SONY MZ-R701 维修电路图.pdf

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1、1 SERVICE MANUAL PORTABLE MINIDISC RECORDER Model Name Using Similar MechanismMZ-G750/R700 Mechanism TypeMT-MZR700-172 Optical Pick-up NameLCX-4R MD recorder Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs MQW Wavelength: = 790 nm Emission duration: continu

2、ous Laser output: less than 44.6 W (This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Recording and playback time When using MDW-80 Maximum 160 min. in monaural Maximum 320 min. in stereo Revolutions 350 rpm to 2,800 rpm

3、 (CLV) Error correction ACIRC (Advanced Cross Interleave Reed Solomon Code) Sampling frequency 44.1 kHz Sampling rate converter Input: 32 kHz/44.1 kHz/48 kHz Coding ATRAC (Adaptive TRansform Acoustic Coding) ATRAC3-LP2 ATRAC3-LP4 SPECIFICATIONS Modulation system EFM (Eight to Fourteen Modulation) Nu

4、mber of channels 2 stereo channels 1 monaural channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Inputs Microphone: stereo mini-jack, minimum input level 0.35 mV Line in: stereo mini-jack, minimum input level 49 mV Optical (Digital) in: optical (digital) mini- jac

5、k Outputs i: stereo mini-jack, maximum output level 5 mW + 5 mW, load impedance 16 ohm General Power requirements Sony AC Power Adaptor (supplied) connected at the DC IN 3 V jack: 240 V AC, 50 Hz (Australian model) 220 V AC, 50 Hz (EE, CH, AR model) 230-240 V AC, 50 Hz (HK model) 100-240 V AC, 50/60

6、 Hz (E model) Nickel cadmium rechargeable battery NC-WMAA (supplied) LR6 (size AA) alkaline battery (not supplied) Abbreviation EE: East European model CH: Chinese model HK: Hong Kong model AR: Argentine model Continued on next page US and foreign patents licensed from Dolby Laboratories. Ver 1.0 20

7、01. 01Ver 1.0 2002. 05 Sony Corporation Personal Audio Company Published by Sony Engineering Corporation 9-874-004-01 2002E0400-1 2002. 05 E Model MZ-R701/R701DPC Australian Model East European Model Chinese Model MZ-R701 MZ-R701/R701DPC 收音机爱好者资料库 Ra d i o Fa n s .CN 2 Flexible Circuit Board Repairi

8、ng Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a dis

9、connected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Battery life1)(Unit: approx.hours) (JEITA2) Batteries

10、StereoLP2LP4 NC-WMAA Nickel Cadmium Recording467.5 rechargeable battery3) Playback1314.518 LR6 (SG) Recording91316 Sony alkaline dry battery4) Playback404653 1) The battery life may be shorter due to operating conditions, the temperature of the location, and varieties of batteries. 2) Measured value

11、 by the standard of JEITA (Japan Electronics and Information Technology Industries Association). 3) When using a 100% fully charged rechargeable battery. 4) When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Dimensions Approx. 81 28.1 74.4 mm (w/h/d) without projections.

12、Mass Approx. 118 g the recorder only Supplied accessories NC-WMAA nickel cadmium rechargeable battery (1) AC power adaptor (1) Headphones/earphones with a remote control (1) Optical cable (1) Rechargeable battery carrying case (1) Carrying pouch/carrying case with a belt clip (1) Design and specific

13、ations are subject to change without notice. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THI

14、S MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. MZ-R701/R701DPC 收音机爱好者资料库 Ra d i o Fa n s .CN 3 1.SERVICING NOTE. 4 2.GENERAL Looking at the controls . 5 3.DISASSEMBLY 3-1. Bottom Panel Assy . 6 3-2. Upper Panel Assy . 7 3-3. LCD Module . 7 3-4. Main Board . 8 3-5. MD Mechanism Deck . 8 3-6. OP Servic

15、e Assy. 9 3-7. Holder Assy. 9 3-8. Motor Flexible Board . 10 3-9. DC Motor (M602) . 10 3-10. DC Motor (M601), DC Motor (M603) . 11 4.TEST MODE 4-1. Outline.12 4-2. Setting Method of Test Mode.12 4-3. Operation in Setting the Test Mode.12 4-4. Releasing the Test Mode .12 4-5. Configuration of Test Mo

16、de . 13 4-6. Manual Mode . 13 4-7. Overall Adjustment Mode . 14 4-8. Self-diagnosis Result Display Mode. 14 4-9. Result the Error Display Code . 15 4-10. Sound Skip Check Result Display Mode . 16 4-11. Key Check Mode.16 TABLE OF CONTENTS 5.ELECTRICAL ADJUSTMENTS 5-1. Outline.18 5-2. Precautions for

17、Adjustment .18 5-3. Adjustment Sequence . 18 5-4. NV Reset .18 5-5. Power Supply Manual Adjustment. 19 5-6. Temperature Correction. 20 5-7. Laser Power Check .20 5-8. Overall Adjustment Mode . 21 5-9. Mode Settings .23 5-10. Resume Clear . 23 6.DIAGRAMS 6-1. IC Pin Descriptions .24 6-2. Block Diagra

18、m Servo Section . 31 6-3. Block Diagram Audio Section .32 6-4. Block Diagram System Control/Power Section .33 6-5. Printed Wiring Board Main Section . 34 6-6. Schematic Diagram Main Section (1/3) .37 6-7. Schematic Diagram Main Section (2/3) .38 6-8. Schematic Diagram Main Section (3/3) .39 6-9. IC

19、Block Diagrams. 40 7.EXPLODED VIEWS 7-1. Panel Section. 42 7-2. Chassis Section . 43 7-3. MD Mechanism Deck Section .44 8.ELECTRICAL PARTS LIST.45 MZ-R701/R701DPC 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MZ-R701/R701DPC SECTION 1 SERVICING NOTE NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The las

20、er diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter

21、which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. NOTES ON HANDLING TH

22、E OPTICAL PICK-UP BLOCK (LCX-4R) The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration.

23、 The flexible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD In performing the repair with the power supplied to the set, removing the MAIN board causes the set to be disabled. In such a case, fix a convex part of the open/close detect switch (S806 on MAIN bo

24、ard) with a tape in advance. Handle the FLEXIBLE board (over write head) with care, as it has been soldered directly to the MAIN board. In repairing the component side of MAIN board, connect the FLEXIBLE board (over write head) and the MAIN board with the lead wires in advance. (See page 8) Replacem

25、ent of CXD2674-204GA (IC801) used in this set requires a special tool. On the set having the microcomputer version 1.000, some adjusted values were set in the manual mode at the shipment, but these data will be cleared when the NV is reset. Therefore, on the set having the microcomputer version 1.00

26、0, change the adjusted values following the Change of Adjusted Values immediately after the NV was reset. (See page 18) laser-tap S806 MAIN board FLEXIBLE board (Over write head) Tape upper panel assy 5 MZ-R701/R701DPC SECTION 2 GENERAL This section is extracted from instruction manual. 6 MZ-R701/R7

27、01DPC Note : This set can be disassemble according to the following sequence. SECTION 3 DISASSEMBLY 3-1. BOTTOM PANEL ASSY Note : Follow the disassembly procedure in the numerical order given. 6bottom panel assy 4claw 1 5 2MI screws (1.4x2.0) 3MI screws (1.4x2.0) 3-1.BOTTOM PANEL ASSY (Page 6) 3-2.U

28、PPER PANEL ASSY (Page 7) 3-4.MAIN BOARD (Page 8) 3-6.OP SERVICE ASSY (Page 9) SET 3-5.MD MECHANISM DECK (Page 8) 3-10. DC MOTOR (M601), DC MOTOR (M603) (Page 11) 3-8.MOTOR FLEXIBLE BOARD (Page 10) 3-3.LCD MODULE (Page 7) 3-7.HOLDER ASSY (Page 9) 3-9.DC MOTOR (M602) (Page 10) 7 MZ-R701/R701DPC 3-3. L

29、CD MODULE 1screws (1.7x2.5) 4LCD module claws upper panel (B) sub assy 2screws (1.7x2.5) 3 3-2. UPPER PANEL ASSY 2MI screws (1.4x2.0) 1MI screws (1.4x2.0) 3upper panel assy 4CN804 8 MZ-R701/R701DPC 3-5. MD MECHANISM DECK 2set chassis assy 3MD mechanism deck boss boss 1MI screws (1.4x1.6) 3-4. MAIN B

30、OARD 3screws (M1.4x2) 6Remove the solders. 7 9Remove the solder. q;battery case assy qsbattery coil spring qdMAIN board qaRemove the solder. 4screws (M1.7x3) 5screws (M1.4x2) 1CN502 2arm 8CN501 9 MZ-R701/R701DPC 3-7. HOLDER ASSY 3Remove the holder assy to direction of the arrow B. 1Open the holder a

31、ssy. A 2 B boss 3-6. OP SERVICE ASSY 4rack spring (s) 6thrust detent spring 3precision pan screw (M1.4) 5precision pan screw (M1.4) 1washer (0.8 - 2.5) 2gear (SA) 8Pull off the lead screw. 7 B A 9Opening the over write head toward the direction A, remove the OP service assy toward the direction B. N

32、ote: Do not open the entire assy forcibly, when opening the over write head. over write head section 10 MZ-R701/R701DPC 4two precision pan screws (M1.4) 5DC moter (sled) (M602) 3Remove four solders of motor flexible board. 1washer (0.8 - 2.5) 2gear (SA) 3-9. DC MOTOR (M602) 2Remove two solders of DC

33、 motor (over write head up/down) (M603). 1Remove four solders of DC motor (sled) (M602). 3Remove four solders of DC motor (spindle) (M601). DC motor (sled) circular hole 5motor flexible board 4adhesive sheet Note: Align a circular hole in the stripping paper with a circular hole in the DC motor (sle

34、d), when mounting the motor flexible board. 3-8. MOTOR FLEXIBLE BOARD 11 MZ-R701/R701DPC 1Remove six solders of motor flexible board. 4three precision pan screws (M1.4) qsDC moter (over write head up/down) (M603) 6two precision pan screws (M1.4) qagear chassis assy 0screw (M1.2 1.5) 9gear (HA) 8gear

35、 (HB) 7washer (0.8 - 2.5) 2washer (0.8 - 2.5) 3gear (HC) 5DC moter (spindle) (M601) DC motor (over write head up/down) (M603) gear chassis assy gear (HA) 2.65 mm Note: Press-fit the gear (HA) up to the position of the DC motor (over write head up/down) (M603) as shown below. 3-10. DC MOTOR (M601), D

36、C MOTOR (M603) 12 MZ-R701/R701DPC 2 In the normal mode, turn on the HOLD switch. While press- ing the VOL - key press the following order: tt.t.tt .t t.tXtX SECTION 4 TEST MODE 4-3. Operation in Setting the Test Mode When the test mode becomes active, first the display check mode is selected. Other

37、mode can be selected from the display check mode. When the test mode is set, the LCD repeats the following dis- play. When theXkey is pressed and hold down, the display at that time is held so that display can be checked. Caution: On the set having the microcomputer version 1.000, some adjusted valu

38、es were set in the manual mode at the shipment, but these data will be cleared when the NV is reset. Therefore, on the set having the micro- computer version 1.000, change the adjusted values following the Change of Adjusted Values immediately after the NV was reset (see page 18). 4-4. Releasing the

39、 Test Mode For test mode set with the method 1: Turn off the power and open the solder bridge on SL801 (TEST) on the MAIN board. Note: Remove the solders completely. Remaining could be shorted with the chassis, etc. For test mode set with the method 2: Turn off the power. Note: If electrical adjustm

40、ent (see page 18) has not been finished completely, always start in the test mode. (The set cannot start in normal mode) 4-1. Outline This set provides the Overall adjustment mode that allows CD (PB) and MO (REC/PB) disk to be automatically adjusted when in the test mode. In this overall adjustment

41、mode, the disc is discriminate between CD and MO, and each adjustment is automatically executed in order. If a fault is found, the system displays its location. Also, the manual mode allows each individual adjustment to be automatically adjusted. Operation in the test mode is performed with the set. A key having no particular description in the text, indicates a set key. For the LCD display, the LCD on the set is shown. 4-2. Setting Method of Test Mode There are two different methods to set the test mode: 1 Short SL801 (TEST) on the MAIN board with a solder bridge (connect pin 3 of IC8