JBL-SG3030-cs-psm 电路图 维修手册.pdf

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1、 Soundgear Series SG2020 SG3030 3 CD Changer Hi-Fi System PRELIMINARY SERVICE MANUAL JBL Incorporated, Inc. 250 Crossways Park Dr. Woodbury, New York 11797 RadioFans.CN 收音机爱 好者资料库 CONTENTS SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 ESD PRECAUTIONS . . . . . . .

2、. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 ADJUSTMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 TROUBLESHOOTING GUIDE. . . . . . . . . . . . . . .

3、 . . . . . . . . . . . . . . .9 WAVEFORMS OF MAJOR CHECK POINTS . . . . . . . . . . . . . . . . . .14 WIRING DIAGRAM (SG2020). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 WIRING DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 BLOCK DIAGRAM (SG2020) .

4、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 BLOCK DIAGRAM (SG3030). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 SCHEMATIC DIAGRAMS (SG2020/3030). . . . . . . . . . . . . . . . . . . . .19 PCB BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5、. . . . . . . . .35 PACKAGE PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . . . .40 MECHANICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . .40 ELECTRICAL PARTS LIST (SG2020). . . . . . . . . . . . . . . . . . . . . . . .43 PACKAGE PARTS LIST (SG3030). . . . . . .

6、. . . . . . . . . . . . . . . . . . .54 MECHANICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . .54 ELECTRICAL PARTS LIST (SG3030). . . . . . . . . . . . . . . . . . . . . . . .57 RadioFans.CN 收音机爱 好者资料库 -3- SERVICING PRECAUTIONS NOTES REGARDING HANDLING OF THE PICK-UP 1. Notes for

7、 transport and storage 1) The pick-up should always be left in its conductive bag until immediately prior to use. 2) The pick-up should never be subjected to external pressure or impact. 2. Repair notes 1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic mat

8、erials. 2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board. 3) Each and every pick-up is already i

9、ndividually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched. 4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part

10、(lens, etc.) of the pick-up if it is damaged. 5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot- ton swab shou

11、ld be used, taking care not to distort this. 6) Never attempt to disassemble the pick-up. Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of

12、 this alcohol on the swab, and do not allow the alcohol to get inside the pick-up. Storage in conductive bag NEVER look directly at the laser beam, and dont let contact fingers or other exposed skin. Magnet How to hold the pick-up Conductive Sheet Cotton swab Pressure Pressure Drop impact RadioFans.

13、CN 收音机爱 好者资料库 -4- NOTES REGARDING COMPACT DISC PLAYER REPAIRS 1. Preparations 1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These compo- nents are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, compon

14、ents can be damaged, and for that reason components should be handled with care. 2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnetism is p

15、resent, or where there is excessive dust. 2. Notes for repair 1) Before replacing a component part, first disconnect the power supply lead wire from the unit 2) All equipment, measuring instruments and tools must be grounded. 3) The workbench should be covered with a conductive sheet and grounded. W

16、hen removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.) 4) To prevent AC leakage, the metal part of the soldering iron should be grounded. 5) Workers should be grounded by an armband (1M)

17、 6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband. 7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin. CLEARING MALFUNCTION You can

18、 reset your unit to initial status if malfunction occur(button malfunction, display, etc.). Using a pointed good conductor(such as driver), simply short the RESET jump wire on the inside of the volume knob for more than 3 seconds. If you reset your unit, you must reenter all its settings(stations, c

19、lock, timer) NOTE: 1. To operate the RESET jump wire, pull the volume rotary knob and release it. 2. If you wish to operate the RESET jump wire, it is necessary to unplug the power cord. Resistor (1 Mohm) VOLUME UP DOWN VOLUME KNOB RESET jump wire Conductive Sheet Resistor (1 Mohm) Armband -5- ESD P

20、RECAUTIONS Electrostatically Sensitive Devices (ESD) Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components com- monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir- cuits and some field-effect

21、transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on y

22、our body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ESD devices, p

23、lace the assembly on a conductive sur- face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices. 4. Use only an anti-static solder removal device. Some solder removal devices not class

24、ified as anti-static can generate electrical charges sufficient to damage ESD devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices. 6. Do not remove a replacement ESD device from its protective package until immediately before you a

25、re ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials). 7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective m

26、aterial to the chassis or circuit assembly into which the device will by installed. CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER SAFETY PRECAUTIONS. 8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion such a

27、s the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen- erate static electricity sufficient to damage an ESD device). -6- SPECIFICATIONS SECTIONSG2020SG3030 AMP Output Power65W+65W (6, 2ch, T.H.D 10%)30W+30W (6, 2ch, T.H.D 10%) Woofer60W+60W (6, 2ch,

28、 T.H.D 10%) Frequency Response(MAIN)4025,000 Hz20025,000 Hz Frequency Response(Woofer)45120 Hz Signal-to-Noise Ratio83dB83dB Tuner FM Tuning Range(OPTICAL)87.5 108 MHz87.5 108 MHz Intermediate Frequency10.7 MHz10.7 MHz Signal-to-Noise Ratio61/58 dBA61/58 dBA (Mono/Stereo, 98MHz) Frequency Response60

29、10,000 Hz20010,000 Hz AM(MW) Range(OPTICAL)5221,611 kHz or 5301,720 kHz5221,611 kHz or 5301,720 kHz Intermediate Frequency450 kHz450 kHz Frequency Response1002,000 Hz2002,000 Hz SW(OPTICAL) Tuning Range5.818.0 MHz5.818.0 MHz Intermediate Frequency450 kHz450 kHz Signal-to-Noise Ratio(11MHz)35 dB35 dB

30、 3 LW(OPTICAL) Tuning Range153281 kHz153281 kHz Intermediate Frequency450 kHz450 kHz Signal-to-Noise Ratio(11MHz)28 dB28 dB CASSETTE DECK FF, REW Time (C-60)120 sec.120 sec. Frequency Response1258,000 Hz25018,000 Hz Signal-to-Noise Ratio43dB(P/B), 43dB(R/P)43dB(P/B), 43dB(R/P) Channel Separation50dB

31、(P/B), 45dB(R/P)50dB(P/B), 45dB(R/P) CD Frequency Response4018,000 Hz2008,000 Hz Signal-to-Noise Ratio70 dB70 dB GENERAL Power RequirementsRefer to the back panel of the unit.Refer to the back panel of the unit. Net Dimensions(WxHxD)273 x 326 x 344 mm273 x 326 x 344 mm Net Weight? kg? kg Speaker Sys

32、tem TypeBass Reflex 2 Way Bi AMP 3 Speaker System(Main Speaker, Super Woofer) 3 Speaker System Impendance66 Frequency Response(MAIN)6020,000 Hz14020,000 Hz Sound Pressure Level(MAIN)85 dB/W(1m)90 dB/W(1m) Rated Input Power(MAIN)65 W30 W Rated Input Power(SUPER WOOFER)60 W Max. Input Power(MAIN)130W6

33、0 W Max. Input Power(SUPER WOOFER)120 W Net Dimensions(WxHxD)220 x 326 x 252 mm220 x 372 x 252 mm Net Weight? kg? kg : EUROPE : UL NOTE: Designs and specification are subject to change without notice for improvement. -7- ADJUSTMENTS This set has been aligned at the factory and normally will not requ

34、ire further adjustment. As a result, it is not recommended that any attempt is made to modificate any circuit. If any parts are replaced or if anyone tam- pers with the adjustment, realignment may be necessary. IMPORTANT 1. Check Power-source voltage. 2. Set the function switch to band being aligned

35、. 3. Turn volume control to minimum unless otherwise noted. 4. Connect low side of signal source and output indicator to chassis ground unless otherwise specified. 5. Keep the signal input as low as possible to avoid AGC and AC action. TAPE DECK ADJUSTMENT 1. AZIMUTH ADJUSTMENT 2. NORMAL SPEED ADJUS

36、TMENT Deck Mode A Deck PlaybackMTT-114Speaker Out DECK Screw Azimuth Screw Maximum B Deck PlaybackMTT-114Speaker OutAzimuth ScrewMaximum Test TapeTest PointAdjustmentAdjust for Deck Mode Normal SpeedMTT-111Speaker OutVR2013kHz 1% Hi-SpeedMTT-111Speaker Outmore than 5.4kHz A Deck Hi-Speed Dubbing Mod

37、e Test TapeTest PointAdjustmentAdjust forRemark CH1 CH2 Speaker Out Playback Mode Head Test Tape MTT-114 L ch R ch GND Dual-trace synchroscope Electronic Voltmeter L out R out Unit Figure 1. Azimuth Adjustment Connection Diagram Head Playback Mode Unit Speaker Out GND L out R out Record/Playback hea

38、d Test Tape MTT-111 Frequency Counter Figure 2. Normal Speed Adjustment Connection Diagram 3. RECORD BIAS ADJUSTMENT 4. TUNER ADJUSTMENT -8- Deck Mode Rec/PauseMTT-5511 ERASE HEAD WIRE(PN402) L201 60kHz5kHz (Auto-stop) 85kHz5kHz (Auto-Reverse) Test TapeTest PointAdjustmentAdjust for Item DC VoltageC

39、hecker PinTP101, 1020V50mV Test PointAdjustmentAdjust for Head Unit PN402 GNDRecord/Playback head Test Tape MTT-5511 Record/Playback and Pause Mode Frequency Counter Figure 3. Record Bias Adjustment Connection Diagram Unit Signal Generator GND Electronic OSCILLOSCOPE FM Antenna TerminalSpeake Figure

40、 4. Tuner(S curve) Adjustment Connection Diagram -9- TROUBLESHOOTING GUIDE Turn power on. Is power on? Does initial read work? Does it play? Does it output audio? Check power supply circuit. (Check PN 807) Check laser circuit. Check focus circuit. Check disc. Check tracking servo circuit. Check audi

41、o circuit. OK YES YES YES YES NO NO NO NO Fails to initial read -10- 1.3V A B YES YES YES YES YES YES YES YES NO NO NONONONO NO NO NO NO Does laser light? Disc motor turns. Does RF waveform appear? TP 801(RF) Does tracking servo work? Lower envelope of TP801(RF) waveform is flat. Does signal appear

42、at TP801(TEO)? Does signal appear at IC 803 Pin and Pin ? Does GFS (IC802 pin ) show as below? Is rotation normal? Is there no dropout of RF signal? Does TE2 signal appear at pin53 of IC801? Defective IC 801, pick up and/or open wire. Detective pattern. Defective IC 801 and/or IC 803 Defective pick-

43、up and/or connector. Defective IC 801. Scratch in disc initial read area. Defective pick-up adjustment focus offset. 2627 25 -11- A NO NO NO NO NO NO Laser does not light. Is “3.5V” applied to pin of IC 801? Is power supplied to laser Q801? (Q 801 collector: about 1.8V) Does laser current flow? 1.0V

44、 across R801 Is data transferred from MICOM IC ? Does voltage appear at IC 803 pin , ? Defective MICOM. Defective MICOM. Defective connector. Defective IC 801, 803 Defective slide motor and/or connector. Defective LMT SW and/or connector. Defective Q 801 and/or laser. Defective laser and/or connecto

45、r. Did pickup return to innermost circular? Does it stop at inner pick circular after shift? Is defect output from LM SW applied to pin of PN803? R8011.0V R8011.0V YES YES YES YES OPENCLOSE YES YES YES YES YES YES 70 1112 2 -12- B C Does lens move up/down? Does IC 801 out focus search signal? IC 801

46、 pin (FEO) Is focus search signal applied to pin , of CN801? Laser lights. Confirm initial read with disc Defective IC801 Defective IC803 Defective IC 801. Open activator and/or connector. Open connector and/or defective IC 801. Incorrect turntable height. Degraded laser diode. Does TP 801 RF signal

47、 appear even in low level? Is laser output adjustment correct? Does FOK(focus ok) signal appear? YES YES YES YES YES YES TP801 (RF) IC801 pin (FOK) NONO NO NO NO NO 48 1316 40 -13- FER ISTAT(SENSE) C Start mode Does FE1 signal appear? IC 801 pin Does FZC signal (focus zero cross signal) appear at pi

48、n of IC 801, ISTAT (SENSE) terminal? Does SMON signal appear at pin of IC 802? Does SMPO signal appear at pin of IC 802? Is drive voltage applied to disk motor? Defective IC 801. Open pick diode Defective IC 801. Defective Pattern between IC 801 and IC 802. Defective IC 801, 803 and/or peripheral ci

49、rcuit. Defective disk motor and/or insulation. (Focus servo turns ON by FZC signal of FOK mod.) NO NO NO NO YES YES YES YES YES 59 31 73 75 -14- WAVEFORMS OF MAJOR CHECK POINT 1. HF signal (RF signal ) waveform (Test Point TP801) during normal play 2. EFM signal (pin IC 801)waveform during Normal Play 0V0V 3. Focus coil drive waveform(Pin NO 1, 2 of IC 803) When focus search failed or there is no disc on the tray 3. Focus coil drive waveform(Pin NO , of IC 803) Focus coil drive waveform(pin NO 1, 2 of IC803) and FOK (pin