sony_MDS-B5_service_manual 维修电路图.pdf
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1、 1 MICROFILM US Model Canadian Model AEP Model UK Model SPECIFICATIONS Model Name Using Similar MechanismMDS-B3 MD Mechanism TypeMDM-2BL Base Unit TypeMBU-2BL Optical Pick-up TypeKMS-210A/J-N SERVICE MANUAL MD RECORDER MDS-B5 Continued on next page 收音机爱好者资料库 Ra d i o Fa n s .CN 2 收音机爱好者资料库 Ra d i o
2、Fa n s .CN 3 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. This caution label is located inside the unit. The laser component in this product is ca- pable of emitting radiation exceeding the limit for Class 1. CAUTION Use
3、of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Cir
4、cuit Board Repairing Keep the temperature of soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. ATTENTION AU COMPOSANT AYANT RAPPORT LA
5、 SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. SAFETY-RELATED
6、 COMPONENT WARNING ! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. SAFETY CHECK
7、-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC le
8、akage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a re- turn to chassis, must not exceed 0.5 mA (500 microampers). Leak- age current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229
9、or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digi- tal multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit”
10、 indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to chec
11、k AC leakage. To Exposed Metal Parts on Set 0.15F1.5k AC voltmeter (0.75V) Earth Ground 收音机爱好者资料库 Ra d i o Fa n s .CN 4 TABLE OF CONTENTS 4. ELECTRICAL ADJUSTMENTS 4-1.Precautions for Checking Laser Diode Emission.39 4-2.Precautions for Use of optical pickup (KMS-210A).39 4-3.Precautions for Adjustm
12、ents.39 4-4.Creating MO Continuously Recorded Disc.39 4-5.Temperature Compensation Offset Adjustment .40 4-6.Laser Power Adjustment .40 4-7.Traverse Adjustment.41 4-8.Focus Bias Adjustment .42 4-9.Error Rate Check .42 4-9-1. CD Error Rate Check.42 4-9-2. MO Error Rate Check .42 4-10. Focus Bias Chec
13、k .42 4-11. Adjusting Points and Connecting Points .43 5. DIAGRAMS 5-1.Circuit Boards Location . 44 5-2.Block Diagrams BD Section . 45 Digital Section. 47 Duplication Section . 49 Remote Section . 51 Power Section. 53 5-3.Printed Wiring Board BD Section . 54 5-4.Schematic Diagram BD Section . 57 5-5
14、.Schematic Diagram Digital Section . 62 5-6.Printed Wiring Board Digital Section . 67 5-7.Printed Wiring Board ETC Section . 70 5-8.Schematic Diagram ETC Section . 73 5-9.Schematic Diagram Audio/Power Section . 77 5-10. Printed Wiring Board Audio/Power Section . 81 5-11. Schematic Diagram Display Se
15、ction . 84 5-12. Printed Wiring Board Display Section . 87 5-13. IC Pin Functions IC101 RF Amplifier (CXA1981AR). 89 IC121 Digital signal processor, digital servo processor, EFM/ACIRC encoder/decoder (CXD2535CR) . 90 IC301 System Control (M30600E8FP). 93 IC401 Shock-Proof Memory Controller, ATRAC En
16、coder/Decoder (CXD2536CR) . 95 IC407 Shock-Proof Memory Controller, ATRAC Encoder/Decoder (CXD2536CR) . 97 IC409 Sampling Rate Converter (CXD8517Q) . 99 5-14. IC Block Diagrams. 100 6. EXPLODED VIEWS 6-1.Case and Front Panel Section . 111 6-2.Chassis Section . 112 6-3.Back Panel Section . 113 6-4.MD
17、 Mechanism Section (MDM-2BL) . 114 6-5.MD Base Unit Section (MBU-2BL). 115 7. ELECTRICAL PARTS LIST. 116 1. GENERAL 2-1.Front Panel . 5 2-2.Rear Panel. 6 2-3.Remote Controller . 7 3-2.Connections . 7 3-4.Setting the Analog Input and Output Reference Levels . 9 4-1.Selecting the Input Signal. 9 4-2.R
18、ecording Procedure . 10 4-3.Display Information During Recording . 10 4-4.Adding Disc and Track Titles. 11 4-5.Precedure for Direct ATRAC Data Copying . 11 4-6.Restrictions on Digital Copying . 12 5-1.Overview of Playback Procedures . 12 5-2.Playback Procedures. 13 5-3.Locating a Track . 14 5-4.Disp
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