Jvc-DRMV-2-SEL-Service-Manual(1) 电路图 维修手册.pdf
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1、SERVICE MANUAL COPYRIGHT 2005 Victor Company of Japan, Limited No.YD087 2005/11 DVD VIDEO RECORDER when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. 6) (4) Release the flat pack-IC from the CBA using twee
2、zers. (Fig. 6) 1.2.4.1.2Caution: (1) The Flat Pack-IC shape may differ by models. Use an ap- propriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. (2) Do not supply hot air to the chip parts around the flat pack- IC for over 6 seconds because damage to the
3、 chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. 2) (3) The flat pack-IC on the CBA is affixed with glue, so be care- ful not to break or damage the foil of each pin or the solder lands under the IC when removing it. Fig.2 Top View OutIn Botto
4、m View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape 1-6 (No.YD087) 1.2.4.1.3With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC.
5、When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. 3) Fig.3 (2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or
6、 a hot air desoldering machine. (Fig. 4) Fig.4 (3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. 6) (4) Release the flat pack-IC from the CBA
7、using tweezers. (Fig. 6) 1.2.4.1.4With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. 3) (2) Affix the wire to a workbench or solid mounting point,
8、 as shown in Fig. 5 (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. 5 (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-
9、IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. 6) (5) Release the flat pack-IC from the CBA using tweezers. (Fig. 6) Note: When using a soldering iron, care must be taken to en- sure that the flat pack-IC is not being held by glue.
10、When the flat pack-IC is removed from the CBA, handle it gen- tly because it may be damaged if force is applied. Fig.5 Fig.6 Flat Pack-IC Desoldering Braid Soldering Iron Fine Tip Soldering Iron Sharp Pin To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fine Tip Soldering Iron CBA
11、Flat Pack-IC Tweezers (No.YD087)1-7 1.2.4.2Installation (1) Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. (2) The ? mark on the flat pack-IC indicates pin 1. (See Fig. 7) Be sure this mar
12、k matches the 1 on the PCB when posi- tioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. 8) (3) Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Fig.7 Fig.8 1.2.5Instructions for Handling Semi-conductors Electrostatic break
13、down of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1.2.5.1Ground for Human Body Be sure to wear a grounding band (1M) that is properly ground- ed to remove any static electricity that may be charged on the body. 1.2.5.2
14、Ground for Workbench (1) Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other sur- face, where the semi-conductors are to be placed. Be- cause the static electricity charge on clothing will not escape through the body grounding band, be careful to
15、avoid contacting semi-conductors with your clothing. Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Presolder CBA Flat Pack-IC CBA CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M 1-8 (No.YD087) 1.3PREPARATION FOR SERVICING 1.3.1How to Enter the Service Mode 1.3.1.1About Optica
16、l Sensors Caution: An optical sensor system is used for the Tape Start and End Sensors on this equipment. Carefully read and follow the in- structions below. Otherwise the unit may operate erratically. What to do for preparation Insert a tape into the Deck Mechanism Assembly and press the PLAY butto
17、n. The tape will be loaded into the Deck Mech- anism Assembly. Make sure the power is on, connect TP507 (S-INH) to GND. This will stop the function of Tape Start Sen- sor, Tape End Sensor and Reel Sensors. (If these TPs are connected before plugging in the unit, the function of the sen- sors will st
18、ay valid.) See Fig. 1. Fig.1 Note: Because the Tape End Sensors are inactive, do not run a tape all the way to the start or the end of the tape to avoid tape dam- age. Q504 Q503 TP501 S-INH (No.YD087)1-9 1.4LASER BEAM SAFETY PRECAUTIONS This DVD player uses a pickup that emits a laser beam. The lase
19、r beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam. CAUTION: Use of controls and adjustments, or doing procedures other than tho
20、se specified herein, may result in hazardous radiation exposure. Location: Top of DVD mechanism. Do not look directly at the laser beam coming from the pickup or allow it to strike against your skin. Drive Mechanism Assembly Laser Beam Radiation Laser Pickup Turntable 1-10 (No.YD087) SECTION 2 SPECI
21、FIC SERVICE INSTRUCTIONS This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS. (No.YD087)1-11 SECTION 3 DISASSEMBLY 3.1CABINET DISASSEMBLY INSTRUCTIONS 3.1.1Disassembly Flowchart This flowchart indicates the disassembly steps to gain access to item(s) to be serviced. When reassembling
22、, follow the steps in reverse order. Bend, route, and dress the cables as they were originally. 3.1.2Disassembly Method Note: (1) Identification (location) No. of parts in the figures (2) Name of the part (3) Figure Number for reference (4) Identification of parts to be removed, unhooked, un- locked
23、, released, unplugged, unclamped, or desoldered. P = Spring, L = Locking Tab, S = Screw, CN = Connector * = Unhook, Unlock, Release, Unplug, or Desolder e.g. 6(S-1) = six Screws (S-1), 5(L-1) = two Locking Tabs (L-1) (5) Refer to Reference Notes. 1 Top Cover 2 Front Assembly 4 Radiation Sheet 3 Fron
24、t Bracket 5 Jack Bracket 6 Front Jack CBA 7 DVD Mechanism see the positions of 44 and 45 in Fig.1 on page 1-20. When reassembling, follow the steps in reverse order. STEP/ LOC. No. STARTING No. PARTREMOVALINSTALLATION Fig. No.REMOVE/*UNHOOK/ UNLOCK/RELEASE/ UNPLUG/DESOLDER ADJUSTMENT CONDITION 11Gui
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