Philips-HTS-3111-Service-Manual电路原理图.pdf

1 - 1HTS3111/12/05©Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system ortransmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwisewithout the prior permission of Philips.Published by RY-LYF 1123 AVM Service Audio Printed in The Netherlands Subject to modificationSoundbar Home Theater SystemVersion 1.1TABLE OF CONTENTSLocation Of PCB Boards. 1-2Versions Variation . 1-2Measurement Setup . 1-4Specifications . 1-3Service Aids . 1-5ESD 50-60 HzPower consumption . 20 WStandby power consumption . 1 WImpedance .4 ohm woofer, 4 ohmtweeterSpeaker drivers . 65 mm (2.5”) woofer, 38mm (1.5”) tweeterFrequency response .150 Hz 20 kHzDimensions (WxHxD) .945 x 93 x 58mmWeight .1.7 kgSubwooferImpedance . 3 ohmSpeaker drivers . 165 mm (6.5”) wooferFrequency response . 40 Hz-150 HzDimensions (WxHxD) .123 x 309 x 369mmWeight .3.81 kgCable length . 4 mWall MountDimensions (WxHxD) .260 x 40 x 15mmWeight . 0.16 kgSpecifi cations subject to change without prior notice.1 - 4LEVEL METERe.g. Sennheiser UPM550with FF-filterS/N and distortion metere.g. Sound Technology ST1700BLRDUTCDUse Audio Signal Disc(replaces test disc 3)SBC429 4822 397 30184Bandpass250Hz-15kHze.g. 7122 707 48001LF Voltmetere.g. PM2534DUTRF Generator e.g. PM5326S/N and distortion metere.g. Sound Technology ST1700BUse a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).Ri=50Tuner FMMEASUREMENT SETUP1 - 5Service Tools:Universal Torx driver holder .4822 395 91019Torx bit T10 150mm .4822 395 50456Torx driver set T6-T20 .4822 395 50145Torx driver T10 extended .4822 395 50423Compact Disc:SBC426/426A Test disc 5 + 5A .4822 397 30096SBC442 Audio Burn-in test disc 1kHz .4822 397 30155SBC429 Audio Signals disc .4822 397 30184Dolby Pro-logic Test Disc .4822 395 10216SERVICE AIDSHANDLING CHIP COMPONENTS1 - 6NL WAARSCHUWINGAlle ICs en vele andere halfgeleiders zijngevoelig voor electrostatische ontladingen(ESD).Onzorgvuldig behandelen tijdens reparatie kande levensduur drastisch doen verminderen.Zorg ervoor dat u tijdens reparatie via eenpolsband met weerstand verbonden bent methetzelfde potentiaal als de massa van hetapparaat.Houd componenten en hulpmiddelen ook opditzelfde potentiaal.I AVVERTIMENTOTutti IC e parecchi semi-conduttori sonosensibili alle scariche statiche (ESD).La loro longevità potrebbe essere fortementeridatta in caso di non osservazione della piùgrande cauzione alla loro manipolazione.Durante le riparazioni occorre quindi esserecollegato allo stesso potenziale che quello dellamassa dellapparecchio tramite un braccialettoa resistenza.Assicurarsi che i componenti e anche gli utensilicon quali si lavora siano anche a questopotenziale.GBSafety regulations require that the set be restored to its originalcondition and that parts which are identical with those specified,be used.Safety components are marked by the symbol!.NLVeiligheidsbepalingen vereisen, dat het apparaat bij reparatie inzijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,identiek aan de gespecificeerde, worden toegepast.De Veiligheidsonderdelen zijn aangeduid met het symbol!.FLes normes de sécurité exigent que lappareil soit remis à létatdorigine et que soient utiliséés les piéces de rechange identiquesà celles spécifiées.Less composants de sécurité sont marqués!.DBei jeder Reparatur sind die geltenden Sicherheitsvorschriften zubeachten. Der Original zustand des Geräts darf nicht verändert werden;für Reparaturen sind Original-Ersatzteile zu verwenden.Sicherheitsbauteile sind durch das Symbol!markiert.ILe norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.Componenty di sicurezza sono marcati con!.GBAfter servicing and before returning set to customer perform a leakagecurrent measurement test from all exposed metal parts to earth groundto assure no shock hazard exist, The leakage current must notexceed 0.5mA.CLASS 1LASER PRODUCT3122 110 03420GB Warning !Invisible laser radiation when open.Avoid direct exposure to beam.S Varning !Osynlig laserstrålning när apparaten är öppnad och spärrenär urkopplad. Betrakta ej strålen.SF Varoitus !Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiinanäkymättömälle laserisäteilylle. Älä katso säteeseen!GB WARNINGAll ICs and many other semi-conductors aresusceptible to electrostatic discharges (ESD).Careless handling during repair can reduce lifedrastically.When repairing, make sure that you areconnected with the same potential as the massof the set via a wrist wrap with resistance.Keep components and tools also at thispotential.FATTENTIONTous les IC et beaucoup dautressemi-conducteurs sont sensibles auxdécharges statiques (ESD).Leur longévité pourrait être considérablementécourtée par le fait quaucune précaution nestprise à leur manipulation.Lors de réparations, sassurer de bien être reliéau même potentiel que la masse de lappareil etenfiler le bracelet serti dune résistance desécurité.Veiller à ce que les composants ainsi que lesoutils que lon utilise soient également à cepotentiel.ESDD WARNUNGAlle ICs und viele andere Halbleiter sindempfindlich gegenüber elektrostatischenEntladungen (ESD).Unsorgfältige Behandlung im Reparaturfall kandie Lebensdauer drastisch reduzieren.Veranlassen Sie, dass Sie im Reparaturfall überein Pulsarmband mit Widerstand verbundensind mit dem gleichen Potential wie die Massedes Gerätes.Bauteile und Hilfsmittel auch auf dieses gleichePotential halten.DK Advarse !Usynlig laserstråling ved åbning når sikkerhedsafbrydere erude af funktion. Undgå udsaettelse for stråling.F“Pour votre sécurité, ces documents doivent être utilisés pardes spécialistes agréés, seuls habilités à réparer votreappareil en panne“.GBESD PROTECTION EQUIPMENTComplete Kit ESD3 (small tablemat, wristband,connection box, estention cable and earth cable . 4822 310 10671Wristband tester . 4822 344 139991 - 7Pb(Lead) Free SolderWhen soldering , be sure to use the pb free solder.INDENTIFICATION:Regardless of special logo (not always indicated)onemusttreatallsetsfrom1 Jan2005onwards,accordingnext rules:Important note: In fact also products of year 2004 mustbe treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305and the higher temperatures belong to this.Due to lead-free technology some rules have to berespected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 withorder code 0622 149 00106. If lead-free solder-pasteis required, please contact the manufacturer of yoursolder-equipment. In general use of solder-pastewithin workshops should be avoided because paste isnot easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able To reach at least a solder-temperature of 400C, To stabilize the adjusted temperature at the solder-tip To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around360C 380C is reached and stabilized at the solderjoint.Heating-timeofthesolder-jointshould notexceed 4 sec. Avoid temperatures above 400C otherwisewear-out of tips will rise drastically and flux-fluid willbe destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solderalloy / parts is possible but PHILIPS recommendsstrongly to avoid mixed solder alloy types (leaded andlead-free).If one cannot avoid or does not know whether productis lead-free, clean carefully the solder-joint from oldsolder alloy and re-solder with new solder alloy(SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities)has to be purchased at external companies. Special information for BGA-ICs: Always use the 12nc-recognizable solderingtemperature profile of the specific BGA (for de-solderingalwaysuse thelead-free temperatureprofile,in case of doubt) Lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) toprotect the IC against moisture. After opening,dependent of MSL-level seen on indicator-label in thebag, the BGA-IC possibly still has to be baked dry.(MSL=Moisture Sensitivity Level). This will becommunicated via AYS-website.Do not re-use BGAs at all. For sets produced before 1.1.2005 (except productsof 2004), containing leaded solder-alloy andcomponents, all needed spare-parts will be availabletill the end of the service-period. For repair of suchsets nothing changes. On our website www.atyourservice.ce.Philips.comyou find more information to:BGA-de-/soldering (+ baking instructions)Heating-profiles of BGAs and other ICs used inPhilips-setsYou will find this and more technical informationwithin the “magazine”, chapter “workshop news”.For additional questions please contact your localrepair-helpdesk.2 - 12 - 1REPAIR INSTRUCTIONSAll functions are not workingAll functions have no soundAux In has no soundMP3 In has no soundcoaxial /optical input has no soundAll functions are not workingAll functions have no soundAux In has no soundMP3 In has no soundcoaxial /optical input has no soundCheck all cables of system are loose or bad insertRe-insert and fix the cable Standby led of panel whether is lightCheck IC505 of main board and their conjoint partscheck output of BK3V3 on the top of power boardcheck pin29 and pin9 of CN501(on the top of main pcb) whether are +30.4V and +12V check pin1of C609 (on the top of main pcb) whether is +3.3Vcheck IC507, IC508 of MAIN PCB and their conjoint parts whether are OKcheck pin1 and pin7 of IC504(on the top of main pcb) output whether are okcheck pin5 and pin13 of IC506(on the top of mainpcb)output whether are 5V and 3.3Vcheck IC506 of main pcb and their conjoint parts whether are OKcheck IC501 of main pcb and their conjoint parts whether are ok Check switch power and the conjoint partscheck pin8 of IC504(on the top of main pcb) output whether is +12V and their conjoint parts whether are OK check IC501 and FB508 of main pcb whether are OKcheck MP3 music output is okcheck mp3 jack connect is okcheck mp3 jack cable and CN508 connect of mian pcb is okcheck pin4 and pin11 of IC501 on the top of main pcb whether have music inputcheck IC510 of main pcb is OKKeep CN508 of main board has Music inputcheck from CN503 to IC510 conjoint partscheck C526 is okcheck pin1 of C650 is 3.3V,check C540 is okcheck their conjoint parts of JK501 and JK303 check their conjoints part of L501check pin3 and pin 22 of IC509 (on the top of main pcb) output whether are all 3.3Vcheck IC509 of main pcb and their conjoint parts3 - 1 3 - 1DISASSEMBLY INSTRUCTIONSDismantling of the IR Boardgure 9.Figure 3Dismantling of the Rear Cabinet1) Loosen Figure 2Figure 4Figure 8Dismantling of the Main Board1) Loosen Figure 9Figure 6Figure 7Figure 1-1Dismantling of the Power Boardgure 8. Dismantling of the MP3 Board1) Loosen BDismantling of the Main Board Bracket1) Loosen CDEDismantling of the Led Board1) Loosen Figure 5FHIDismantling of the Key Boardgure 5.GA15Figure 1-22) Lifting the front cabinet upwards and pull it right until the MP3 Links Jack out the cabinet as shown in figure 1-2.on the rear cabinet as shown in figure 1-1.3 - 2 3 - 2SERVICE POSITIONS Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them.Service Position A - All BoardsService Position B - Main, Power, Led, Key BoardService Position C IR, Led, Key Board