Philips-DVDR-9000-H-Service-Manual电路原理图.pdf

Published by KC-TE 0547 AV Systems Printed in the Netherlands Subject to modication EN 3139 785 31681DVDR9000H/10/75/97HDD & DVD RecorderCLASS 1LASER PRODUCTContents Page1 Technical Specications and ConnectionFacilities 22 Safety Information, General Notes & Lead Free Requirements 53 Directions for Use 74 Mechanical Instructions 105 Firmware Upgrading & Diagnostic Software 146 Block Diagrams,Waveforms, Wiring Diagram 131Overall block diagram 131Wiring diagram 132Waveforms of Analog Board 133Waveforms of Digital Board 134Waveforms of HDMI Board 135Test Points Overview for Analog Board 136Test Points Overview for Front Left Board 137Test Points Overview for Front Right Board 138Test Points Overview for Front AV_INPUT Board 139Test Points Overview for Digital Board 140Test Points Overview for HDMI Board 141Test Points Overview for IR Blaster Board 142Contents Page7 Circuit Diagrams and PWB Layout 143Analog Circuit Diagrams 143Analog Layout Diagrams 153PCB Front Circuit Diagrams 155PCB Front Layout Diagrams 158Digital Circuit Diagrams 161Digital Layout Diagrams 172HDMI Circuit Diagrams 174IR Blaster Board Circuit Diagrams 178IR Blaster Board Layout Diagrams 179DTTM Circuit Diagrams 180DTTM Component Diagrams 1868 Alignments & Test Procedures 1899 Circuit and IC description 190Circuit Description 190IC Description 19910 Exploded view & Service parts list 238Exploded View of the set 238Service parts list 23911 Revision List 240©Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.Version 1.1EN 2 3139 785 316811. Technical Specifi cations and Connection Facilities1. Technical Specifi cations and Connection Facilities1.1 PCB Locations1.2 Read / Write SpeedType of Disc (Function) Disc Rotation SpeedRead Speed CD 7X CAV Read Speed DVD 4X CAV Write Speed DVD+R/+RW 2.4X ZCAVWrite Speed DVD-R/-RW 2X 1.3 General:Mains voltage : 200V 240V Mains frequency : 50 HzPower consumption (record) : 51 WStandby Power Consumption : 4.5V / 9.5V / 1V / 10kVideo - CinchInput voltage : 1Vpp ± 3dB Input impedance : 75Video - YC (Hosiden)According to IEC 933-5Superimposed DC-level on pin 4 (load = 100k)3.5V is detected as 16:9 aspect ratioInput voltage Y : 1Vpp ± 3dB Input impedance Y : 75Input voltage C : 300mVpp ± 3dBInput impedance C : 751.5.4 Out 1Component Video Cinch Y/Pb/Praccording EIO-770-I-A, EIA-770-2Audio - CinchOutput voltage : 2.2Vrms max.Output impedance : > 10k1.5.5 Out 2Audio - CinchOutput voltage : 2Vrms max.Output impedance : > 10kVideo - CinchOutput voltage : 1Vpp ± 3dB Output impedance : 75Video - YC (Hosiden)According to IEC 933-5Superimposed DC-level on pin 4 (load > 100k)3.5V is detected as 16:9 aspect ratioOutput voltage Y : 1Vpp ± 3dB Input impedance : 75Output voltage C : 300mVpp ± 3dBInput impedance : 75EN 4 3139 785 316811. Technical Specifi cations and Connection Facilities1.6 Digital Inputs / Outputs 1.6.1 Digital OutputDigital Audio Coaxial / OpticalLCM : according IEC 60958MPEG 1, MPEG 2, AC3 : according IEC 61937DTS : according IEC 61937 + addendum1.6.2 HDMI OutputType A connector (19 pins)1.6.3 Digital Video Input (IEEE 1394)Implementation Standard according:IEEE Std 1394-1995 IEC61883 - Part1IEC61883 - Part 2 SD-DVCR (02-01-1997)Specifi cation of consumer use digital VCRs using 6.3mm magnetic tape dec.1994Mechanical connection according to Annex of IEC 61883-11.6.4 G-Link (for IR-remote transmitting device)Output voltage : 5 ± 0.5V (high level)0.4 ± 0.3V (low level)Output impedance : 1501.7 Video PerformanceAll outputs loaded with 75SNR measurements over full bandwidth without weighting.1.7.1 SCART (RGB)SNR : 55dB on all outputBandwidth : 4.8MHz -3dB1.8 Audio Performance 1.8.1 Cinch Output RearOutput voltage 2 channel mode : 2Vrms ± 2dBChannel unbalance (1kHz) : 100dBCrosstalk 16Hz-20kHz : > 87dBFrequency response 20Hz-20kHz : ± 0.5dBSignal to noise ratio (unweighted) : > 85dBDynamic range 1kHz : > 83dBDistortion and noise 1kHz : > 83dBDistortion and noise 16Hz-20kHz : > 75dBIntermodulation distortion : > 70dBMute : > 95dB1.8.2 Scart AudioOutput voltage 2 channel mode : 1.6Vrms ± 2dBChannel unbalance (1kHz) : 85dBCrosstalk 16Hz-20kHz : > 70dBFrequency response 20Hz-20kHz : ± 0.5dBSignal to noise ratio (unweighted) : > 80dBDynamic range 1kHz : > 75dBDistortion and noise 1kHz : > 75dBDistortion and noise 16Hz-20kHz : > 50dBIntermodulation distortion : > 70dBMute : > 80dB1.9 Dimensions and WeightHeight of feet : 5.5mmApparatus tray closed : WxDxH:435x390x89mmApparatus tray open : WxDxH:435x525x89mmWeight without packaging : approx. 7.1 ± 0.5kgWeight with packaging : approx. 8.5kg1.10 Laser Output Power & Wavelength1.10.1 DVDOutput power during reading : 0.8mWOutput power during writing : 20mWWavelength : 650nm1.10.2 CDOutput power : 0.3mWWavelength : 780nmEN 53139 785 31681 2.Safety Information, General Notes & Lead Free Requirements2.1 Safety Instructions2.1.1 General SafetySafety regulations require that during a repair: Connect the unit to the mains via an isolation transformer. Replace safety components, indicated by the symbol ,only by components identical to the original ones. Anyother component substitution (other than original type) may increase risk of fi re or electrical shock hazard.Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention tothe following points: Route the wires/cables correctly, and fi x them with themounted cable clamps. Check the insulation of the mains lead for externaldamage. Check the electrical DC resistance between the mains plug and the secondary side:1. Unplug the mains cord, and connect a wire betweenthe two pins of the mains plug.2. Set the mains switch to the on position (keep themains cord unplugged!).3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.4. Repair or correct unit when the resistancemeasurement is less than 1 M.5. Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492).6. Switch the unit off, and remove the wire between the two pins of the mains plug.2.1.2 Laser SafetyThis unit employs a laser. Only qualifi ed service personnel may remove the cover, or attempt to service this device (due to possible eye injury).Laser Device UnitType : Semiconductor laser GaAlAsWavelength : 650 nm (DVD): 780 nm (VCD/CD)Output Power : 20 mW(DVD+RW writing): 0.8 mW(DVD reading): 0.3 mW(VCD/CD reading)Beam divergence : 60 degreeCLASS 1LASER PRODUCTFigure 2-1Note: Use of controls or adjustments or performance of procedure other than those specifi ed herein, may result in hazardous radiation exposure. Avoid direct exposure to beam.2.2 Warnings2.2.1 General All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD, ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential.Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. Wristband tester 4822 344 13999. Be careful during measurements in the live voltage section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is off!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A lightning stroke and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. Never replace modules, or components, while the unit is on.2.2.2 Laser The use of optical instruments with this product, will increase eye hazard. Only qualifi ed service personnel may remove the cover or attempt to service this device, due to possible eye injury. Repair handling should take place as much as possible with a disc loaded inside the player. Text below is placed inside the unit, on the laser cover shield:Figure 2-22. Safety Information, General Notes & Lead Free RequirementsCAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAMADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLINGADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLENVARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLENVARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEENVORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAMATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSE AU FAISCEAUEN 6 3139 785 316812. Safety Information, General Notes & Lead Free Requirements2.3 Lead Free RequirementInformation about Lead-free produced setsPhilips CE is starting production of lead-free sets from 1.1.2005 onwards. INDENTIFICATION:Regardless of special logo (not always indicated) One must treat all sets from 1 Jan 2005 onwards, according next rules. Example S/N:Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 1991 wk 18So from 0501 onwards = from 1 Jan 2005 onwardsImportant note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pate is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360°C 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.Philips.com you fi nd more information to: null BGA-de-/soldering (+ baking instructions)null Heating-profi les of BGAs and other ICs used in Philips-setsYou will fi nd this and more technical information within the “magazine”, chapter “workshop news”.For additional questions please contact your local repair-helpdesk.EN 73139 785 316813. Directions For UseThe following except of the Quick Use Guide serves as an introduction to the set.The Complete Direction for the Use can be downloaded in different languages from the internet site of Philips Customer care Center: www.p4c.philips.com)%7%1MBZFS3FDPSEFS%7%3)2VJDL4UBSU(VJEF$POOFDU 4FUVQ &OKPZ 8IBUTJOUIFCPY )%7%1MBZFS3FDPSEFS3'DPBYJBMDBCMF3FNPUF$POUSPMBOECBUUFSJFT6TFS.BOVBM4DBSUDBCMF5VOFSJOUFSMJOLDBCMF2VJDL4UBSU(VJEF1PXFSDBCMF(-*/,DBCMFUSBOTNJUUFS3.Directions For Use$POOFDU4UBSUXJUIUIFA#BTJDDPOOFDUJPO *GZPVIBWFB7$3 GPMMPXUIFJOTUSVDUJPOTGPSA$POOFDUJPOXJUI7$3PSTJNJMBSEFWJDF*GZPVIBWFBTFUUPQCPY GPMMPXUIFJOTUSVDUJPOTGPSA$POOFDUJPOXJUITFUUPQCPY#BTJD$POOFDUJPO “#FGPSF$POOFDUJOH6OQMVHUIFBOUFOOBDBCMFUIBUJTDVSSFOUMZDPOOFDUFEUP ZPVS57 *GZPVIBWFPOMZBTJOHMFPGGBJSBOUFOOB GPMMPXA#DPOOFDUJPO *GZPVIBWFCPUIUIFPGGBJSBOUFOOBBOEEJHJUBMUFSSFTUSJBM BOUFOOB GPMMPXA#DPOOFDUJPO$POOFDUJOH(%JTDPOOFDUUIFBOUFOOBDBCMFGSPNZPVS57BOE DPOOFDUJUUPUIF“/5&/“TPDLFUPOUIJTSFDPSEFS26TFUIFTVQQMJFE3'DPBYJBMDBCMFUPDPOOFDUUIF57TPDLFUPOUIJTSFDPSEFSUPUIF“OUFOOB*OTPDLFUPOUIF5716T