HarmanKardon-AVR145-av-sm维修电路图 手册.pdf
harman/kardon AVR145 AVR145 5 X 40W 5.1 CHANNEL A/V RECEIVER SERVICE MANUAL CONTENTS ESD WARNING.2ELECTRICAL PARTS LIST.12 LEAKAGE TESTING.3SEMICONDUCTOR PINOUTS48 BASIC SPECIFICATIONS.4PCB DRAWINGS.119 TROUBLESHOOTING GUIDE.5BLOCK DIAGRAM.126 PROCESSOR RESET.5WIRING DIAGRAM.127 PACKAGE LIST AND PARTS.6AMP BIAS ADJUSTMENT128 DISASSEMBLY7SCHEMATIC DIAGRAMS.129 UNIT EXPLODED VIEW AND PARTS11 Released 2007 Discontinued XXXXRev 0, 10/2007 harman/kardon, Inc. 250 Crossways Park Dr. Woodbury, New York, 11797 harman/kardonAVR 145/230 service manual Page 1 of 135 RadioFans.CN Eachprecautioninthismanualshouldbefollowedduringservicing. Components identified with the IEC symbolin the parts list are special significance to safety. When replacing a component identified with , use only the replacement parts designated, or parts with the same ratings or resistance, wattage, or voltage that are designated in the parts list in this manual. Leakage-current or resistance measurements must be made to determine that exposed parts are acceptably insulated from the supply circuit before retuming the product to the customer. Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.) 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together or your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES devices. CAUTION : AVR145 harman/kardonharman/kardon harman/kardonAVR 145/230 service manual Page 2 of 135 RadioFans.CN 2 ELECTROSTATICALLY SENSITIVE DEVICES SAFETY PRECAUTIONS The following check should be performed for the continued protection of the customer and service technician. LEAKAGE CURRENT CHECK Measure leakage current to a known earth ground (water pipe, conduit, etc.) by connecting a leakage current tester between the earth ground and all exposed metal parts of the appliance (input/output terminals, screwheads, metal overlays, control shaft, etc.). Plug the AC line cord of the appliance directly into a 120V AC 60Hz outlet and turn the AC power switch on. Any current measured must not exceed o.5mA. ANY MEASUREMENTS NOT WITHIN THE LIMITS OUTLINED ABOVE ARE INDICATIVE OF A POTENTIAL SHOCK HAZARD AND MUST BE CORRECTED BEFORE RETURNING THE APPLIANCE TO THE CUSTOMER. Device under test Test all exposed metal surfaces Also test with plug reversed (Using AC adapter plug as required) AC Leakage Test Leakage current tester Reading should not be above 0.5mA Earth ground harman/kardonAVR 145/230 service manual Page 3 of 135 RadioFans.CN Technical Specifications AVR145/230 Audio Section Stereo Mode Continuous Average Power (FTC) 50Watts per channel, 20Hz20kHz, < 0.07% THD, both channels driven into 8 ohms 5 Channel Surround Modes Power Per Individual Channel Front L Amplifier is in protection mode Check speaker wire connections for shorts at receiver and light around power switch is reddue to possible shortspeaker ends Amplifier is in protection mode Contact your local Harman Kardon service center due to internal problems No sound from surround or Incorrect surround mode Select a mode other than Stereo center speakers Input is monaural There is no surround information from mono sources Incorrect configuration Check speaker mode configuration Stereo or Mono program material The surround decoder may not create center- or rear-channel information from nonencoded programs Unit does not respond to Weak batteries in remote Change remote batteries remote commands Wrong device selected Press the AVR selector Remote sensor is obscured Make certain front panel sensor is visible to remote or connect an optional remote sensor Intermittent buzzing in tuner Local interference Move unit or antenna away from computers, fluorescent lights, motors or other electrical appliances Letters flash in the channel indicator Digital audio feed paused Resume play for DVD display and digital audio stops Check that Digital Input is selected In addition to the items shown above, additional information on troubleshooting possible problems with your AVR 145, or installation-related issues, may be found in the list of Frequently Asked Questions which is located in the Product Support section of our Web site at . AVR 145 OM (New) 8/4/06 1:19 PM Page 45 harman/kardonAVR 145/230 service manual Page 5 of 135 RadioFans.CN NO DESCRIPTION PARTS NO.Q,ty 1 2 3 4 5 1 ACCESSORY-1 BOX,OUT CARTON5 6 1 3 DESCRIPTIONNO CPS4A564 CQXAVR145/230 CPG1A820W 1 1 1 Q,tyPARTS NO. CPS4A565SNOW,PAD(R) 4 1 1. Instruction manual assy - Accessories2. Package Drawing 7 1 1 SNOW,PAD(L) AVR145/230 SETAVR145/230SET1 FM 1 POL ANT CSA1A018Z1 1 NODESCRIPTIONPARTS NO.Q,ty 9 10 11 12 13 1CPB1061YPOLY BAG CQX1A1135YMANUAL,INSTRUCTION MANUAL ,SETUP GUIDE 1 1 BOOKLET,INFORMATIONCQE1A180Z1 STAPLECPL09053 ACCESSORY-2 ACCESSORY-1 CPB1061Y POLY BAG CSA1A027Z AM LOOP ANTENNA ASSY 1 CABR03P3 BATTERY3 COVER ASSYCGRAVR130/230ZA POLY BAG 1 12 7 23 AM LOOP ANTENNA ASSY BATTERY ASSY 4 FM 1 POLE ANT 5 COVER ASSY 6 BOOKLET,INFORMATION 9 MANUAL INSTRUCTION 10 MANUAL SETUP CODE 11 1 1CGR1A332M7H43 CQE1A220Z CPS1A6761 CPB1A176Z1 1 2 3 4 5 CGR1A331M7H431 PAD , COVER COVER A COVER B SHEET,FRONT COVER BAG , POLY ACCESSORY-2CQXAVR145/230 CQX1A1138X 13 1 IMAGE BROCHURESHQE1A273Z IMAGE BROCHURES STAPLE POLY BAG ACCESSORY-11 SNOW PAD (R) 3 BOX ,OUT CARTON 5 SET 4 SNOW PAD (L)2 ACCESSORY-2 6 REMOCON TRANSMITTER ASSY 2 6 STAPLE 8 8STAPLECPL09053 REMOCON ASSYCARTAVR145/2301 harman/kardonAVR 145/230 service manual Page 6 of 135 RadioFans.CN 1 2 1 1. Removing the Top Cabinet Remove the Screws 5 4 6 DISASSEMBLY 13 11 10 7 9 13 3 12 8 7 5 6 8 9 4 3 2 1 Remove the Screws 2. Removing the Front Panel 19 6 3 4 7 Remove the Screws 4. Removing the Main PCB 1 2 5 17 1 25 Remove the Screws 3. Removing the Rear Panel AVR145/230 25 10 9 8 19 7 65 202122 16 15432 1 1718 2324 1112 1314 harman/kardonAVR 145/230 service manual Page 7 of 135 RadioFans.CN AVR145 DISASSEMBLY PROCEDURE 1 TOP-CABINET (21) REMOVAL 1. Remove 13 screws (S1,S7) and then remove the Top-cabinet. 2 FRONT PANEL ASSY REMOVAL 1. Remove the Top-cabinet, referring to the previous step 1. 2. Disconnect the card cable between connector (CN72-17p) on the FIP PCB (37-1) and connector (CN72) on the Input PCB (39-1). 3. Disconnect the lead wire (BN81-8P) on the FIP PCB (37-1) from connector (CN81) on the Trans PCB (40-4). 4. Disconnect the lead wire (BN22-6P) on the Phone PCB (37-5) from connector (CN22) on the Input PCB (39-1). 5. Disconnect the lead wire (BN18-5P) on the Phone PCB (37-5) from connector (CN18) on the Input PCB (39-1) 6. Disconnect the lead wire (BN10-4P) on the Volume PCB (37-6) from connector (CN10) on the Input PCB (39-1) 7. Disconnect the lead wire (BN41-6P) on the Volume PCB (37-6) from connector (CN41) on the Video PCB (41) 8. Remove 1 screw (S10) and then lead wire (JW82-1P,JW83-1P) on the Phone PCB (37-5). 9 .Remove 1screw (S10) and then lead wire (JW84-1P) on the Volume PCB (37-3). 10. Remove 10 screws (S1) and then remove the Front Panel ASSY. 3 VOLUME PCB (37-6) REMOVAL 1. Remove the Top-cabinet, referring to the previous step 1. 2. Remove the Front Panel ASSY, referring to the previous step 2. 3. Pull out the Volume Knob ASSY. 4. Disconnect connector (CN84) on the Volume PCB (37-6) from the lead wire (BN84-5P) on the FIP PCB (37-1). 5. Remove 8 screws (S2,S14), and then remove the Volume PCB (37-6). 4 PHONE PCB (37-5) REMOVAL 1. Remove the Top-cabinet, referring to the previous step 1. 2. Remove the Front Panel ASSY, referring to the previous step 2. 3. Disconnect connector (CN85)on the Phone PCB (37-5) from the lead wire (BN85-2P) on the FIP PCB (37-1). 4. Remove 2 screws (S2) and then remove the Phone PCB (37-5). 5 POWER LED PCB (37-3) REMOVAL 1. Remove the Top-cabinet, referring to the previous step 1. 2. Remove the Front Panel ASSY, referring to the previous step 2. 3. Disconnect connector (CN88) on the Power Led PCB (37-3) from the lead wire (BN88-4P) on the FIP PCB (37-1) . 4. Remove 2 screws (S2) and then remove the Power led PCB (37-3). 6 FIP PCB (37-1) REMOVAL 1. Remove the Top-cabinet, referring to the previous step 1. 2. Remove the Front Panel ASSY, referring to the previous step 2. 3. Disconnect the lead wire (BN84-5P) on the FIP PCB (37-1) from connector (CN84) on the Volume PCB (37-6). 4. Disconnect the lead wire (BN85-2P) on the FIP PCB (37-1) from connector (CN85) on the Phone PCB (37-5). 5. Disconnect the lead wire (BN88-4P) on the FIP PCB (37-1) from connector (CN88) on the Power Led PCB (37-3). 6. Disconnect the connector (CN89) on the FIP PCB (37-1) from lead wire (BN89-4P) on the Key PCB (37-2). 7. Remove 3 screws (S2) and then remove the Guide PCB (37-8) DQ15A1 Low will select the LSB of the Word on the other addresses, DQ15A1 High will select the MSB. Throughout the text consider references to the Data Input/Output to include this pin when BYTE is High and references to the Address In- puts to include this pin when BYTE is Low except when stated explicitly otherwise. Chip Enable (E). The Chip Enable, E, activates the memory, allowing Bus Read and Bus Write op- erations to be performed. When Chip Enable is High, VIH, all other pins are ignored. Output Enable (G). The Output Enable, G, con- trols the Bus Read operation of the memory. Write Enable (W). The Write Enable, W, controls the Bus Write operation of the memorys Com- mand Interface. Reset/Block Temporary Unprotect (RP). The Reset/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to temporarily unprotect all Blocks that have been protected. A Hardware Reset is achieved by holding Reset/ Block Temporary Unprotect Low, VIL, for at least tPLPX. After Reset/Block Temporary Unprotect goes High, VIH, the memory will be ready for Bus Read and Bus Write operations after tPHEL or tRHEL, whichever occurs last. See the Ready/Busy Output section, Table 15. and Figure 15., Reset/ Block Temporary Unprotect AC Waveforms, for more details. Holding RP at VID will temporarily unprotect the protected Blocks in the memory. Program and Erase operations on all blocks will be possible. The transition from VIH to VID must be slower than tPHPHH. Ready/Busy Output (RB). The Ready/Busy pin is an open-drain output that can be used to identify when the device is performing a Program or Erase operation. During Program or Erase operations Ready/Busy is Low, VOL. Ready/Busy is high-im- pedance during Read mode, Auto Select mode and Erase Suspend mode. After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy be- comes high-impedance. See Table 15., Reset/ Block Temporary Unprotect AC Characteristics and Figure 15., Reset/Block Temporary Unprotect AC Waveforms. The use of an open-drain output allows the Ready/ Busy pins from several memories to be connected to a single pull-up resistor. A Low will then indicate that one, or more, of the memories is busy. Byte/Word Organization Select (BYTE). The Byte/Word Organization Select pin is used to switch between the 8-bit and 16-bit Bus modes of the memory. When Byte/Word Organization Se- lect is Low, VIL, the memory is in 8-bit mode, when it is High, VIH, the memory is in 16-bit mode. VCC Supply Voltage. The VCC Supply Voltage supplies the power for all operations (Read, Pro- gram, Erase etc.). The Command Interface is disabled when the VCC Supply Voltage is less than the Lockout Voltage, VLKO. This prevents Bus Write operations from ac- cidentally damaging the data during power up, power down and power surges. If the Program/ Erase Controller is programming or erasing during this time then the operation aborts and the memo- ry contents being altered will be invalid. A 0.1F capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during program and erase operations, ICC3. VSS Ground. The VSS Ground is the reference for all voltage measurements. harman/kardonAVR 145/230 service manual Page 92 of 135 RadioFans.CN 11/42 M29W800DT, M29W800DB BUS OPERATIONS There are five standard bus operations that control the device. These are Bus Read, Bus Write, Out- put Disable, Standby and Automatic Standby. See Tables 2 and 3, Bus Operations, for a summary. Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the memory and do not affect bus operations. Bus Read. Bus Read operations read from the memory cells, or specific registers in the Com- mand Interface. A valid Bus Read operation in- volves setting the desired address on the Address Inputs, applying a Low signal, VIL, to Chip Enable and Output Enable and keeping Write Enable High, VIH. The Data Inputs/Outputs will output the value, see Figure 12., Read Mode AC Waveforms, and Table 12., Read AC Characteristics for detai
