sony_MZ-E75_service_manual 维修电路图.pdf
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1、Ver 1.1 2000.01 MICROFILM MZ-E75 SERVICE MANUAL PORTABLE MINIDISC PLAYER SPECIFICATIONS US Model AEP Model UK Model Australian Model E Model Tourist Model Model Name Using Similar MechanismNEW MD Mechanism TypeMT-MZE75-167 Optical Pick-up Mechanism TypeODX-1B US and foreign patents licensed from Dol
2、by Laboratories Licensing Corporation System Audio playing system Minidisc digital audio system Laser diode properties Material : GaAlAs Wavelength : =790nm Emission duration : continuous Laser output : less than 44.6 W* *This output is the value measured at a distance of 200 mm from the objective l
3、ens surface on the optical pick-up block with 7mm aperture. Revolutions 400 rpm to 900 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1kHz Coding Adaptive Transform Acoustic Coding (ATRAC) Modulation system EFM (Eight to Fourteen Modulation) Numb
4、er of channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Outputs Headphones : stereo mini-jack, maximum output level 5mW+5mW, load impedance 16 ohm General Power requirements Nickel metal hydride rechargeable battery NH-14WM (
5、supplied) One LR6 (size AA) alkaline battery (not supplied) Sony AC Power Adaptor (not supplied) connected at the DC IN 1.5V jack Battery operation time BatteriesPlayback Ni-MHApprox. Rechargeable battery (NH-14WM)16 hours One LR6 (size AA)Approx. Sony alkaline batteries22 hours One LR6 (size AA) an
6、d aApprox. Ni-MH (NH-14WM)42 hours Ni-CDApprox. Rechageable battery (NC-6WM)8 hours One LR6 (size AA) and aApprox. Ni-CD (NC-6WM)32 hours Dimensions Approx. 86 x 16.3 x 75.4 mm (w/h/d) not including projecting parts and controls Mass Approx. 98 g the player only Approx. 141 g incl. a premastered MD
7、and a nickel metal hydride rechargeable battery NH-14WM (N) Supplied accessories Battery charger (1) Rechargeable battery (1) Rechargeable battery carrying case (1) Headphones with a remote control (1) Dry battery case (1) Carrying pouch (1) AC plug adaptor (E, Tourist model) (1) Design and specific
8、ations are subject to change without notice. 收音机爱好者资料库 Ra d i o Fa n s .CN 2 Specifications . 1 1.SERVICING NOTE. 2 2.GENERAL Location and Function of Controls . 3 3.DISASSEMBLY 3-1. Upper Panel ASSY, “Panel ASSY, Bottom” . 4 3-2. Belt, Ornamental. 4 3-3. Main Board . 5 3-4. Optical Pick-up Block AS
9、SY . 5 4.TEST MODE. 6 5.ELECTRICAL ADJUSTMENTS. 9 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN
10、 THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when
11、 soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. TABLE OF CONTENTS CAUTION Use of controls or adjustments or performance of procedures other than those specified here
12、in may result in hazardous radiation exposure. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. “MD WALKMAN” is a trademark of Sony Corporation. This Mini Disc p
13、layer is classi- fied as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior. 6.DIAGRAMS 6-1. Explanation of IC Terminals. 10 6-2. Block Diagram. 13 6-3. Printed Wiring Boards . 16 6-4. Schematic Diagram. 19 7.EXPLODED VIEWS 7-1. Main Section. 26 7-2. Mechanism
14、 Deck Section . 27 8.ELECTRICAL PARTS LIST. 28 SECTION 1 SERVICING NOTE When repairing this device with the power on, if you remove the main board, this device stops working. In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801). Mechanism
15、 deck section Open/Close detection switch (S801) * Replacement of CXD2661GA-2 (IC601) used in this set requires a special tool. Therefore, it cannot be replaced. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS Main Unit Headphones with Remote Control 1 i 1 jack 2
16、OPEN button 3 OPERATE indicator 4 B button 5 . button 6 x button 7 i 2 jack 1 Headphones 2 x button 3 B /. button 4 VOL +/ button 5 DISPLAY button 8 VOLUME + button 9 VOLUME button q; External battery terminal (+/) qa DIGITAL SOUND PRESET switch qs AVLS switch qd HOLD switch 2 7 3 1 6 4 q; qa? qs qd
17、 9 5 8 4 5698 321 7 6 PLAYMODE button 7 DISPLAY window 8 X button 9 HOLD . switch 收音机爱好者资料库 Ra d i o Fa n s .CN 4 SECTION 3 DISASSEMBLY Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER PANEL ASSY, “PANEL ASSY, BOTTOM” 3-2. BELT, ORNAMENTAL r The equipment can be remov
18、ed using the following procedure. Optical pick-up block ASSYsetUpper panel ASSY, “Panel ASSY, bottom”Belt, OrnamentalMain board 1 Screws (1.4) 3 Screw (1.7) Upper panel ASSY 6 Screws (1.4) 5 7 Claw 4 Claw 2 Press the OPEN button Main unit Panel ASSY, bottom Main unit Belt, ornamental 2 1 Move it awa
19、y from projection 5 3-3. MAIN BOARD 3-4. OPTICAL PICK-UP BLOCK ASSY 1 Screws (M1.4 toothed lock) 2 Screw (HP), step Main board Main unit 5 OP flexble board 3 CLV fexble board 4 3 Screw (M1.4) precision pan Shaft (Main) Chissis ASSY OP flexible board Optical pick-up block ASSY OP flexible board Doubl
20、e sided adhesive tape 2 1 5 6 4 Note :Put the OP flexible board to a correct position of chassis ASSY. 6 SECTION 4 TEST MODE Outline In this set, overall adjustment mode is made available by enter- ing test mode to perform automatic adjustment of CD and MO. In the overall adjustment mode, the disc i
21、s determined whether it is CD or MO and adjustments are performed in sequence. If a fault is found, the location of the fault is displayed. Also, in servo mode, each adjustment can be automatically made. Operation in the test mode is performed with the Remote Com- mander. A key having no particular
22、description in the text, indi- cates a Remote Commander key. Setting the Test Mode To enter the test mode, two methods are available : 1. Entering method with key input. Turn on the HOLD switch on the set. While holding down the x key on the set, press the following remote commander keys in the foll
23、owing order : B/ t B/ t . t . t B/ t .t B/ t . t X t X 2. Entering method by shorting the test point Solder bridge the test point TAP805 (TEST) on the main board (connect IC801 pin ed to GND), and turn on the POWER. MAIN BOARD (SIDE B) Releasing the Test Mode 1. When test mode was entered with key i
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