sony_MZ-E900_service_manual 维修电路图.pdf
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1、Ver 1.1 2001.01 MZ-E900 SERVICE MANUAL PORTABLE MINIDISC PLAYER SPECIFICATIONS US Model Canadian Model AEP Model UK Model E Model Tourist Model Model Name Using Similar MechanismNEW MD Mechanism TypeMT-MZE900-173 Optical Pick-up Mechanism TypeLCX-4E US and foreign patents licensed from Dolby Laborat
2、ories Licensing Corporation System Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs Wavelength: l = 790 nm Emission duration: continuous Laser output: less than 44.6 W* * This output is the value measured at a distance of 200 mm from the objective lens surfa
3、ce on the optical pick-up block with 7 mm aperture. Revolutions Approx. 300 rpm to 2,700 rpm Error correction ACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3: LP2 ATRAC3: LP4 Modulation system EFM (Eight to Four
4、teen Modulation) Number of channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limits Outputs Headphones/earphones: stereo mini-jack, maximum output level 5 mW +5 mW, load impedance 16 ohms Power requirements Nickel metal hydride rec
5、hargeable battery One NH-14WM(A) (supplied): 1.2V, 1,350 mAh (min) One LR6 (size AA) battery (not supplied) External power jack: Power rating 1.5V DC Battery operation time 1) 2) BatteriesStereo(normal)LP2 StereoLP4 Stereo Ni-MH rechargeable293337 battery NH-14WM (A) 1) LR6 (SG) Sony424958 alkaline
6、dry battery 3) LR6 (SG) Sony7687100 alkaline dry battery 3) and a Ni-MH rechargeable rechargeable battery 1) Unit:Approx. hours 1) With a fully charged battery 2) Measured in accordance with the EIAJ (Electronic Industries Association of Japan) standard (using a Sony MDW-series Mini-disc). 3) When u
7、sing a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Note The battery life may be shorter depending on operating conditions, the surrounding temperature, and the battery type. Dimensions Approx. 77.7 x 12.7 x 71.0 mm (w/h/d) (3 1/8 x 1/2 x 2 7/8 in.) (not including projecting par
8、ts and controls) Mass Approx. 58g (2.0 oz) (the player only) Supplied accessories Headphones/earphones with a remote control (1) Battery charger (1) (EXCEPT Korean MODEL) Rechargeable battery (1) Rechargeable battery carrying case (1) (Tourist MODEL) Dry battery case (1) Carrying pouch (1) (EXCEPT U
9、S MODEL) AC plug adaptor (1) (E33, Tourist model) Design and specifications are subject to change without notice. 9-927-992-12 2001A0200-1 2001.1 Sony Corporation Audio Entertainment Group General Engineering Dept. 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MZ-E900 Specifications . 1 1.SERVICING NOTE. 2 2.GENE
10、RAL Location and Function of Controls . 3 3.DISASSEMBLY 3-1. “Lid ASSY, Upper”, Holder ASSY . 4 3-2. Mechanism Deck . 4 3-3. Audio Board. 5 3-4. Bracket (L) ASSY, Bracket (R) ASSY . 5 3-5. Main Board, Bracket (L) ASSY, SW Board . 6 3-6. Optical Pick-up ASSY . 6 4.TEST MODE. 7 5.ELECTRICAL ADJUSTMENT
11、S.11 6.DIAGRAMS 6-1. Block Diagram. 15 6-2. Printed Wiring Boards Main Section (1/2) . 16 6-3. Printed Wiring Boards Main Section (2/2) . 17 6-4. Schematic Diagram Main Section (1/2) . 18 6-5. Schematic Diagram Main Section (2/2) . 19 6-6. Printed Wiring Boards Audio Section . 20 6-7. Schematic Diag
12、ram Audio Section . 21 7.EXPLODED VIEWS 7-1. Front Section . 25 7-2. Mechanism Deck Section . 26 8.ELECTRICAL PARTS LIST. 27 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REP
13、LACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit
14、board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS SECTION 1 SERVICING NOTE
15、 When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S809). * Replacement of CXD2671-201GA (IC601) used in this set requires a special tool.
16、 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Open/Close detection switch (S809) Mechanism deck section r UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead-free mark (
17、LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary sold
18、er. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, s
19、o be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinar
20、y solder. Ver 1.1 2001.01 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MZ-E900 SECTION 2 GENERALThis section is extracted from instruction manual. Ver 1.1 2001.01 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-E900 SECTION 3 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 3-1. “LID ASSY, UP
21、PER”, HOLDER ASSY 3-2. MECHANISM DECK r The equipment can be removed using the following procedure. Optical pick-up ASSY Set “Lid ASSY, Upper”, Holder ASSY Mechanism deck Audio board Main board, Bracket (L) ASSY, SW board Bracket (R) ASSY 1 Screws (MI 1.4) Panel, bottom 4 Bracket (stop) ASSY Holder
22、ASSY 3 Move it away from projection 3 Move it away from projection 1 Screws (MI 1.4) 2 Lid ASSY, upper 1 Screws (MD), step Panel, bottom 6 Motor flexible board 7 OP flexible board 4 Claw 2 5 3 Mechanism deck 5 MZ-E900 3-3. AUDIO BOARD 3-4. BRACKET (R) ASSY Panel, bottom 2 CN801 1 Switch flexible boa
23、rd Audio board 1 Screws (MI 1.4) 2 Screws (MI 1.4) 3 Bracket (R) ASSY Panel, bottom Ver 1.1 2001.01 6 MZ-E900 Panel, bottom Main board 6 Remove solder 2 Lid, battery case 1 Claw 5 3 7 8 Bracket (L) ASSY Knob (AVLS) SW board Knob (HOLD) Knob (open) 4 Screw (MI 1.4) 3 Screw (MI 1.4) 4 Spring, thrust d
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