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1、 harman/kardon Service Manual AVR 155/230 5 x 40W 5.1 CHANNEL A/V RECEIVER CONTENTS ESD WARNING 2 BASIC SPECIFICATIONS 3 TROUBLESHOOTING GUIDE 4 PROCESSOR RESET 4 REMOTE AND PROCESSOR RESET 5 PACKAGE LIST AND PARTS 6 DISASSEMBLY 7 EXPLODED VIEW AND PARTS 8 ELECTRICAL PARTS LIST 9 SEMICONDUCTOR PINOU
2、TS 35 PCB DRAWINGS 76 BLOCK DIAGRAM 82 WIRING DIAGRAM 83 AMP BIAS ADJUSTMENT 84 SCHEMATIC DIAGRAMS 85 Released EU2008 harman/kardon, Inc. Rev 0, 07/2008 250 Crossways Park Dr. Woodbury, New York, 11797 harman/kardonAVR 155/230 Service Manual Page 1 of 92 RadioFans.CN Eachprecautioninthismanualshould
3、befollowedduringservicing. Components identified with the IEC symbolin the parts list are special significance to safety. When replacing a component identified with , use only the replacement parts designated, or parts with the same ratings or resistance, wattage, or voltage that are designated in t
4、he parts list in this manual. Leakage-current or resistance measurements must be made to determine that exposed parts are acceptably insulated from the supply circuit before retuming the product to the customer. Some semiconductor (solid state) devices can be damaged easily by static electricity. Su
5、ch components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by s
6、tatic electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be
7、removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a
8、 grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate elec
9、trical change sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
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