Philips-DMREH-57-Service-Manual电路原理图.pdf

© 2007 Matsushita Electric Industrial Co., Ltd. Allrights reserved. Unauthorized copying anddistribution is a violation of law.Vol. 1Colour(S).Silver Type(K).Black TypeDVD RecorderORDER NO.CHM0705024CEModel No.1 Safety Precaution 31.1. General guidelines 32 Warning 42.1. Prevention of Electrostatic Discharge (ESD) toElectrostatic Sensitive (ES) Devices 42.2. Precaution of Laser Diode 52.3. Service caution based on legal restrictions 63 Service Navigation 73.1. Service Information 73.2. Caution for DivX 74 Specifications 85 Location of Controls and Components 106 Operation Instructions 126.1. Taking out the Disc from DVD-Drive Unit when the Disccannot be ejected by OPEN/CLOSE button 127 Service Mode 157.1. Self-Diagnosis and Special Mode Setting 158 Service Fixture & Tools 279 Disassembly and Assembly Instructions 289.1. Disassembly Flow Chart 289.2. P.C.B. Positions 299.3. Top Case 309.4. Front Panel 309.5. HDD, ATAPI P.C.B. 319.6. RAM/Digital P.C.B. Module 339.7. DV Jack P.C.B. 349.8. Rear Panel 349.9. Power P.C.B. 359.10. HDMI P.C.B. 359.11. Main P.C.B., Front Jack P.C.B. and Front (L) P.C.B. 3610 Measurements and Adjustments 3710.1. Service Positions 3710.2. Caution for Replacing Parts 4110.3. Standard Inspection Specifications after Making Repairs 4311 Block Diagram 4511.1. Power Supply Block Diagram 4511.2. Analog Video Block Diagram 4711.3. Analog Audio Block Diagram 4811.4. Analog Timer Block Diagram 4911.5. HDMI Block Diagram 5012 Schematic Diagram 5112.1. Interconnection Schematic Diagram 5112.2. Power Supply Schematic Diagram 5212.3. Main Net (1/4) Section (Main P.C.B. (1/4) SchematicDiagram (M) 5312.4. Main Net (2/4) Section (Main P.C.B. (1/4) SchematicDiagram (M) 5412.5. Main Net (3/4) Section (Main P.C.B. (1/4) SchematicDiagram (M) 5512.6. Main Net (4/4) Section (Main P.C.B. (1/4) SchematicDiagram (M) 5612.7. AV I/O (1/4) Section (Main P.C.B. (2/4) SchematicDiagram (AV) 5812.8. AV I/O (2/4) Section (Main P.C.B. (2/4) SchematicDiagram (AV) 5912.9. AV I/O (3/4) Section (Main P.C.B. (2/4) SchematicDiagram (AV) 6012.10. AV I/O (4/4) Section (Main P.C.B. (2/4) SchematicDiagram (AV) 6112.11. Tuner Section (Main P.C.B. (3/4) Schematic Diagram(TU) 6312.12. Timer (1/4) Section (Main P.C.B. (4/4) SchematicDiagram (T) 6412.13. Timer (2/4) Section (Main P.C.B. (4/4) SchematicDiagram (T) 6512.14. Timer (3/4) Section (Main P.C.B. (4/4) SchematicDiagram (T) 6612.15. Timer (4/4) Section (Main P.C.B. (4/4) SchematicDiagram (T) 6712.16. HDMI Schematic Diagram 6812.17. DV Jack Schematic Diagram 6912.18. Front Jack Schematic Diagram 6912.19. Front (L) Schematic Diagram 6912.20. ATAPI Schematic Diagram 6913 Printed Circuit Board 7113.1. Power P.C.B. and DV Jack P.C.B. 7113.2. Main P.C.B. 7213.3. HDMI P.C.B. 7713.4. Front Jack P.C.B. and Front (L) P.C.B. 7813.5. ATAPI P.C.B. 7914 Appendix for Schematic Diagram 8114.1. Voltage and Waveform Chart 8115 Parts and Exploded Views 8815.1. Exploded Views 8815.2. Replacement Parts List 90CONTENTSPage Page2DMR-EH57GN1.1.1. Leakage current cold check1. Unplug the AC cord and connect a jumper between the twoprongs on the plug.2. Measure the resistance value, with an ohmmeter, betweenthe jumpered AC plug and each exposed metallic cabinetpart on the equipment such as screwheads, connectors,control shafts, etc. When the exposed metallic part has areturn path to the chassis, the reading should be between1Mg87 and 5.2Mg87.When the exposed metal does not have a return path to thechassis, the reading must be .1.1.2. Leakage current hot check(See Figure 1 .)1. Plug the AC cord directly into the AC outlet. Do not use anisolation transformer for this check.2. Connect a 1.5kg87, 10 watts resistor, in parallel with a 0.15µFcapacitors, between each exposed metallic part on the setand a good earth ground such as a water pipe, as shown inFigure 1.3. Use an AC voltmeter, with 1000 ohms/volt or moresensitivity, to measure the potential across the resistor.4. Check each exposed metallic part, and measure thevoltage at each point.5. Reverse the AC plug in the AC outlet and repeat each of theabove measurements.6. The potential at any point should not exceed 0.75 voltsRMS. A leakage current tester (Simpson Model 229 orequivalent) may be used to make the hot checks, leakagecurrent must not exceed 1/2 milliampere. In case ameasurement is outside of the limits specified, there is apossibility of a shock hazard, and the equipment should berepaired and rechecked before it is returned to thecustomer.Figure 11 Safety Precaution1.1. General guidelines1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated ordamaged by the short circuit.2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properlyinstalled.3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.3DMR-EH57GN2 Warning2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive(ES) DevicesSome semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are calledElectrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sandsemiconductor “chip“ components. The following techniques should be used to help reduce the incidence of component damagecaused by electrostatic discharge (ESD).1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on yourbody by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,which should be removed for potential shock reasons prior to applying power to the unit under test.2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)“ cangenerate electrical charge sufficient to damage ES devices.5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparableconductive material).7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will be installed.CautionBe sure no power is applied to the chassis or circuit, and observe all other safety precautions.8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as thebrushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficientto damage an ES device).4DMR-EH57GN2.2. Precaution of Laser Diode5DMR-EH57GN2.3. Service caution based on legal restrictions2.3.1. General description about Lead Free Solder (PbF)The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for thisequipment in considering the globally environmental conservation.The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than thatof the normal solder.Definition of PCB Lead Free Solder being usedThe letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.(See right figure)Service caution for repair work using Lead Free Solder (PbF)g32g32g32g32g183g32g183g32The lead free solder has to be used when repairing the equipment for which the lead free solder is used.(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)g32g32g32g32g183g32g183g32To put lead free solder, it should be well molten and mixed with the original lead free solder.g32g32g32g32g183g32g183g32Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.g32g32g32g32g183g32g183g32Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to meltthe lead free solder.g32g32g32g32g183g32g183g32Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30degrees C (662±86°F).Recommended Lead Free Solder (Service Parts Route.)g32g32g32g32g183g32g183g32The following 3 types of lead free solder are available through the service parts route.RFKZ03D01K-(0.3mm 100g Reel)RFKZ06D01K-(0.6mm 100g Reel)RFKZ10D01K-(1.0mm 100g Reel)Note* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%6DMR-EH57GN3 Service Navigation3.1. Service Information3.2. Caution for DivX7DMR-EH57GN4 Specifications8DMR-EH57GN9DMR-EH57GN5 Location of Controls and Components10DMR-EH57GN