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1、ABCDEFGHIJ 1 2 3 4 5 6 7 RX-V563/HTR-6150/DSP-AX563 71 (Side B)OPERATION (2) P.C.B. U, C models Semiconductor Location Ref no.LocationRef no.Location D7005D5 D7006D4 D7010E4 D7012H3 D7013I3 D7016B3 D7。
2、RX-Z7/DSP-Z7 1 0 111 6 SERVICE MANUAL IMPORTANT NOTICE This manual has been provided for the use of authorized YAMAHA Retailers and their service personnel It has been assumed that basic service proce。
3、 A 1 2 3 4 5 6 7 8 9 10 BCDEFGHIJKLMN RX-Z7/DSP-Z7 151 DSP 3/3 02.7 5.5 2.9 11.5 2.9 2.9 0 0 5.5 2.92.9 2.9 0 0 2.9 5.5 5.5 2.3 2.3 2.3 2.3 2.3 2.3 2.3 2.3 -11.3 2.8 0.3 0.3 11.5 -11.3 1.4 1.4 1.6 5.。
4、TF5/TF3/TF1 181 HAAD22 DSP#4(IC401) AXR07(A6) - CN705 OMNI1-8(11th) CN702 SD_HA2(6th) - DSP#2(IC201) AXR21(B7) HAAD31 DSP#4(IC401) AXR08(B6) - CN705 OMNI9-16(13th) CN703 SD_HA3(6th) - DSP#1(IC101) AXR。
5、53 TF5/TF3/TF1 BRDG/HAAD C323US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C324US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C330US064100MONOLITHIC CERAMI。
6、TF5/TF3/TF1 181 HAAD22 DSP#4(IC401) AXR07(A6) - CN705 OMNI1-8(11th) CN702 SD_HA2(6th) - DSP#2(IC201) AXR21(B7) HAAD31 DSP#4(IC401) AXR08(B6) - CN705 OMNI9-16(13th) CN703 SD_HA3(6th) - DSP#1(IC101) AXR。
7、53 TF5/TF3/TF1 BRDG/HAAD C323US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C324US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C330US064100MONOLITHIC CERAMI。
8、ABCDEFGHIJ 1 2 3 4 5 6 7 RX-V557/HTR-5850/DSP-AX557 RX-V457/HTR-5840/DSP-AX457 71 I PRINTED CIRCUIT BOARD (Foil side) HTR-5850 SUBTRANS (1) P.C.B. (Side A) SUBTRANS (1) P.C.B. (Side B) Lead Free Sold。
9、SERVICE MANUAL HAMAMATSU, JAPAN SERVICE MANUAL 201404- PA012144 Copyright (c) Yamaha Corporation. All rights reserved. PDF 15.05 SPECIFICATIONS（総合仕様） .4 PANEL LAYOUT（）。
10、ABCDEFGHIJ 1 2 3 4 5 6 7 RX-V740/RX-V740RDS/DSP-AX740 RX-V640/RX-V640RDS/HTR-5660/DSP-AX640/DSP-AX640SE 71 I PRINTED CIRCUIT BOARD (Foil side) OPERATION (4) P. C. B.(Lead Type Device)OPERATION (6) P. 。
11、SERVICE MANUAL HAMAMATSU, JAPAN SERVICE MANUAL 201404- PA012144 Copyright (c) Yamaha Corporation. All rights reserved. PDF 15.05 SPECIFICATIONS（総合仕様） .4 PANEL LAYOUT（）。
12、ABCDEFGHIJ 1 2 3 4 5 6 7 RX-V3900/DSP-AX3900 121 IC802 IC805 IC801 14 58 1 13 4 5 4 58 OPERATION (3) P.C.B.(Side B) Semiconductor Location Ref No. Location D8004F4 D8005F4 D8006E3 D8007E3 D8008D3 D800。
13、91 TF5/TF3/TF1 PIN NO. I/OFUNCTIONNAME PIN NO. I/OFUNCTIONNAME 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 AIN2+ AIN2- GND VA REF_GND FILT+ VQ GND VA GND AIN4+ AIN4- AIN3+ AIN3- AIN7+ 。
14、182 RX-Z11/DSP-Z11 RX-Z11/DSP-Z11 Ref No.Part No.DescriptionRemarksMarkets部品名 P.C.B. DSP New Parts 新規部品 *WK989900P.C.B.DSPJRTKABGEL *WK990000P.C.B.DSPUC CB502V9192700CN.BS.PIN4P付01 CB503WC195900CN.BS.。
15、91 TF5/TF3/TF1 PIN NO. I/OFUNCTIONNAME PIN NO. I/OFUNCTIONNAME 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 AIN2+ AIN2- GND VA REF_GND FILT+ VQ GND VA GND AIN4+ AIN4- AIN3+ AIN3- AIN7+ 。
16、53 TF5/TF3/TF1 BRDG/HAAD C323US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C324US035100MONOLITHIC CERAMIC CAPACITOR (CHIP)0.1000 16V K RECT. 積 層 C330US064100MONOLITHIC CERAMI。
17、CS1D 141 (BOTTOM ASSY LEFT)CIO MB21 BUFFER See Page 8. Rear Panel Assembly A ; See Page 13. Rear Panel Assembly B ; See Page 13. Rear Panel Assembly C ; See Page 14. CMU2-CARD Assembly ; See Page 1。
18、MAIN-A, MAIN-B, MAIN-C: 3NA-V312430-3 S-SYNC:3NA-V519530-2 2 Pattern sidePattern sidePattern side Pattern side MAIN-A Circuit BoardS-SYNC Circuit Board MAIN-B Circuit BoardMAIN-C Circuit Board D24 36 。
19、TF5/TF3/TF1 46 1. Side Pad R Assembly, Side Pad L Assembly (Time required: About 1 minute each) 1-1 Side Pad R Assembly : 1-1-1 Remove the two (2) screws marked 80A. The side pad R assembly can then b。
