Philips-FWM-35-Service-Manual电路原理图.pdf
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1、CLASS 1LASER PRODUCTServiceServiceServiceFWM35/21/21M/22/30Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The NetherlandsAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system ortransmitted, in any form or by any means, electronic, mechanical, p
2、hotocopying, or otherwisewithout the prior permission of Philips.Published by SL0509 Service Audio Printed in The Netherlands Subject to modification.GB3141 785 30140Mini SystemTABLE OF CONTENTSPageLocation of PC Boards.1-2Versions Variation fr Reparaturen sind Original-Ersatzteile zu verwenden.ILe
3、norme di sicurezza esigono che lapparecchio venga rimessonelle condizioni originali e che siano utilizzati i pezzi di ricambioidentici a quelli specificati.“After servicing and before returning set to customer perform aleakage current measurement test from all exposed metal parts toearth ground to a
4、ssure no shock hazard exist. The leakage currentmust not exceed 0.5mA.“CLASS 1LASER PRODUCT3122 110 03420GB Warning !Invisible laser radiation when open.Avoid direct exposure to beam.S Varning !Osynlig laserstrlning nr apparaten r ppnad och sprrenr urkopplad. Betrakta ej strlen.SF Varoitus !Avatussa
5、 laitteessa ja suojalukituksen ohitettaessa olet alttiinankymttmlle laseristeilylle. l katso steeseen!DK Advarse !Usynlig laserstrling ved bning nr sikkerhedsafbrydere erude af funktion. Undg udsaettelse for strling.1-7INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from
6、 1.1.2005 onwards. IDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N: Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So fr
7、om 0501 onwards = from 1 Jan 2005 onwards Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have
8、 to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because
9、paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different application
10、s. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-ou
11、t of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clea
12、n carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-r
13、ecognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening
14、, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-al
15、loy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you find more information to: a11BGA-de-/soldering (+ baking instructions) a11Heating-profiles of BGAs and other ICs used in
16、 Philips-sets You will find this and more technical information within the magazine, chapter workshop news. For additional questions please contact your local repair-helpdesk. SERVICE INSTRUCTION 1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.2. Set the AC P
17、ower switch to the “on“ position (keep theAC Power cord unplugged!).3. Measure the resistance value between the pins of the AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be larger than 4.5 Mohm(For U.S. it should be between 4.2 Mohm and 12
18、 Mohm.4. Switch “off“ the set, and remove the wire between the two pins of the AC Power plug.Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention tothe following points: Route the wire trees correctly and fix them with themou
19、nted cable clamps. Check the insulation of the AC Power lead for externaldamage. Check the strain relief of the AC Power cord for proper function. Check the electrical DC resistance between the AC PowerPlug and the secondary side (only for sets which have a ACPower isolated power supply): Check the
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