SONY mdx65_11 维修电路图.pdf

1 MICROFILM Model Name Using Similar MechanismMDX-62 Mini Disc Mechanism TypeMG-798K-133 Optical Pick-up NameKMS-241A/J2N SERVICE MANUALUS Model Canadian Model AEP Model UK Model E Model MDX-65 MINIDISC CHANGER SystemMini disc digital audio system Laser Diode Properties Material: GaAlAs Wavelength: 780 nm Emission Duration: Continuous Laser output Power: Less than 44.6 W* * This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block. Frequency response 10 20,000 Hz Wow and flutter Below measurable limit Signal-to-noise ratio 95 dB OutputsBus control output (8 PIN) Analog audio output (RCA PIN) Current drain300 mA (MD playback) 600 mA (during loading or ejecting a disc) DimensionsApprox. 176 83.5 142 mm (7 3 3/8 5 18/32 in.) (w/h/d) not incl. projecting parts and controls MassApprox. 1.1 kg (2 lb. 7 oz.) Power requirement 12 V DC car battery (negative ground) Supplied accessories Mounting hardware (1 set) Bus cable 5.5 m (1) RCA pin cord 5.5 m (1) U.S. and foreign patents licensed from Dolby Laboratories Licensing Corporation. Design and specifications subject to change without notice. SPECIFICATIONS Sony BUS system compatible with mobile MD changers. Direct-in system for inserting and removing MDs easily. No waiting time to change discs in continuous play. The MD changer compartment has a built in light for easy use even in the dark. 1 bit Digital/Analog converter for high quality sound reproduction. FEATURES Dolby noise reduction extension manufactured under license from Dolby Laboratories Licensing Corporation. “DOLBY” and the double-D symbol a are trademarks of Dolby Laboratories Licensing Corporation. 收音机爱好者资料库 Ra d i o Fa n s .CN 2 TABLE OF CONTENTS 1. SERVICE NOTE 1-1. To Place the Set into Playback Mode. 3 1-2. How to Check the Servo Board Waveforms . 3 2. GENERAL Preparations . 4 Listening MDs . 4 Connections . 5 3. DISASSEMBLY 3-1. Panel (Rear) Assy. 6 3-2. Case (Upper) . 6 3-3. Panel (Front) Assy. 7 3-4. MD Block. 7 3-5. Main Board . 8 3-6. Chassis (OP) Block . 8 3-7. Servo Board. 9 3-8. Optical Pick-up . 9 3-9. Note on Assembly for the Chassis (OP) Block . 10 4. DIAGRAMS 4-1. IC Pin Descriptions . 11 4-2. Circuit Boards Location . 14 4-3. Block Diagram . 15 4-4. Printed Wiring Boards Servo Section . 17 4-5. Schematic Diagram Servo Section. 21 4-6. Schematic Diagram Main Section. 23 4-7. Printed Wiring Boards Main Section . 26 4-8. Printed Wiring Board Power Section . 29 4-9. Schematic Diagram Power Section . 31 5. EXPLODED VIEWS 5-1. Case Section . 38 5-2. Main Board Section . 39 5-3. MD Section (1). 40 5-4. MD Section (2). 41 5-5. MD Section (3). 42 6. ELECTRICAL PARTS LIST. 43 SERVICE NOTE CAUTION Use of controls or adjustments or performance of proce- dures other than those specified herein may result in haz- ardous radiation exposure. Notes on Chip Component Replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. NOTES ON PICK-UP FLEXIBLE BOARD The pick-up flexible board in this set is secured to the optical pick-up with an adhesive tape. Once the tape is removed, an adhering force becomes weak, and it cannot be reused. Therefore, if the optical pick-up is replaced, replace also the pick-up flexible board with a new one. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241A/J2N) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care. laser-tap SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. OPTICAL PICK-UP FLEXIBLE BOARD ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 BP1 BP2 MDX-65 Master unit (CDX-C880, C880R, etc.) BUS CONTROL INBUS CONTROL OUT SECTION 1 SERVICE NOTE 1-1. TO PLACE THE SET INTO PLAYBACK MODE The this set has no key control function and cannot be placed into the Playback mode alone. For key control, the this set is controlled through serial communication with a master unit (car audio player, TV tuner or source selector compatible with the Sony BUS system.) To service the this set, the set should be connected as given below: 1-2. HOW TO CHECK THE SERVO BOARD WAVEFORMS 1. Remove the panel (rear) assy, case (upper) and panel (front) assy. Then, remove the main board from the mechanism deck. (See page 8 of “SECTION 3. DISASSEMBLY”.) 2. Remove the chassis (OP) block from the mechanism deck. (See page 10 of “SECTION 3. DISASSEMBLY”.) 3. Short each bridge points BP1 and BP2 on the main board by solder bridge. main board (conductor side) 4. Connect the power board with the main board by the main flexible board. Connect the main board with the servo board by the servo flexible board. 5. Connect to a master unit. With the master unit OFF, press the preset buttons 4 n 5 n 1 (2 seconds or more each) in this turn to enter the TEST mode. 6. Open the doors and insert a disc in the chassis (OP) assy. Use the SOURCE button on the master unit to select to MD to playback. 7. Check the waveforms at each point on the servo board. Note: After this check is completed, remove solder between shorted bridge points BP1 and BP2 and open these points. 收音机爱好者资料库 Ra d i o Fa n s .CN 4 SECTION 2 GENERALThis section extracted from US, Canadian, E models instruction manual. 5 6 1 BVTT 2.6x6 3 case (upper) 2 BVTT 2.6x6 2 PTT 2.6x8 4 BVTT 2.6x6 3 BVTT 2.6x6 6 panel (rear) assy 5 CN901 1 cover SECTION 3 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 3-1. PANEL (REAR) ASSY 3-2. CASE (UPPER) 7 1 damper (798) 2 damper (798) 3 tension spring (FL) 4 tension spring (FL) 5 tension spring (FL) 6 MD block 1 claw 2 claw 3 panel (front) assy 4 CN620 3-3. PANEL (FRONT) ASSY 3-4. MD BLOCK 8 4 bearing (ELV) 7 bearing (ELV) 9 worm wheel (ELV2) 6 chassis (OP) block 3 chassis (bottom) assy 1 precision screws (P 1.7x1.8) 2 precision screws (P 1.7x1.8) 5 bearing (ELV) 8 bearing (ELV) 1 cushion 3 escutcheon 6 chassis (front) 7 collar (EHS) 5 lead stopper ! CN700 ! CN701 ! CN603 ! CN601 0 CN600 ! CN500 9 CN602 ! MAIN board ! cushion (MAIN) 8 sheet (MAIN PC board) 2 screws (M1.7) ! special flat screws (1.7x3) 4 screws (M1.7) 3-5. MAIN BOARD 3-6. CHASSIS (OP) BLOCK 9 1 screws (K1.7x3.5) 2 optical pick-up 1 CN200 6 CN100 5 CN300 4 CN400 3 screws (M1.7x2.2) 7 SERVO board 2 Unsolder the motor lead wires. 3-7. SERVO BOARD 3-8. OPTICAL PICK-UP 10 A B B B A A 2 Turn the three feed screw (ELV) assy fully in the direction of arrows A. !Turn the three gear (ELVB) fully in the direction of arrows B. 6 bearing (ELV) 7 bearing (ELV) 0 precision screws (P1.7x1.8) 9 precision screw (P1.7x1.8) 8 chassis (bottom) assy 5 chassis (OP) block 3 bearing (ELV) 4 bearing (ELV) 1 worm wheel (ELV2) ! gear (ELVC) ! gear (ELVA2) ! polyethylene washer ! polyethylene washer 3-9. NOTE ON ASSEMBLY FOR THE CHASSIS (OP) BLOCK 11 4-1. IC PIN DESCRIPTIONS IC100 CXA2523AR (RF AMP) Pin No.Pin NameI/OPin Description 1III-V converted RF signal input (I) from detector of optical pick-up. 2JII-V converted RF signal input (J) from detector of optical pick-up. 3VCOCenter voltage (+1.65 V) generation output 4 9A FISignal input (A to F) from detector of optical pick-up. 10PDIQuantity monitor input of light from laser diode of optical pick-up. 11APCOLaser amplifier output to automatic power control circuit. 12APCREFIReference voltage input for laser power setting. 13GNDGND 14TEMPIITemperature sensor connecting pin (Not used in this set.) 15TEMPROReference voltage output for temperature sensor. (Not used in this set.) 16SWDTIWrite data signal input from System controller (IC600). 17SCLKISerial clock signal input from System controller (IC600). 18XLATISerial latch signal input from System controller (IC600). 19XSTBYIStandby signal input (“L” : Standby) (Fixed at “H” in this set.) 20FOCNTICenter frequency control voltage input of internal circuit filter (BPF22, BPF3T and EQ). 21VREFOReference voltage output (Not used in this set.) 22EQADJICenter frequency setting input of internal circuit filter (EQ). 233TADJICenter frequency setting input of internal circuit filter (BPF3T). 24VCCPower supply pin (+3.3 V) 25WBLADJICenter frequency setting input of internal circuit filter (BPF22). 26TEOTracking error signal output to CXD2652AR (IC200). 27CSLEDIConnecting pin for low pass filter condenser of sled error signal. 28SEOSled error signal output to CXD2652AR (IC200). 29ADFMOFM signal output of ADIP. 30ADINIFM signal input of ADIP by AC combination. 31ADAGCIExternal condenser connecting pin for AGC of ADIP. 32ADFGOADIP double FM signal output (22.05 kHz 1 kHz) to CXD2652AR (IC200). 33AUXOSupport signal (I3 signal/temperature signal) output (Not used in this set.) 34FEOFocus error signal output to CXD2652AR (IC200). 35ABCDOQuantity signal output of light to CXD2652AR (IC200). 36BOTMOBottom hold signal output of quantity signal (RF/ABCD) of light to CXD2652AR (IC200). 37PEAKOPeak hold signal output of quantity signal (RF/ABCD) of light to CXD2652AR (IC200). 38RFOPlayback EFM RF signal output to CXD2652AR (IC200). 39RFAGCIExternal condenser connecting pin of AGC circuit for RF. 40AGCIIRF signal input by AC combination. 41COMPOOUser comparator output pin (Not used in this set.) 42COMPPIUser comparator input pin (Fixed at “L” in this set.) 43ADDCIExternal condenser connecting pin for low frequency interception of ADIP amplifier. 44OPOOExternal condenser connect pin for lower cut of ADIP amplifier. 45OPNIUser operational amplifier inversion input pin (Fixed at “L” in this set.) 46RFOORF signal output 47MORFIIRF signal input of MO by AC combination. 48MORFOORF signal output of MO. SECTION 4 DIAGRAMS 12 IC600 PD784216GC-027-8EU (SYSTEM CONTROLLER) Pin No.Pin NameI/OPin Description 1M1OElevator motor (M904) drive signal output 2M1OElevator motor (M904) drive signal output 3M2OLoading motor (M903) drive signal output 4M2OLoading motor (M903) drive signal output 5MDMONOMechanism deck system power control output (“H” : Power ON) 6LESILoading end sensor detection switch (S902) input 7SESIStore end sensor detection switch (S903) input 8HOMEIHome position detection switch (S901) input (“L” : Home position) 9VDDPower supply pin (+5 V) 10X2Main system clock connecting pin (14 MHz) 11X1Main system clock connecting pin (14 MHz) 12VSSGND 13XT2Sub system clock connecting pin (32.768 kHz) 14XT1Sub system clock connecting pin (32.768 kHz) 15RESETSystem reset input 16BU INIBackup OFF detection input (“L” : Backup OFF) 17BUS ONIBUS OFF detection of SONY BUS. (“H” : BUS OFF) 18SQ SYISub code Q sync input from CXD2652AR (IC200). 19STR SWISTOP switch (S600) input 20ONot used. 21CC XINTIInterruption status input from CXD2652AR (IC200). 22ONot used. 23AVDDPower supply for A/D converter. (+5 V) 24AVREF0Reference voltage for A/D converter. 25INITIInitial input pin at reset. 26TEMPIThermistor connecting pin for temperature detection. 27EHSIElevator height position detection input 28, 29IConnect to GND. 30 32OConnect to GND. 33AVSSAnalog GND 34ERR PWMOError data output (Not used in this set.) 35ONot used. 36AVREF1Reference voltage for D/A converter. 37, 38ONot used. 39Not used. 40MD SIIRead data signal input from CXD2652AR (IC200). 41MD SOOWrite data signal output to CXA2523AR (IC100) and CXD2652AR (IC200). 42MD CKOOSerial clock signal output to CXA2523AR (IC100) and CXD2652AR (IC200). 43ONot used. 44Not used. 45UNISIISerial data input for SONY BUS. 46UNISOOSerial data output for SONY BUS. 47UNI CKIISerial clock input for SONY BUS. 48LINKOFFOLink control signal output for SONY BUS. (“H” : Link OFF) 49ONot used. 50INot used. 51, 52D-BASS1, 2ODigital D-BASS select output 1, 2 (Not used in this set.) 53 55ONot used. 56 59MNT0 3OMonitor 0 3 signal input from CXD2652AR (IC200). 60AGINGONot used. 61AGCHKONot used. 62TFTONONot used. 13 Pin No.Pin NameI/OPin Description 63ONot used. 64EE CSOChip