Philips-DVDR-600-VR-Service-Manual电路原理图.pdf

DVD Recorder when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Caution:1. The Flat Pack-IC shape may differ by models. Usean appropriate hot-air flat pack-IC desolderingmachine, whose shape matches that of the FlatPack-IC.2. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damage tothe chip parts may occur. Put masking tape aroundthe flat pack-IC to protect other parts from damage.(Fig. S-1-2)Top ViewOut InBottom ViewInput510Pin 1Pin 1FFC CableConnectorCBA* Be careful to avoid a short circuit.Fig. S-1-11-3-2 E6STA3. The flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC when removingit.With Soldering Iron:(1) Using desoldering braid, remove the solder from allpins of the flat pack-IC. When you use solder fluxwhich is applied to all pins of the flat pack-IC, youcan remove it easily. (Fig. S-1-3)(2) Lift each lead of the flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)(3) Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)(4) Release the flat pack-IC from the CBA using twee-zers. (Fig. S-1-6)Fig. S-1-2Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-3Flat Pack-ICDesoldering BraidSoldering IronFig. S-1-4Fine TipSoldering IronSharpPin