Technics-SLC-700-E-Service-Manual电路原理图.pdf
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1、 Panasonic Corporation 2015. All rights reserved. Unauthorized copying and distribution is a violation of law. ORDER NO.PSG1502003CE Compact Disc Player Model No.SL-C700E Product Colour: (S) . Silver Type RadioFans.CN 收音机爱 好者资料库 2 TABLE OF CONTENTS PAGEPAGE 1 Safety Precautions -3 1.1. General guide
2、lines-3 2 Warning -4 2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices-4 2.2. Service caution based on legal restrictions-5 2.3. Precaution of Laser Diode -6 2.4. Handling Precaution for CD DRIVE UINT(Optical Pickup)-7 3 Specifications-8 4 Location of Controls
3、and Components-9 5 Troubleshooting Guide- 11 5.1. Check the problem is reproduced- 11 5.2. No power-12 5.3. LED does not illuminate -17 5.4. No buzzer -17 5.5. Remote control does not operate -17 5.6. No Display -18 5.7. No CD operation-19 5.8. Connector pin configuration -20 5.9. Blocks related to
4、each function-21 6 Disassembly and Assembly Instructions-22 6.1. PCB layout drawing-23 6.2. Removing the disc when the disc cannot be removed using the opening-closing button -25 6.3. Disassembly flow chart -26 6.4. SET LEG UNIT -27 6.5. TOP AL PANEL-27 6.6. TOP CABINET BLOCK-27 6.7. SIDE PANEL (R),
5、 SIDE PANEL (L), TOP PANEL -27 6.8. FRONT PANEL UNIT -28 6.9. TOUCH SENSOR PCB, PICT LIGHTING WINDOW-28 6.10. DISPLAY PCB, OLED ASSY-28 6.11. IR PCB, MAIN SWITCH PCB-29 6.12. FRONT PANEL ASSY -29 6.13. BELT LOADING -29 6.14. CD MECHA BLOCK, DOOR -29 6.15. SPRING, CD LOADING UNIT -30 6.16. INSULATOR,
6、 CD DRIVE UNIT-30 6.17. REAR PANEL-30 6.18. MAIN PCB -31 6.19. SOFTWARE IN 1 PCB, SOFTWARE IN 2 PCB-31 6.20. CD MECHA DRIVE PCB-31 6.21. PS PCB-32 6.22. AC INLET PCB -32 7 Dimensions -33 8 Block Diagram -34 9 Wiring Connection Diagram-35 RadioFans.CN 收音机爱 好者资料库 3 1Safety Precautions 1.1.General guid
7、elines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly inst
8、alled. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards. 1.1.1.Leakage current cold check 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between
9、 the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the cha
10、ssis, the reading must be . 1.1.2.Leakage current hot check (See Figure 1.) 1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set an
11、d a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and rep
12、eat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliampere. In case a measurement is outside of the limits specified
13、, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer. Figure 1 4 2Warning 2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged ea
14、sily by static electricity. Such components commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand semiconductor chip components. The following techniques should be used to help reduce the incidence of co
15、mponent damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
16、 which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembl
17、y. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static (ESD protected) can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled che
18、micals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive f
19、oam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to th
20、e chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricit
21、y sufficient to damage an ES device). 5 2.2.Service caution based on legal restrictions 2.2.1.General description about Lead Free Solder (PbF) The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering
22、the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more tha
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