Philips-DVDR-3575-H-Service-Manual电路原理图.pdf

DVDR3575H/05/31/58 DVDR3577H/05/31/51/58 DVDR3595H/05/31/51/58 DVDR3597H/05/31/58 Service Package Version 1.1 The table below gives the summary of all the files in the service package. Please refer to this document for the required information. Chapter No. Reference Document & Instructions Chapter 1 Technical Specifications and Connection Facilities Chapter 2 Safety Information, General notes & Lead-free Requirements Chapter 3 Directions for Use / QUG Direction for use is available at website: www.p4c.philips.com(EPG /31) (Non EPG/05/51/58) Chapter 4 Mechanical Instructions Chapter 5 Firmware Upgrading, Alignment and Test Procedures Diagnostic Software (Diagnostic Software) Chapter 6 Block Diagram & Wiring Diagram Chapter 7 Electrical Circuits & Layout Drawings, Test Point View, Waveforms 1. Front Panel: 2. Analog Board 3. Digital Board 4. HDMI Board Chapter 8 Exploded View and Service Parts List Chapter 9 Revision List 1. Technical Specifications and Connection Facilities 1.1. PCB Locations Digital Board Front Board Standby BoardHDD Basic Engine Analog Board HDMI Board PSU Board 1.2. General Mains voltage: 220V-240V Mains frequency: 50 Hz Power consumption: 35 W Standby Power consumption: 4.5V / 9.5V / 1V / 10k CAM 1 VIDEO - Cinch Input voltage: 1Vpp ± 3dB Input impedance: 75 1.4.4. VIDEO OUT Connectors CVBS OUT Cinch Output Voltage: 1Vpp ± 3dB Output impedance: 75 S-VIDEO OUT - Hosiden According to IEC 933-5 Output Voltage Y: 1Vpp ± 3dB Output Impedance Y: 75 Output Voltage C: 300mVpp ± 3dB Output Impedance C: 75 1.4.5. AUDIO OUT AUDIO Cinch (L/R) Output voltage: 2Vrms ± 2dB Output impedance: 110 dB Crosstalk 16Hz-20kHz: > 110 dB Frequency response: |0.2| dB Signal to noise ratio (unweighted): > 110 dB Signal to noise ratio (A-weighted): > 112 dBA Dynamic range 1kHz: > 92 dB Distortion and noise 1kHz: > 85 dB Distortion and noise 16Hz-20kHz: > 85dB Intermodulation distortion: -94 dB (pcm) Intermodulation distortion: -77 dB (lpcm) 1.7.2. Scart Audio Output voltage: 2Vrms ± 1dB Channel unbalance (1kHz): 100 dB Crosstalk 16Hz-20kHz: > 78 dB Frequency response: |0.2| dB Signal to noise ratio (unweighted): > 100 dB Signal to noise ratio (Aweighted): > 100 dB Dynamic range 1kHz: > 83 dB Distortion and noise 1kHz: > 83 dB Distortion and noise 16Hz-20kHz: > 75 dB Intermodulation distortion: -65 dB (pcm) Intermodulation distortion: -77 dB (lpcm) 1.8. Dimension and Weight Set Dimension W x H x D: 435 x 43 x 324 mm Net Weight: 3.8 kg 1.9. Laser Output Power & Wavelength 1.9.1. DVD Output power during reading: 1.0 m W Output power during writing: 69 m W Wavelength: 658 nm (at 25 °C) 1.9.2. CD Output power: 1.2 m W Wavelength: 783 nm (at 25 °C) 1.10. Playability Video Playback1 Playback Media: CD-R/CD-RW, DVD+R/+RW, DVD-R/-RW, DVD-Video, Video CD/SVCD, DVD+R DL, DVD-R DL, USB flash drive x 2 Compression formats: MPEG2, MPEG1, DivX 3.11, DivX 4.x, DivX 5.x, DivX 6.0, DivX Ultra, MPEG4 x Audio Playback1 Playback Media: Audio CD, CD-R/RW, DVD+R DL, DVD+R/+RW, DVD-R/-RW, MP3-CD, MP3-DVD, USB flash drive, WMA-CD x 2 Compression format: Dolby Digital, MP3, MPEG2 Multichannel, PCM, WMA x 3 MPEG1 bit rates: 64-384 kbps and VBR x Still Picture Playback1 Playback Media: CD-R/RW, DVD+R DL, DVD+R/+RW, DVD-R/-RW, Picture CD, USB Digital Camera (PTP), USB flash drive x 2 Picture compression format: JPEG, JPEG digital camera photos x 3 Picture enhancement: Slideshow with MP3 playback, Create albums, Rotate, Slideshow with music playback, Zoom x 1.11. Supported Disc Types and Media Speed for Recording Disc Media speeds DVD+R 1x - 16x DVD+RW 2.4x - 8x DVD-R 1x - 16x DVD-RW 2.4x - 4x DVD+R DL 2.4x 1.12. Diversity Matrix DVDR3575H EU DVDR3577H EU DVDR3595H EU DVDR3597H EU Hard Disk capacity 160 GB 160 GB 250GB 250GB Colour Titanium Black Sliver Sliver Pure Black 2.1 Safety Instructions2.1.1 General SafetySafety regulations require that during a repair: Connect the unit to the mains via an isolation transformer. Replace safety components, indicated by the symbol ,only by components identical to the original ones. Anyother component substitution (other than original type) may increase risk of re or electrical shock hazard.Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention tothe following points: Route the wires/cables correctly, and x them with themounted cable clamps. Check the insulation of the mains lead for externaldamage. Check the electrical DC resistance between the mains plug and the secondary side:1. Unplug the mains cord, and connect a wire betweenthe two pins of the mains plug.2. Set the mains switch to the on position (keep themains cord unplugged!).3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.4. Repair or correct unit when the resistancemeasurement is less than 1 M.5. Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492).6. Switch the unit off, and remove the wire between the two pins of the mains plug.2.1.2 Laser SafetyThis unit employs a laser. Only qualied service personnel may remove the cover, or attempt to service this device (due to possible eye injury).Laser Device UnitType : Semiconductor laser GaAlAsWavelength : 650 nm (DVD): 780 nm (VCD/CD)Output Power : 20 mW(DVD+RW writing): 0.8 mW(DVD reading): 0.3 mW(VCD/CD reading)Beam divergence : 60 degreeCLASS 1LASER PRODUCTFigure 2-1Note: Use of controls or adjustments or performance of procedure other than those specied herein, may result in hazardous radiation exposure. Avoid direct exposure to beam.2.2 Warnings2.2.1 General All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD, ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential.Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. Wristband tester 4822 344 13999. Be careful during measurements in the live voltage section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is off!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A lightning stroke and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. Never replace modules, or components, while the unit is on.2.2.2 Laser The use of optical instruments with this product, will increase eye hazard. Only qualied service personnel may remove the cover or attempt to service this device, due to possible eye injury. Repair handling should take place as much as possible with a disc loaded inside the player. Text below is placed inside the unit, on the laser cover shield:Figure 2-22. Safety Information, General Notes & Lead Free RequirementsCAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAMADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLINGADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLENVARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLENVARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEENVORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAMATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU2.3 Lead Free RequirementInformation about Lead-free produced setsPhilips CE is starting production of lead-free sets from 1.1.2005 onwards. INDENTIFICATION:Regardless of special logo (not always indicated) One must treat all sets from 1 Jan 2005 onwards, according next rules. Example S/N:Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 1991 wk 18So from 0501 onwards = from 1 Jan 2005 onwardsImportant note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pate is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360°C 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and ux-uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature prole of the specic BGA (for de-soldering always use the lead-free temperature prole, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.Philips.com you nd more information to: BGA-de-/soldering (+ baking instructions) Heating-proles of BGAs and other ICs used in Philips-setsYou will nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpdesk.