Philips-DVP-3150-V-Service-Manual电路原理图.pdf
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1、STOP PLAYREW F.FWD PLAY REC CHANNELSTOP/EJECTVIDEO AUDIOLRONE TOUCH RECORDING LONG PLAYSOURCESTANDBY-ONVCR DVDDVDDVP 3150V DVD PLAYER/VCROPEN/CLOSEContentsChapterSec. 1: Adjustment ProceduresSchematic Diagrams and CBAsExploded ViewsMechanical and Electrical Parts ListsSec. 2: Standard MaintenanceMec
2、hanism Alignment ProceduresDisassembly / Assembly of MechanismDeck Exploded ViewsDeck Parts ListSurvey of versions:Published by FU0619 Service AV Systems Printed in The Netherlands Subject to modification/37 NTSCDVD + VCR Combi DVP3150V/37cCopyright 2006 Philips Consumer Electronics B.V. Eindhoven,
3、The Netherlands.All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.CLASS 1 LASER PRODUCTKLASSE 1 LASER PRODUKTKLASS 1
4、LASER APPARATCLASSE 1 PRODUIT LASEREN 3139 785 32000Second GenerationService ManualServiceServiceServiceThis service manual is for DVP3150V/37 Second Generation model, which is different from the previous generation DVP3150V/37 model. For Second Generation model, the serial number begins with SG2B06
5、xxxxxxxx. Refer to the rating label illustration at right.SG2B06xxxxxxxxM A R C H 2 0 0 6Serial numberRating labelBarthServiceMAIN SECTIONDVD PLAYER when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6
6、)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)CAUTION:1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.2. Do not supply hot air to the chip parts around the flat pack-IC f
7、or over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when
8、removing it.Fig. S-1-1Hot-airFlat Pack-ICDesolderingMachineCBAFlat Pack-ICTweezersMasking TapeFig. S-1-2BarthService1-3-3 T2221_SNWith Soldering Iron:1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pac
9、k-IC, you can remove it easily. (Fig. S-1-3)2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)3. Bottom of the flat pack-IC
10、 is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)With Iron Wire:1. Using desoldering braid, remo
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