sony_MDS-JB940_service_manual 维修电路图.pdf
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1、MDS-JB940 US Model Canadian Model AEP Model UK Model SERVICE MANUAL MINIDISC DECK Model Name Using Similar MechanismNEW MD Mechanism TypeMDM-7A Optical Pick-up NameKMS-260B/J1N U.S and foreign patents licensed from Dolby Laboratories Licensing Corporation. SPECIFICATIONS Inputs Outputs SystemMiniDis
2、c digital audio system DiscMiniDisc LaserSemiconductor laser ( = 780 nm) Emission duration: continuous Laser outputMAX 44.6 W1) 1) This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture. Laser diodeMaterial: GaAlAs Re
3、volutions (CLV)400 rpm to 900 rpm Error correctionACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency44.1 kHz CodingATRAC (Adaptive TRansform Acoustic Coding)/ATRAC 3 Modulation systemEFM (Eight-to-Fourteen Modulation) Number of channels2 stereo channels Frequency response5 to 20,
4、000 Hz 0.3 dB Signal-to-noise ratioOver 100 dB during play Wow and flutterBelow measurable limit ANALOG INJack type: phono Impedance: 47 kilohms Rated input: 500 mVrms Minimum input: 125 mVrms DIGITAL OPTICAL IN1Connector type: square optical Impedance: 660 nm (optical wave length) DIGITAL OPTICAL I
5、N2Connector type: square optical Impedance: 660 nm (optical wave length) DIGITAL COAXIAL INJack type: phono Impedance: 75 ohms Rated input: 0.5 Vp-p, 20 % PHONESJack type: stereo phone Rated output: 28 mW Load impedance: 32 ohms ANALOG OUTJack type: phono Rated output: 2 Vrms (at 50 kilohms) Load im
6、pedance: over 10 kilohms DIGITAL OPTICAL OUT Connector type: square optical Rated output: 18 dBm Load impedance: 660 nm (optical wave length) DIGITAL COAXIAL OUT Jack type: phono Rated output: 0.5 Vp-p (at 75 ohms) Load impedance: 75 ohms General Power requirements Supplied accessories US and foreig
7、n patents licensed from Dolby Laboratories. Design and specifications are subject to change without notice. Where purchasedPower requirements U.S.A. and Canada120 V AC, 60 Hz Europe230 V AC, 50/60 Hz Power consumption18 W Dimensions (approx.)430 111 286 mm (17 43/8 113/8 in.) (w/h/d) incl. projectin
8、g parts and controls Mass (approx.)5.3 kg (11 lbs 11 oz) This MD deck comes with the following items: Audio connecting cords (2) Optical cable (1) Remote commander (remote) (1) R6 (size-AA) batteries (2) 收音机爱好者资料库 Ra d i o Fa n s .CN 2 After correcting the original service problem, perform the follo
9、wing safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all expose
10、d metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1.A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instru
11、ments. 2.A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3.Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage sca
12、le. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) SAFETY CHECK-OUT To Exposed Metal Parts on Set 0.15 F 1.5 k AC Voltmeter (0.75 V) Earth Ground Fig. A. Using an AC
13、 voltmeter to check AC leakage. TABLE OF CONTENTS MODEL IDENTIFICATION BACK PANEL Model AEP, UK models Canadian model US model Part No. 4-228-507-0s 4-228-507-1s 4-228-507-2s Part No. SELF-DIAGNOSIS FUNCTION 4 1. SERVICE NOTE6 2. GENERAL 11 3. DISASSEMBLY 14 4. TEST MODE 17 5. ELECTRICAL ADJUSTMENTS
14、 22 6. DIAGRAMS 6-1. Block Diagram MAIN Section 31 6-2. Block Diagram DISPLAY/POWER Section 32 6-3. Note for Printed Wiring Boards and Schematic Diagrams 33 6-4. Circuit Board Location 33 6-5. Waveforms 34 6-6. Printed Wiring Board BD Board 35 6-7. Schematic Diagram BD Board (1/2) 36 6-8. Schematic
15、Diagram BD Board (2/2) 37 6-9. Printed Wiring Board HP Board/KEY Board 38 6-10.Schematic Diagram HP Board/KEY Board 38 6-11.Schematic Diagram MAIN Board (1/3) 39 6-12.Schematic Diagram MAIN Board (2/3) 40 6-13.Schematic Diagram MAIN Board (3/3) 41 6-14.Printed Wiring Board MAIN Board (Side A) 42 6-1
16、5.Printed Wiring Board MAIN Board (Side B) 43 6-16.Printed Wiring Board PANEL Section 44 6-17.Schematic Diagram PANEL Section 45 6-18.Schematic Diagram AC Board 46 6-19.Printed Wiring Board AC Board 47 6-20.IC Block Diagrams 48 6-21.IC Pin Function Description 53 7. EXPLODED VIEWS 60 8. ELECTRICAL P
17、ARTS LIST 64 收音机爱好者资料库 Ra d i o Fa n s .CN 3 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THI
18、S MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PISES SONY DONT LES NUM
19、ROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPMENTS PUBLIS PAR SONY. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. The following caution label is located inside the unit. Laser component in this product is capable of emitt
20、ing radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side o
21、f a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when solder
22、ing or unsoldering. ADVARSEL Eksplosjonsfare ved feilaktig skifte av batteri. Benytt samme batteritype eller en tilsvarende type anbefalt av apparatfabrikanten. Brukte batterier kasseres i henhold til fabrikantens instruksjoner. VARNING Explosionsfara vid felaktigt batteribyte. Anvnd samma batterity
23、p eller en likvrdig typ som rekommenderas av apparattillverkaren. Kassera anvnt batteri enligt gllande freskrifter. VAROITUS Paristo voi rjht, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hvit kytetty paristo valmistajan ohjeiden mukaisesti.
24、 ADVARSEL! Lithiumbatteri-Eksplosionsfare ved fejlagtig hndtering. Udskiftning m kun ske med batteri af samme fabrikat og type. Levr det brugte batteri tilbage til leverandren. CAUTION Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended b
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