Philips-FWD-410-Service-Manual(1) 电路图 维修手册.pdf
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1、1 - 1 FWD410/77/98/51 Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without t
2、he prior permission of Philips. Published by HF1151 Service Audio Printed in The Netherlands Subject to modification DVD Mini System Version 1.0 TABLE OF CONTENTS Location Of PCB Boards. 1-2 Versions Variation . 1-2 Measurement Setup . 1-5 Specifications . 1-3 BG LE . 1-6 ESD fr Reparaturen sind Ori
3、ginal-Ersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza sono marcati con ! . GB Af
4、ter servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist, The leakage current must not exceed 0.5mA. CLASS 1 LASER PRODUCT 3122 110 03420 GBWarning ! Invisible laser radiation when open.
5、 Avoid direct exposure to beam. SVarning ! Osynlig laserstrlning nr apparaten r ppnad och sprren r urkopplad. Betrakta ej strlen. SFVaroitus ! Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina nkymttmlle laseristeilylle. l katso steeseen! GBWARNING All ICs and many other semi-conduct
6、ors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential. F AT
7、TENTION Tous les IC et beaucoup dautres semi-conducteurs sont sensibles aux dcharges statiques (ESD). Leur longvit pourrait tre considrablement courte par le fait quaucune prcaution nest prise leur manipulation. Lors de rparations, sassurer de bien tre reli au mme potentiel que la masse de lappareil
8、 et enfiler le bracelet serti dune rsistance de scurit. Veiller ce que les composants ainsi que les outils que lon utilise soient galement ce potentiel. ESD DWARNUNG Alle ICs und viele andere Halbleiter sind empfindlich gegenber elektrostatischen Entladungen (ESD). Unsorgfltige Behandlung im Reparat
9、urfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall ber ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gertes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten. DKAdvarse ! Usynlig laserstrling ved b
10、ning nr sikkerhedsafbrydere er ude af funktion. Undg udsaettelse for strling. F Pour votre scurit, ces documents doivent tre utiliss par des spcialistes agrs, seuls habilits rparer votre appareil en panne. GB ESD PROTECTION EQUIPMENT Complete Kit ESD3 (small tablemat, wristband, connection box, este
11、ntion cable and earth cable .4822 310 10671 Wristband tester . 4822 344 13999 1 - 8 Pb(Lead) Free Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) onemusttreatallsetsfrom1 Jan2005onwards,according next rules: Important note
12、: In fact also products of year 2004 must be treatedin this way as long as youavoidmixingsolder- alloys(leaded/ lead-free). Sobest to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only le
13、ad-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste withinworkshopsshouldbeavoidedbecausepaste is not easy to store and to handle. Use only adequate solder
14、tools applicable for lead- free solder alloy. The solder tool must be able To reach at least a solder-temperature of 400?C, To stabilize theadjustedtemperature atthesolder- tip To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360?C 380?C is rea
15、chedandstabilized at thesolder joint.Heating-timeofthesolder-jointshould notexceed 4 sec. Avoid temperatures above 400?C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un- used equipment, or reduce heat. Mix of lead-free solder
16、 alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoidmixed solderalloy types (leadedand lead-free). Ifonecannot avoidordoes not knowwhetherproduct is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (
17、SAC305). Use only original spare-parts listed in the Service- Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: Always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de- solderingalwaysuse
18、 thelead-free temperatureprofile, in case of doubt) Lead free BGA-ICs will be delivered in so-called dry- packaging(sealedpack including a silica gelpack) to protect the IC against moisture. After opening, dependent of MSL-level seenonindicator-labelin the bag, the BGA-IC possibly still has to be ba
19、ked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. Fo
20、r repair of such sets nothing changes. On our websitewww.atyourservice.ce.P you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information within the “magazine”, chapter “workshop n
21、ews”. For additional questions please contact your local repair-helpdesk. 2 - 12 - 1 5) Upgrading new software a) Check for the latest software version on Search for your model and click on software&drivers . b) Copy the latest upgrading software onto a CD-R or USB storage device. c) Insert the CD-R
22、 program disc or connect the USB storage device to the home theater. d) Press button on R/C. e) TV will show message as follow: Upgrade fi le detected Upgrade? Press PLAY to start f) Press “u” button on R/C. g) TV will show message as follow: Upgrade fi le detected Upgrade? Press PLAY to start Upgra
23、ding h) When the updated is complete ,the home theater automatically switch to standby. Note: when upgrade in progress, please do not unplug or switch off the device. 6) How to replace the defective DVD Loader a) Remove the defective DVD Loader (see chapter 3). b) Accordingly connect DVD Loader and
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