schematic Diagram PANEL Section . 37 7.EXPLODED VIEWS 7-1.Overall Section . 51 7-2.Panel (Upper) Section . 52 7-3.Chassis Section. 53 7-4.Mechanism Deck Section (MT-MZDH10P-181) . 54 8.ELECTRICAL PARTS LIST. 55 Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ? ? ? ? ? ? Ver. 1.2 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-DH10P SECTION 1 SERVICING NOTES The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT OPERATION CHECK WHEN THE MAIN BOARD IS REMOVED In making an operation check with the MAIN board removed from the set, short the SL894 of the MAIN board with the solder before starting the operation check. Note: Be sure to remove the solder used for shortcircuit after the repaire completed. MAIN BOARD (Conductor Side) SL894 UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40 C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Providing the required system environment The following system environment is required in order to use the SonicStage Ver. 3.0/MD Simple Burner Ver. 2.0 software for the MD Walkman. This software is not supported by the following environments: OSs other than the indicated above Personally constructed PCs or operating systems An environment that is an upgrade of the original manufacturer-installed operating system Multi-boot environment Multi-monitor environment Macintosh We do not ensure trouble-free operation on all computers that satisfy the system requirements. The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard (factory) settings. For Windows 2000 Professional users, install Service Pack 3 or later version before using the software. We do not ensure trouble-free operation of the system suspend, sleep, or hibernation function on all computers. System requirements ComputerIBM PC/AT or Compatible CPU: Pentium III 450 MHz or higher Hard disk drive space: 200 MB or more (1.5 GB