Panasonic-SAHT855E-htss-sm 电路图 维修手册.pdf

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1、lGeneral Power Source: E/ EG areas:AC 230V, 50Hz EB area:AC 230V-240V, 50Hz Power consumption:115 W Dimensions (WHD):43060354 mm Mass:3.35kg lAmplifier section RMS Output Power: Dolby Digital Mode lTotal RMS Dolby Digital mode Power:850 W At 1kHz and total harmonic of 10% lFront:110 W/ Channel (3) l

2、Center:225 W/ Channel (6) lSurround:90 W/ Channel (4) At 100Hz and total harmonic of 10% lActive subwoofers:225 W/ Channel (6) DIN Output Power: Dolby Digital Mode: lTotal DIN Dolby Digital mode Power: 440 W At 1kHz and total harmonic of 1% 2006 Panasonic AVC Networks Singapore Pte. Ltd. All rights

3、reserved. Unauthorized copying and distribution is a violation of law. SA-HT855E SA-HT855EB SA-HT855EG Colour (S).Silver Type lFront:80 W/ Channel (3) lCenter:75 W/ Channel (6) lSurround:65 W/ Channel (4) At 100Hz and total harmonic of 1% lSubwoofer:75 W/ Channel (6) lFM tuner section Preset Memory:

4、FM 15 stations AM/MW 15 stations Frequency Range:87.50-108.00MHz (50kHz in step) Sensitivity:1.8V (IHF) S/N 26dB1.4V Antenna Terminals:75 (unbalanced) lAM tuner section Frequency Range:522-1629kHz (9kHz in step) AM Sensitivity S/N 20dB at 999kHz: 560V/m lDigital audio input: Optical digital input:Op

5、tical terminal (1 system) Sampling frequency:32kHz, 44.1kHz, 48kHz lPhone Jack: DVD Home Theater Sound System Specifications ORDER NO.MD0603062C2 RadioFans.CN 收音机爱 好者资料库 Terminal:Stereo 3.5 mm jack lFront M. Port: Sensitivity:100mV (15k) Terminal:Stereo 3.5 mm jack lDisc section Discs played (8 cm o

6、r 12 cm): (1)DVD DVD-Video, DVD-Audio, DivX(*1,2) (2)DVD-RAM DVD-VR, MP3(*2,6), JPEG(*2,3), MPEG4(*2,4), DivX(*1,2) (3)DVD-R DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3), MPEG4(*2,4), DivX(*1,2) (4)DVD-R DL DVD-Video, DVD-VR (5)DVD-RW DVD-Video, DVD-VR, MP3(*2,6), JPEG(*2,3), MPEG4(*2,4), DivX(*1,2) (6)

7、+R/+RW Video (7)+R DL Video (8)CD, CD-R/RW CD-DA, Video CD, SVCD(*5), MP3(*2,6), WMA(*2,7), JPEG(*2,3), MPEG4(*2,4), DivX (*1,2), HighMAT Level 2 (Audio and Image) *1Plays all versions of DivX video (including DivX6) with standard playback of DivX media files. Certified to the DivX Home Theater Prof

8、ile. lGMC (Global Motion Compensation) is not supported. *2The total combined maximum number of recognizable audio, picture and video contents and groups: 4000 audio, picture and video contents and 400 groups. *3Exif Ver 2.1 JPEG Baseline files lPicture resolution: between 160 x 120 and 6144 x 4096

9、pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2, 4:4:4). Extremely long and narrow pictures may not be displayed. *4MPEG4 data recorded with Panasonic SD multi cameras or DVD video recorders. lConforming to SD VIDEO specifications (ASF standard)/ MPEG4 (Simple Profile) video system/G.726 audio system. *

10、5Conforming to IEC62107 *6MPEG-1 Layer 3, MPEG-2 Layer 3 *7Windows Media Audio Ver.9.0 L3 lNot compatible with Multiple Bit Rate (MBR) Pick up: Wavelength: lCD:785nm lDVD:662nm Laser power: lCD:CLASS 1M lDVD:CLASS 1 Audio output (DISC): Number of channels:5.1 ch (FL, FR, C, SL, SR, SW) Audio perform

11、ance: Frequency response: DVD (linear audio):4 Hz-22 kHz (48 kHz sampling) 4 Hz-44 kHz (96 kHz sampling) DVD-Audio:4 Hz-88 kHz (192 kHz sampling) CD-Audio:4 Hz-20 kHz S/N ratio: CD-Audio:105 dB Dynamic range: DVD (linear audio):95 dB CD-Audio:95 dB Total harmonic distortion: CD-Audio:0.005 % lVideo

12、section Video system: Signal system:PAL 625/50, PAL 525/60, NTSC Composite video output: Output level:1 Vp-p (75 ) Terminal:Pin jack (1 system) Scart jack (1 system) S-video output: Y output level:1 Vp-p (75 ) C output level:PAL; 0.3Vp-p (75) NTSC; 0.286 Vp-p (75 ) TerminalS terminal (1 system) Scar

13、t jack (1 system) Component video output (NTSC: 480p/480i, PAL: 576p/576i): Y output level:1 Vp-p (75 ) PBoutput level:0.7 Vp-p (75 ) PRoutput level:0.7 Vp-p (75 ) Terminal:Pin jack (Y: green, PB: blue, PR: red) (1 system) RGB video output: R output level:0.7 Vp-p (75 ) G output level:0.7 Vp-p (75 )

14、 B output level:0.7 Vp-p (75 ) Terminal:Scart jack (1 system) HDMI AV output:19 pin type A connector, HDMI Ver.1.2a (EDID Ver.1.3) Power consumption in standby mode: approx 0.5W Note: 1.Specifications are subject to change without notice. Mass and dimensions are approximate. 2.Total harmonic distort

15、ion is measured by the digital spectrum analyzer. Solder: This model uses lead free solder (PbF). Mechanism: This model uses DL2SU (Single tray) mechanism. 2 SA-HT855E / SA-HT855EB / SA-HT855EG RadioFans.CN 收音机爱 好者资料库 Refer to the original service manual for *1, *2, *3, *4. 1 Safety Precautions 5 1.

16、1. GENERAL GUIDELINES 5 1.2. Before Repair and Adjustment 5 1.3. Protection Circuitry 5 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 6 3 Precaution of Laser Diode 7 4 About Lead Free Solder (PbF) 8 4.1. Service caution based on legal restrictions 8 5 Cau

17、tion for AC Mains Lead 9 6 Handling Precautions for Traverse Unit 10 6.1. Cautions to Be Taken in Handling the Optical Pickup Unit 10 6.2. Grounding for electrostatic breakdown prevention 10 7 Accessories 12 8 Operation Procedures 13 8.1. Operating instructions 13 8.2. Main Unit Keys Operation 14 8.

18、3. Connection Setup (HDMI/ Scart) 15 8.4. Use of HDAVI Control 17 8.5. Using of Music Port 18 8.6. Disc Information 19 8.7. About DivX VOD Content 21 9 New Features 22 9.1. About HDMI 22 10 Self-Diagnosis and special mode setting 24 CONTENTS Page Page 3 SA-HT855E / SA-HT855EB / SA-HT855EG RadioFans.

19、CN 收音机爱 好者资料库 10.1. Service Mode Summary Table 24 10.2. Service Mode Table 1 24 10.3. DVD Self Diagnostic Function-Error Code 29 10.4. Sales Demonstration Lock Function 31 10.5. Service Precautions 32 11 Assembling and Disassembling 33 11.1. Disassembly Flow Chart 34 11.2. Main Components and P.C.B.

20、 Locations 35 11.3. Disassembly of Top Cabinet 36 11.4. Disassembly of the DVD Lid (When taking out disc manually) 36 11.5. Disassembly of Front Panel Assembly 36 11.6. Disassembly of Music Port P.C.B, FL P.C.B. & Top Button P.C.B. 37 11.7. Disassembly of DVD Mechanism Unit 37 11.8. Disassembly of H

21、DMI Module P.C.B. 38 11.9. Disassembly of Rear panel 38 11.10. Disassembly of Scart P.C.B. 38 11.11. Disassembly of Relay P.C.B. 38 11.12. Disassembly of Main P.C.B., AC-Inlet P.C.B. & Tuner Extent P.C.B. 39 11.13. Disassembly of Digital Amp IC 39 11.14. Disassembly of Digital Amp IC (IC5400) 39 11.

22、15. Disassembly of Regulator IC 39 11.16. Disassembly of Switch Regulator IC (IC5701) 40 11.17. Service Position 40 12 Assembly and disassembly of Mechanism Unit 41 12.1. Disassembly Procedure 41 13 Measurements and Adjustments 47 13.1. Service Tools and Equipment 47 13.2. Important points in adjust

23、ment 47 13.3. Storing and handling of test discs 47 13.4. Optical adjustment 48 13.5. Abbreviations 49 14 Voltage and Waveform Chart 51 14.1. HDMI Module P.C.B. 51 14.2. Main P.C.B. 53 14.3. FL P.C.B., Scart P.C.B., Tray Loading P.B.C. 55 14.4. Waveform Chart 56 15 Illustration of ICs, Transistors a

24、nd Diodes 57 16 Wiring Connection Diagram 59 17 Block Diagram 61 18 Schematic Diagram Notes 69 19 Schematic Diagram 71 19.1. (A) HDMI Module Circuit 71 19.2. (B) Main Circuit 77 19.3. (C) Main/Power Circuit 82 19.4. (D) FL, Scart, Tuner, Tray Loading, Relay Circuit 86 20 Printed Circuit Board 89 20.

25、1. (A) HDMI Module P.C.B. 89 20.2. (B) Main P.C.B. 90 20.3. (C) Tuner extent, AC-inlet, FL, Music port & Top button P.C.B. 91 20.4. (D) Scart, Tray motor & Relay P.C.B. 92 21 Basic Troubleshooting Guide 93 21.1. Basic Troubleshooting Guide for Traverse Unit (HDMI Module P.C.B) 93 21.2. Basic Trouble

26、shooting Guide for HDMI AV output 94 22 Overall Flow-Chart (HT855) 95 22.1. SC-HT855 DVD Unit Block Diagram 96 22.2. HT855 Block Diagram (Analog Signal : DVD 5.1ch Play Back Mode) 97 22.3. HT855 Block Diagram (Analog Signal : 2ch Analog Input Mode) 98 22.4. HT855 Power Supply Block Diagram 99 22.5.

27、HT855 Power Block Diagram (SMPS) 100 23 Terminal Function of ICs 101 23.1. IC2018 (C2CBYY000196): Operation CPU 101 24 Exploded Views 102 24.1. Cabinet Parts Location 102 24.2. Packaging 104 25 Replacement Parts List 105 25.1. Component Parts List 106 4 SA-HT855E / SA-HT855EB / SA-HT855EG 1 Safety P

28、recautions 1.1. GENERAL GUIDELINES 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation pape

29、rs shields are properly installed. 3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1. LEAKAGE CURRENT COLD CHECK 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistanc

30、e value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does

31、 not have a return path to the chassis, the reading must be. Figure 1 1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, betwe

32、en each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. R

33、everse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measur

34、ement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. 1.2. Before Repair and Adjustment Disconnect AC power, discharge Power Supply Capacitors C5716, C5717, C5718 through a 10 , 10

35、 W resistor to ground. DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent. Current consumption at AC 230 V, 50 Hz in NO SIGNAL mode volume minimal s

36、hould be 600 mA. (For E/ EG) Current consumption at AC 230V240 V, 50 Hz in NO SIGNAL mode volume minimal should be 600 mA. (For EB) 1.3. Protection Circuitry The protection circuitry may have operated if either of the following conditions are noticed: No sound is heard when the power is turned on. S

37、ound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used. 5 SA-HT855E / S

38、A-HT855EB / SA-HT855EG If this occurs, follow the procedure outlines below: 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one minute. Note: When the protection circuitry functions, the unit will not operate unless the power is firs

39、t turned off and then on again. 2 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of t

40、ypical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD). 1. Immediately before handling any semiconductor component

41、 or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After remo

42、ving an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder r

43、emoval device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES d

44、evice from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from

45、 the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackage

46、d replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device). 6 SA-HT855E / SA-HT855EB / SA-HT855EG 3 Precaution of Laser Diode 7 SA

47、-HT855E / SA-HT855EB / SA-HT855EG 4 About Lead Free Solder (PbF) 4.1. Service caution based on legal restrictions 4.1.1. General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for thi

48、s equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.

49、30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the