sony_MZ-E501_service_manual 维修电路图.pdf
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1、MZ-E501 AEP Model Hong Kong Model SERVICE MANUAL PORTABLE MINIDISC PLAYER Ver 1.2 2001. 12 With SUPPLEMENT-1 Model Name Using Similar MechanismMZ-E500 MD Mechanism TypeMT-MZE500-174 Optical Pick-up Mechanism TypeLCX-4E US and foreign patents licensed from Dolby Laboratories Licensing Corporation SPE
2、CIFICATIONS Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs Wavelength: = 790 nm Emission duration: continuous Laser output: less than 44.6 W* * This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up
3、 block with 7 mm aperture. Revolutions Approx. 300 rpm to 2,700 rpm Error correction ACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3: LP2 ATRAC3: LP4 Modulation system EFM (Eight to Fourteen Modulation) Number o
4、f channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limits Outputs Headphones/earphones: stereo mini-jack, maximum output level 5 mW + 5 mW, load impedance 16 ohms Power requirements Nickel Cadmium rechargeable battery One NC-6WM (
5、supplied): 1.2V, 600 mAh One LR6 (size AA) battery (not supplied) External power jack: Power rating 3V DC AC power adaptor for the battery charging stand (supplied): AC230240V, 50Hz Battery operation time See “When to replace or recharge the battery” Dimensions Approx. 74.5 80.5 17.9 mm (w/h/d) (3 3
6、 1/4 23/32 in.) (not including projecting parts and controls) Mass Approx. 80 g (2.8 oz) (the player only) Supplied accessories Headphones/earphones with a remote control (1) Battery charging stand (assembly needed)(1) AC power adaptor* Rechargeable battery (1) Rechargeable battery carrying case (1)
7、 Dry battery case (1) Carrying pouch (1) AC plug adaptor (1) (world model only) US and foreign patents licensed from Dolby Laboratories. Design and specifications are subject to change without notice. Sony Corporation Personal Audio Company Published by Sony Engineering Corporation 9-873-162-03 2001
8、L1600-1 2001.12 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MZ-E501 1. SERVICING NOTE 3 2. GENERAL 4 3. DISASSEMBLY 3-1. Case Assy, Holder Assy 5 3-2. Mechanism Deck 6 3-3. Bracket Assy 6 3-4. Main Board 7 3-5. Optical Pick-up Assy (LCX-4E) 7 4. TEST MODE 8 5. ELECTRICAL ADJUSTMENTS 12 6. DIAGRAMS 6-1. Block Di
9、agram 17 6-2. Printed Wiring Board Main Section (Side A) 18 6-3. Printed Wiring Board Main Section (Side B) 19 6-4. Schematic Diagram Main Section (1/3) 20 6-5. Schematic Diagram Main Section (2/3) 21 6-6. Schematic Diagram Main Section (3/3) 22 6-7. IC Block Diagrams 23 6-8. IC Pin Function Descrip
10、tion 25 7. EXPLODED VIEWS 7-1. Main Section 31 7-2. Mechanism Deck Section 32 8. ELECTRICAL PARTS LIST 33 Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 tim
11、es). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Unleaded solder Boards requiring use of unleaded solder are p
12、rinted with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature ab
13、out 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heat
14、ed tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded so
15、lder may also be added to ordinary solder. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS M
16、ANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MZ-E501 * Replacement of CXD2671-205GA (IC601) used in this s
17、et requires a special tool. When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S809). SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTIC
18、AL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use t
19、he procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lo
20、se your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-4E) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down suffi
21、ciently before the operation. The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD laser-tap Open/Close detection switch (S809) 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-E501 SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS N . VOL+/ GROUP x x X 1N VOL+ VO
22、L . 3 Color Info-LED ./N VOL +/ HOLD DISPLAYSOUND PLAYMODERPT/ENT x GROUP HOLD 3 Color Info-LED This section is extracted from instruction manual. 5 MZ-E501 r Disassemble the unit in the order as shown below. Note : Follow the disassembly procedure in the numerical order given. 3-1. CASE ASSY, HOLDE
23、R ASSY SECTION 3 DISASSEMBLY Optical pick-up assy (LCX-4E) Mechanism deckCase assy, Holder assySetBracket assyMAIN board case assy 1 screws (1.4), MI 3 Move it away from the projection case (rear) hold assy 2 1 screws (1.4), MI 3 Move it away from the projection 6 MZ-E501 3-3. BRACKET ASSY 3 screw (
24、1.7) 1 screw (1.7) 2 bracket (R) assy 4 bracket (L) assy 3-2. MECHANISM DECK 4 mechanism deck 1 step screw (MD) 5 OP FLEXIBLE board (CN501) 6 MOTER FLEXIBLE board (CN551) 3 claw 2 claw 3 claw 7 MZ-E501 3-4. MAIN BOARD 3-5. OPTICAL PICK-UP ASSY (LCX-4E) case (rear) 3 battery case lid 2 claw 5 Remove
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