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    Yamaha DTX-Multi 12 Percussion Pad Service Manual 电路图.pdf

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    Yamaha DTX-Multi 12 Percussion Pad Service Manual 电路图.pdf

    SERVICE MANUAL HAMAMATSU, JAPAN SERVICE MANUAL DTX-MULTI12 20091125-94500 MAT1 20091125-5250 ED011962 Copyright (c) Yamaha Corporation. All rights reserved. PDF monaural x 4) Tone generatorMaximum polyphony64 notes Wave memory Voices 100 MB (16-bit linear conversion) Drum and percussion: 1,061 Keyboard: 216 Drum kits Preset: 50 User-defi ned: 200 EffectsVariation x 42 types; Chorus x 6 types; Reverb x 6 types: 5-band master equalizer Trigger section Pad functions Increment or decrement of drum kit, pattern, or tempo; tap tempo; switching on or off of click-track; transmission of control change messages WavesReadable quantity500 Bit depth16 bit Wave memory64 MB Maximum size Mono sample: 2 MB Stereo sample: 4 MB Sample formatsProprietary, WAV, and AIFF SequencerSequence capacity152,000 notes Note resolutionQuarter note / 480 Recording methodReal-time overdubbing Patterns Preset patterns: 128 phrases (including 3 demo patterns) User-defi ned patterns: 50 phrases Sequence formats Proprietary SMF Format 0 (for loading only) Click-trackTempo30 to 300 BPM. Tap tempo functionality Beats1/4 16/4, 1/8 16/8, 1/16 16/16 Note timingAccent notes, quarter notes, eight notes, sixteenth notes, triplets OtherDisplayBacklit LCD with 2 rows of 16 characters Connectors PADM jack (standard stereo-phone plug; left = trigger, right = rim switch) PADN/O and PAD P/Q jacks (standard stereo-phone plug; left = trigger, right = trigger) HI-HAT CONTROL jack (standard stereo-phone plug) FOOT SW jack (standard stereo-phone plug) OUTPUT L/MONO and R jacks (standard phone plugs) PHONES jack (standard stereo-phone plug), AUX IN jack (standard stereo-phone plug), MIDI IN and OUT connectors, USB TO HOST port, USB TO DEVICE port, and DC IN. Power Consumption 9W (DTXM12 and PA-5D adaptor) 6W (DTXM12 and PA-150 adaptor) Size and weight345 (w) x 319 (d) x 96 (h) mm; 3.3 kg Package Contents Power adaptor (PA-5D/PA-150 or an equivalent recommended by Yamaha), Owners Manual (this booklet), Data List booklet, DVD-ROM RadioFans.CN 收音机爱 好者资料库 DTX-MULTI 12 4 部数12 外部入力5 (3対応1, 4) 音源部最大同時発音数64音 波形 数 100MB相当(16bit換算) /:1,061音色 :216音色 数:50 :200 42、6、6、 EQ(5) 部INC/DEC、INC/DEC、INC/DEC、ON/ OFF、送信 読込可能数500 16bit 波形64MB 最大1:2MB 1:4MB 、WAV、AIFF 容量約152,000音 音符分解能4分音符/480 方式 数128曲(3曲) :50曲 SMF0 () 30300/分、機能 1/4 16/4、1/8 16/8、1/16 16/16 、4分音符、8分音符、16分音符、3連符 他16文字 x 2行 付LCD 接続端子入力 M (標準端子 L:、R:) 入力 N/O、P/Q (標準端子 L:、R:) HI-HAT CONTROL (標準端子) OUTPUT L/MONO、R (標準端子) FOOT SW (標準端子)、PHONES (標準端子)、 AUX IN (標準端子) MIDI IN/OUT、USB (TO HOST、TO DEVICE)、DC IN 消費電力PA-5D使用時:9W (DTXM12電源 ) PA-150使用時:6W (DTXM12電源 ) 寸法、重量345(W)319(D)96(H)mm 、3.3kg 付属品電源(PA-5D/PA-150同等推奨品)、保証書、取扱説明書(本書)、 、DVD-ROM1枚 総合仕様 5 DTX-MULTI 12 PANEL LAYOUT() Front Panel() q VOLUME dial w Display e Pad Indicator r MIDI button t VOICE button y KIT button u PTN button i WAVE button o UTILITY button !0 SHIFT button !1 button !2 EXIT button !3 ENTER button !4 STORE button !5 button !6 -/DEC button !7 +/INC button !8 USB TO DEVICE port !9 USB TO HOST port 0 Standby/On switch 1 Cord clip 2 DC IN terminal 3 MIDI IN/OUT connectors 4 FOOT SW jack 5 HI-HAT CONTROL jack 6 PAD jacks (!3 to !7) 7 AUX IN jack 8 GAIN knob 9 OUTPUT L/MONO and R jacks #0 PHONES jack #1 VOLUME knob YAMAHA < e!5 o!0!4!6!7iuy r!1!2!3tqw !8!9 Side Panel() 39640578#0#112 Rear Panel() q VOLUME () w LCD 画面 e LED r MIDI t VOICE y KIT u PTN i WAVE o UTILITY !0 SHIFT !1 () !2 EXIT !3 ENTER !4 STORE !5 、 () !6 /DEC !7 +/INC !8 USB TO DEVICE 端子 !9 USB TO HOST 端子 0 ( / ) 1 2 DC IN 端子 3 MIDI IN/OUT 端子 4 FOOT SW 端子 5 HH CTRL () 端子 6 入力端子 (!3 !7) 7 AUX IN 端子 8 GAIN 9 OUTPUT L/MONO、R 端子 #0 PHONES 端子 #1 VOLUME () DTX-MULTI 12 6 CIRCUIT BOARD LAYOUT() PAD UNIT R (R) PAD UNIT F (F) FRONT CASE ASSEMBLY (Ass y) JK DM 7 DTX-MULTI 12 FRONT CASE ASSEMBLY (Ass y) (R (F) ) PAD UNIT R (F) (組立品) PAD ASSEMBLY LCD MODULE (LCD) PAD ASSEMBLY (組立品) PAD SHEET SWITCH (SW) SENSOR UNIT ST (ST) SENSOR UNIT ST (ST) SENSOR UNIT CT (CT) PN VR DTX-MULTI 12 8 JK DM VR PN LCD MODULE (LCD) CN601 (8P) CN304 (8P) CN302 (17P) CN303 (37P) CN312 (21P)CN308 (2P) CN305 (2P) CN309 (2P) CN306 (2P) CN310 (2P) CN307 (2P) CN301 (10P) to PAD SHEET SWITCH (Rear side) to PAD SHEET SWITCH (Front side) to SENSOR UNIT ST (PAD4) to SENSOR UNIT ST (PAD1) to SENSOR UNIT ST (PAD6) to SENSOR UNIT ST (PAD3) to SENSOR UNIT CT (PAD2) to SENSOR UNIT CT (PAD5) CN311 (21P) CN6 (17P) CN8 (37P) CN4 (16P) CN7 (10P) CN5 (26P) CN501 (26P) WIRING(結線図) 9 DTX-MULTI 12 DISASSEMBLY PROCEDURE(分解手順) 1. PAD UNIT R (Time required: About 1 minutes) 1-1 Remove the four (4) screws marked 150A and three (3) screws marked 160A. The pad unit R can then be removed. (Fig.1, Fig.2) Photo 1(写真 1) Precautions(注意事項) * Notes on Flat Cable Contacts are visible from the back. Pay attention not to insert and install the cable to the connector inversely. (Photo 1) Front Side(表面)Back Side(裏面) 注意 接点裏面透見。表 裏逆差込注意取付。 (写真 1) 1. R(所要時間 : 約 1 分) 1-1 150A 4 本 160A 3 本外、 R 外。 (図 1、図 2) 150A150A 150B150B 150: BIND HEAD TAPPING SCREW-S (SBIND) 3.0X6 MFZN2B3 (WE87780R) Fig.1 (図1) 160A 160B160B 160A 160C PAD UNIT R ( R) PAD UNIT F ( F) KNOB V (V) 160A 160C 160: BIND HEAD SCREW (小BIND) 3.0X6 MFZN2B3 (WE878300) Fig.2 (図2) DTX-MULTI 12 10 2. PAD UNIT F (Time required: About 3 minutes) 2-1 Remove the pad unit R. (See procedure 1.) 2-2 Remove the four (4) screws marked 150B and six (6) screws marked 160B. The pad unit F can then be removed. (Fig.1, Fig.2) 3. JK Circuit Board (Time required: About 5 minutes) 3-1 Remove the pad unit R. (See procedure 1.) 3-2 Remove the pad unit F. (See procedure 2.) 3-3 Remove the fi ve (5) screws marked 130A and screw marked 170. The JK sheet assembly can then be removed. (Fig.3) * Pay attention not to lose DC cord column when removing the screw marked 170. (Fig. 3) 3-4 Remove the screw marked JK60. The DC angle can then be removed. (Fig.4) 2. F(所要時間 : 約 3 分) 2-1 R 外。 (1 項参照) 2-2 150B 4 本 160B 6 本外、 F 外。 (図 1、図 2) 3. JK (所要時間 : 約 5 分) 3-1 R 外。 (1 項参照) 3-2 F 外。 (2 項参照) 3-3 130A 5 本 170 1 本外、 JK Ass y 外。 (図 3) 170 外際、DC 紛失 注意。 (図 3) 3-4 JK60 1 本外、DC 外 。 (図 4) 130A130A 130B130B 130C 170 DC CORD COLUMN (DC) JK SHEET ASSEMBLY (JKAss y) FRONT CASE ASSEMBLY (Ass y) EARTH PLATE (金具) DM 130: BIND HEAD TAPPING SCREW-B (BBIND) 3.0X8 MFZN2W3 (WE774301) 170: BIND HEAD TAPPING SCREW-B (BBIND) 3.0X12 MFZN2B3 (WE99810R) Fig.3 (図3) 11 DTX-MULTI 12 3-5 Remove the two (2) screws marked JK40 and fi ve (5) angle brackets, U and separate the JK circuit board and shield JK. (Fig. 4) 3-6 Remove the push button from the JK circuit board. (Fig. 4) * The push button is not part of the JK circuit board. When replacing the JK circuit board, remove the push button from the circuit board and install it on the new circuit board. (Fig. 4) 4. Front Case Assembly (Time required: About 4 minutes) 4-1 Remove the pad unit R. (See procedure 1.) 4-2 Remove the pad unit F. (See procedure 2.) 4-3 Remove the three (3) screws marked 130B and four (4) screws marked 160C. The front case assembly can then be removed. (Fig.2, Fig.3) 5. DM Circuit Board (Time required: About 5 minutes) 5-1 Remove the pad unit R. (See procedure 1.) 5-2 Remove the pad unit F. (See procedure 2.) 5-3 Remove the front case assembly. (See procedure 4.) 5-4 Remove the four (4) screws marked 130C and remove the DM circuit board with the shield DM. * Pay attention not to lose earth plate when removing the screws marked 130C. 5-5 Remove the four (4) screws marked 140 and separate the DM circuit board and shield DM. (Fig. 5) 3-5 JK402本U字金具5個外、 JK JK 分離。 (図 4) 3-6 JK 外。 (図 4) JK 構成部品。 JK 交換際、 本体 取外、新取付 。 (図 4) 4. Ass y(所要時間 : 約 4 分) 4-1 R 外。 (1 項参照) 4-2 F 外。 (2 項参照) 4-3 130B 3 本 160C 4 本外、 Ass y 外。 (図 2、図 3) 5. DM (所要時間 : 約 5 分) 5-1 R 外。 (1 項参照) 5-2 F 外。 (2 項参照) 5-3 Ass y 外。 (4 項参照) 5-4 130C 4 本外、 DM 付 状態 DM 外。 (図 3) 130C 外際、金具紛失 注意。 (図 3) 5-5 140 4 本外、DM DM 分離。 (図 5) 140: BIND HEAD TAPPING SCREW-S (SBIND) 3.0X6 MFZN2W3 (WE877900) Fig.5 (図5) DM 140 SHIELD DM (DM) JK SHEET ASSEMBLY(JKAss y) JK40 JK60 ANGLE BRACKET, U (U字金具) PUSH BUTTON () SHIELD JK (JK) DC ANGLE (DC) JK JK40: BIND HEAD TAPPING SCREW-B (BBIND) 3.0X12 MFZN2W3 (WE98740R) JK60: BIND HEAD TAPPING SCREW-S (SBIND) 3.0X6 MFZN2W3 (WE877900) Fig.4 (図4) DTX-MULTI 12 12 6. PN Circuit Board, LCD Module, VR Circuit Board 6-1 Remove the pad unit R. (See procedure 1.) 6-2 Remove the pad unit F. (See procedure 2.) 6-3 Remove the front case assembly. (See procedure 4.) 6-4 PN Circuit Board (Time required: About 5 minutes each) 6-4-1 Remove the three (3) screws marked 80A. The shield PN can then be removed. (Fig. 6) 6-4-2 Remove the three (3) screws marked 80B. The PN circuit board can then be removed. (Fig. 6) * Tighten the screws in the order of a, b and c in Fig. 6 when installing the PN circuit board to front case. (Fig. 6) 6-5 LCD Module (Time required: About 5 minutes each) 6-5-1 Remove the four (4) screws marked 90. The LCD module can then be removed. (Fig. 6) 6-6 VR Circuit Board (Time required: About 4 minutes each) 6-6-1 Remove the knob V. (Fig. 2, Fig. 7) 6-6-2 Remove the screw marked 80C. The VR circuit board can then be removed. (Fig. 6) 6. PN 、LCD 、VR 6-1 R 外。 (1 項参照) 6-2 F 外。 (2 項参照) 6-3 Ass y 外。 (4 項参照) 6-4 PN (所要時間 : 約 5 分) 6-4-1 80A 3 本外、 PN 外 。 (図 6) 6-4-2 80B 3 本外、 PN 外。 (図 6) PN 取付際、 図 6 a, b, c 順締。 (図 6) 6-5 LCD (所要時間 : 約 5 分) 6-5-1 90 4 本外、LCD 外 。 (図 6) 6-6 VR (所要時間 : 約 4 分) 6-6-1 V 外。 (図 2、図 7) 6-6-2 80C 1 本外、 VR 外。 (図 6) FRONT CASE ASSEMBLY(Ass y) 80A 80B a b c 90 80C SHIELD PN (PN) LCD MODULE (LCD) PN VR 80: BIND HEAD TAPPING SCREW-B (BBIND) 3.0X8 MFZN2W3 (WE774301) 90: BIND HEAD TAPPING SCREW-B (BBIND) 2.6X10 MFZN2W3 (WF741100) Fig.6 (図6) KNOB (V) Fig.7 (図7) 13 DTX-MULTI 12 7. Sensor Unit CT, Sensor Unit ST, Pad Sheet Switch (Time required: About 2 minutes each) * The following describes procedures for pad unit R side. Removal on pad unit F side can be conducted in the same way. 7-1 Remove the pad unit R. (See procedure 1.) 7-2 Remove the ten (10) screws marked 50. The pad support plate R can then be removed. (Fig. 8) 7-3 Sensor Unit CT, Sensor Unit ST 7-3-1 Remove the sensor unit CT or sensor unit ST. (Fig. 9) 7-4 Pad Sheet Switch 7-4-1 Remove the rubber pad. (Fig. 9, Photo 2) 7-4-2 Remove the pins at six (6) positions to remove the pad sheet switch. (Photo 3) 7. CT、 ST、 SW(所要時間 : 各約 2 分) 、 R 側手順記載。 F 側同様外。 7-1 R 外。 (1 項参照) 7-2 50 10 本外、支板 R 外 。 (図 8) 7-3 CT、 ST 7-3-1 CT ST 外。 (図 9) 7-4 SW 7-4-1 外。 (図 9、写真 2) 7-4-2 6 個所外、 SW 外。 (写真 3) PAD UNIT R(R) 50 50505050 50 PAD SUPPORT PLATE R (支板R) PAD ASSEMBLY (組立品) 50: PW HEAD TAPPING SCREW-P (PPWH) 3.0X10-10 MFZN2W3 (WF76550R) Fig.8 (図8) PAD ASSEMBLY(組立品) SENSOR UNIT ST (ST) SENSOR UNIT ST (ST) RUBBER PAD () SENSOR UNIT CT (CT) Fig.9 (図9) Photo 2 (写真2) RUBBER PAD () PAD SHEET SWITCH (SW) Pin () Pin () Pin () Photo 3 (写真3) DTX-MULTI 12 14 LSI PIN DESCRIPTION(LSI 端子機能表) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 VSS AN2 AN1 VSS RxD1 SCK1 UCLK VSS FUNC_DM VSS HOST_DM POWER_ENB XTAL EXTAL VSS CS7N/PJ6 TRSTN TDI TCK VCCQ MD15 VSS AN3 AN0 VSS TxD1 TxD0 VSS FUNC_DP VSS HOST_DP SCL VSS VSS CS4N/PJ3 TIOC0A/PJ7 TESTN TMS VCCQ VCCQ MD13 MD14 VSS VREFADC VSSADC VSS RxD0 VSS VBUS VSS OVER_CURRENT_N SDA CS0N CS2N/PJ1 CS5N/PJ4 ASEMDN TDO VCCQ VDDPLL VDDPLL MD10 MD11 MD12 VSS VCCADC VSS RESN VCCQ PULLUP_ENB VCCQ UCTL EICN CS1N/PJ0 CS3N/PJ2 CS6N/PJ5 ASEBRKAKN VCCQ VCCQ VSSPLL - I I - I I I - I/O - I/O O O I - O I I I - I/O - I I - O O - I/O - I/O I/O - - O O I I - - I/O I/O - - - - I - I - I I/O O O O I O - - - I/O I/O I/O - - - I - O - I O O O O I/O - - - Ground ADC analog input 2 ADC analog input 1 Ground Serial input 1 External sync. clock input 1 USB external clock input (48 MHz) Ground USB function data - Ground USB host data - USB voltage enable Crystal oscillator output Crystal oscillator input (16.9344 MHz) Ground SH2A-CPU chip select 7 JTAG test reset input JTAG test data input JTAG test clock input Power supply +3.3 V Wave memory data bus 15 Ground ADC analog input 3 ADC analog input 0 Ground Serial output 1 Serial output 0 Ground USB function data + Ground USB host data + E bus (I2C) clock input/output (5V compatible) Ground SH2A-CPU chip select 4 PWM output Test input JTAG test mode select input Power supply +3.3 V Wave memory data bus 13 Wave memory data bus 14 Ground ADC reference power supply +3.3 V ADC analog ground Ground Serial input 0 Ground USB cable connection monitor (5V compatible) Ground USB overcurrent detection (5V compatible) E bus (I2C) data input/output (5V compatible) SH2A-CPU chip select 0 SH2A-CPU chip select 2 SH2A-CPU chip select 5 Debug mode configuration JTAG test data output Power supply +3.3 V PLL analog power supply +1.2 V Wave memory data bus 10 Wave memory data bus 11 Wave memory data bus 12 Ground ADC analog power supply +3.3 V Ground Hardware reset Power supply +3.3 V USB pull-up enable Power supply +3.3 V USB output control E bus reset output SH2A-CPU chip select 1 SH2A-CPU chip select 3 SH2A-CPU chip select 6 Emulator break Power supply +3.3 V PLL analog ground 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 D20 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E20 F1 F2 F3 F4 F5 F16 F17 F18 F19 F20 G1 G2 G3 G4 G5 G16 G17 G18 G19 G20 H1 H2 H3 H4 H5 H16 H17 H18 H19 H20 J1 J2 J3 J4 J5 J9 J10 J11 J12 J16 J17 J18 J19 J20 K1 K2 K3 K4 K5 K9 K10 K11 K12 K16 K17 K18 K19 K20 VSSPLL MD6 MD7 MD8 MD9 VDD VDD VSS VCCQ VSS VCCQ VCCQ VSS VCCQ VSS VDD VDD D31/PF7 D30/PF6 D29/PF5 D28/PF4 MD2 MD3 MD4 MD5 VDD VDD D27/PF3 D26/PF2 D25/PF1 D24/PF0 MA2 MA1 MD0 MD1 VSS VSS D23/PE7 D22/PE6 D21/PE5 D20/PE4 MA6 MA5 MA4 MA3 VCCQ VCCQ D19/PE3 D18/PE2 VCCQ VCCQ MA10 MA9 MA8 MA7 VSS VSS VSS VSS VSS VSS D17/PE1 D16/PE0 CKOEN CKIO MA14 MA13 MA12 MA11 VDD VSS VSS VSS VSS VDD CKE D15 VSS VSS - I/O I/O I/O I/O - - - - - - - - - - - - I/O I/O I/O I/O I/O I/O I/O I/O - - I/O I/O I/O I/O O O I/O I/O - - I/O I/O I/O I/O O O O O - - I/O I/O - - O O O O - - - - - - I/O I/O I O O O O O - - - - - - O I/O - - PLL analog ground Wave memory data bus 6 Wave memory data bus 7 Wave memory data bus 8 Wave memory data bus 9 Power supply +1.2 V Ground Power supply +3.3 V Ground Power supply +3.3 V Ground Power supply +3.3 V Groun

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