Panasonic-SABTX70E-htss-sm 电路图 维修手册.pdf
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1、 Panasonic Corporation 2009. All rights reserved. Unauthorized copying and distribution is a violation of law. PSG0905004CE Blu-ray Disc Home Theater Sound System Model No.SA-BTX70EB SA-BTX70EG SA-BTX68EF Vol.1 Product Color: (K).Black Type TABLE OF CONTENTS PAGEPAGE 1 Safety Precautions- 4 1.1. GEN
2、ERAL GUIDELINES- 4 1.2. Before Repair and Adjustment- 4 1.3. Protection Circuitry- 4 1.4. Safety Parts Information-6 2 Warning -7 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices-7 Notes: These models BD Drive/Digital P.C.B. Module are - RFKNBTX70EB (For EB);
3、- RFKNBTX70EG (For EG); - RFKNBTX68EF (For EF) Caution: Pairing of BD Mechanism and Digital P.C.B. as “BD Mechanism/Digital P.C.B. Kit Assembly” have to be replaced together. If the either BD Mechanism or Digital P.C.B. is changed, BD Mechanism unit has to be re-aligned. Because the alignment data f
4、or BD Mechanism is stored in Digital P.C.B. RadioFans.CN 收音机爱 好者资料库 2 2.2. Precaution of Laser Diode -8 2.3. Service caution based on Legal restrictions-9 2.4. Handling Precautions for Traverse Unit -10 3 Service Navigation-12 3.1. Service Information-12 4 Specifications-13 5 Location of Controls an
5、d Components-15 5.1. Remote Control Key Button Operations-15 5.2. Main Unit Key Button Operations -16 5.3. Speaker Connections -17 5.4. Connections to a Set Top Box, etc.-18 5.5. Network connection-19 5.6. Media Information (Disc, SD Card and USB device) -20 5.7. Using the iPod -24 5.8. Using BD-LIV
6、E or BONUSVIEW in BD-Video -26 6 Operating Instructions -27 6.1. Door Assembly Unit Jam-27 7 Self-Diagnosis and Special Mode Setting -28 7.1. Service Mode Summary Table-28 7.2. Special Mode Setting-31 7.3. Service Mode at glance -33 8 Service Fixture TL1 37REX1381BLACK WIRE (SMPS-AC);TL2 91RFKNBTX70
7、EBBD MECHANISM / DIGITAL P.C.BEB 91RFKNBTX70EGBD MECHANISM / DIGITAL P.C.BEG 91RFKNBTX68EFBD MECHANISM / DIGITAL P.C.BEF A2K2CQ2CA00007AC CORDEG/EF A2K2CZ3YY00005AC CORDEB A3RQT9464-BO/I BOOK (En)EB/EG A3RQT9465-DO/I BOOK (Fr)EG A3RQT9466-EO/I BOOK (It/Ge)EG A3RQT9467-HO/I BOOK (Sp/Du)EG A3RQT9468-J
8、O/I BOOK (Da/Sw)EG A3RQT9469-RO/I BOOK (Ru/Ur)EG A3RQT9488-DO/I BOOK (Fr)EF PCB3REP4522ASMPS P.C.B(RTL) PCB20REP4522AAC INLET P.C.B(RTL) IC51001RFKB4520AIC IC51301RFKB4520AIC IC51601RFKB4520AIC DZ5701ERZV10V511CSZNR L5701ELF15N035ANLINE FILTER L5702ELF21N010ALINE FILTER T5701ETS42BM1F6ACMAIN TRANSFO
9、RMER T5751ETS19AB2A6AGBACKUP TRANSFORMER T7001G4D1A0000117SWITCHING TRANSFORMER T51601J0MAB0000200FILTER PC5702B3PBA0000402PHOTO COUPLER PC5720B3PBA0000402PHOTO COUPLER PC5799B3PBA0000402PHOTO COUPLER RY701K6B1AEA00003RELAY F1K5D312BLA015FUSE F2K5G162B00016FUSE IP7001K5H7512A0010PROTECTOR IP55004K5H
10、252Z00003PROTECTOR IP55005K5H202Z00005PROTECTOR IP58301ERBSE3R00UPROTECTOR TH5702D4CAA5R10001THERMISTOR P5701K2AA2B000017AC INLET C5700F1BAF22200232200pF C5701ECQU2A104MLC0.1uF C5702ECQU2A104MLC0.1uF C5704F1BAF10200201000pF C5705F1BAF101A013100pF 7 2Warning 2.1.Prevention of Electrostatic Discharge
11、(ESD) to Electrostatic Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec- trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors
12、 and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by tou
13、ching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly o
14、n a conductive surface such as alumi- num foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-stati
15、c (ESD protected)” can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are rea
16、dy to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara- ble conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
17、 to the chassis or circuit assembly into which the device will be installed. Caution: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the br
18、ushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf- ficient to damage an ES device). 8 2.2.Precaution of Laser Diode Caution: This product utilizes a laser diode with the unit turned “on”, invisible laser radiation is em
19、itted from the pickup lens. Maximum output radiation power from pickup: 100 W/VDE Laser radiation from the pickup unit is safety level, but be sure the followings: 1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resistor on
20、the pickup unit. It was already adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend not to look at pickup lens for a long time. 9 2.3.Service caution based on Legal restrictions 2.3.1.General description about Lead Free Solder (PbF) The lead free solder has been used i
21、n the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn)
22、, silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used when re
23、pairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cleanly f
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