Philips-HTS-3181-X-Service-Manual电路原理图.pdf

1 1© Copyright 2009 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system ortransmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwisewithout the prior permission of Philips.Published by RY0929 Service Audio Printed in The Netherlands Subject to modificationDVD Home Theater SystemVersion 1.0TABLE OF CONTENTSService ManualService3139 785 35050 GBChapter LASER BEAM SAFETY PRECAUTIONS.1-2 STANDARD NOTES FOR SERVICING. .1-3 SAFETY AND IMPORTANT NOTICE.1-7 LOCATION OF PCB BOARDSVERSION VARIATION .2-1 OPERATING CONTROLS AND FUNCTIONS .2-2SPECIFICATIONS .3-1 MEASUREMENT SETUP.3-2 .SYSTEM,REGION CODE,ETC.SETTING PRODURE.3-3 RETURN UNIT TEST FLOW.3-4 MAIN UNIT REPAIR CHART.3-5 DISASSEMBLY INSTRUCTIONS .4 BLOCK WIRING DIAGRAM.5 AMPLIFIER BOARDLED + KEY BOARDDECODE BOARDPOWER BOARD.9 MECHANICAL EXPLODE VIEW PART LIST.10 REVISION LIST.11 .HTS3181/55 HTS3181X/78.6 .7 .8 LASER BEAM SAFETY PRECAUTIONS This DVD player uses a pickup that emits a laser beam. Do not look directly at the laser beam coming from the pickup or allow it to strike against your skin. The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam. CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in hazardous radiation exposure. CAUTION LASER RADIATION WHEN OPEN. DO NOT STARE INTO BEAM. Location: Top of DVD mechanism. 1 - 2STANDARD NOTES FOR SERVICING Instructions for Connectors 1. When you connect or disconnect the FFC (Flexible Foil Connector) cable, be sure to first disconnect the AC cord. 2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle. Pb (Lead) Free Solder When soldering, be sure to use the Pb free solder. IDENTIFICATION: Regardless of special logo (not always indicated) One must treat all sets from 1.1.2005 onwards, a ccording next rules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your solder-equipment. In general use of solder paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able To reach at least a solder-temperature of 400°C, To stabilize the adjusted temperature at the solder-tip To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360°C - 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs:- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for desoldering always use highest lead-free 1 - 3temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.Philips.com you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets. You will find this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. How to Remove / Install Flat Pack-IC 1. Removal With Hot-Air Flat Pack-IC Desoldering Machine: 1. Prepare the hot-air flat pack-IC desoldering machine, then apply hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1) 2. Remove the flat pack-IC with tweezers while applying the hot air. 3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it. With Soldering Iron: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 1 - 43. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig.S-1-5. 4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation 1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. 2. The “ ” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. 1 - 52. Ground for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing. Instructions for Handling Semiconductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body. 1 - 6Safety and important notice Warning Risk of overheating! Never install the Home Theater System in a confi ned space. Always leave a space of at least 4 inches around the Home Theater System for ventilation. Ensure curtains or other objects never cover the ventilation slots on the Home Theater System. Never place the Home Theater System, remote control or batteries near naked fl ames or other heat sources, including direct sunlight. Only use this Home Theater System indoors. Keep this Home Theater System away from water, moisture and liquid-fi lled objects. Never place this Home Theater System on other electrical equipment. Keep away from this Home Theater System during lightning storms. Where the mains plug or an appliance coupler is used as the disconnect device, the disconnect device shall remain readily operable. Visible and invisible laser radiation when open Avoid exposure to beam. Recycle notice This electronic equipment contains a large number of materials that can be recycled or reused if disassembled by a specialized company. If you are disposing of an old machine, please take it to a recycling center. Please observe the local regulations regarding disposal of packaging materials, exhausted batteries and old equipment. Copyright notice This product incorporates copyright protection technology that is protected by method claims of certain U.S. patents and other intellectual property rights owned by Macrovision Corporation and other rights owners. Use of this copyright protection technology must be authorised by Macrovision Corporation, and is intended for home and other limited viewing uses only unless otherwise authorised by Macrovision Corporation. Reverse engineering or disassembly is prohibited. About Progressive Scan Consumers should note that not all high defi nition television sets are fully compatible with this product and may cause artifacts to be displayed in the picture. In case of 525 or 625 progressive scan picture problems, it is recommended that the user switch the connection to the standard defi nition output. If there are questions regarding our TV set compatibility with this model 525p and 625p DVD player, please contact our customer service center. 1 - 7LOCATION OF PCB BOARDS LED BOARD VERSION VARIATION:Type/Versions Features Output Power-300WVoltage(110V-240V)SERVICE SCNARIO MATRIX: Type/Versions Board in used/5 5 HTS3181/78 HTS3181/5 5 /78 DECODE BOARD KEY BOARD AMP BOARD POWER BOARD POWER board C CAMP board C CLED board C CKEY board C C*C=Component Level Repair2 - 1HTS3181XHTS3181XDECODE board C COPERATING CONTROLS AND FUNCTIONS Front Panel USB Standby-On Turns on the player or switches to standby mode Disc Tray Open/Close Opens or closes the disc compartment. Display Panel Connects a USB supported device Play/Pause Stop starts or pauses Stops playback playback SOURCE Selects a media to play or listen to audio from the connected device. Back Panel VOLUME Increases or decreases volume. MIC Connects a microphone MAINS(AC Power cord) Connect to a standard AC outlet SPEAKERS AUDIO IN Connect the audio cables(not supplied) to the AUDIO IN_AUX1 jacks VIDEO VIDEO OUT Connect the component video cable(not supplied) to the Y Pb Pr jacks ANTENNA Connect the Speakers to the matching jacks Connect a composite video cable to the video jack Connect the FM antenna to the FM 75 jack 2 - 2SPECIFICATIONS AMPLIFIER Total output power . 300 W RMS(30%THD) Frequency Response .180Hz 18kHz / ±3 dB Signal-to-Noise Ratio .>- 60 dB (A-weighted) Input Sensitivity - AUX1.500 mV - AUX2. . 500 mV RADIO Tuning Range .