sony_MDCT-1000_service_manual 维修电路图.pdf
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1、MDCT-1000 US ModelSERVICE MANUAL MD CONFER-TRANSCRIBER Sony Corporation Personal Audio Company Shinagawa Tec Service Manual Production Group 9-873-186-02 2001G1600-1 2001.7 SPECIFICATIONS Ver 1.1 2001. 07 US and foreign patents licensed from Dolby Laboratories Licensing Corporation Model Name Using
2、Similar MechanismMDCC-2000 MD Mechanism TypeCCMD-2000 Optical Pick-up Mechanism TypeKMS-250A Laser diode properties Material: GaAlAs Wavelength: 780 nm Emission duration: Continuous Laser output: Less than 44.6 W (This output is the value measured at a distance of about 200 mm from the lens surface
3、on the optical pick-up block with 7 mm aperture.) Revolutions 400 rpm to 1,800 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1 kHz Coding ATRAC 3 (Adaptive TRansform Acoustic Coding 3) Modulation system EFM (Eight to Fourteen Modulation) Number
4、of channels 2 or 4 monaural channels Frequency response 5010,000 Hz Speaker Approx. 5.0 cm (2 inches) dia. Power output 600 mW (at 10% distortion) Output EAR (minijack) for 8300 earphones Other connector CONTROL UNIT connector Power requirements 12 V DC DC IN 12V jack accepts the supplied AC power a
5、daptor for use on 120 V AC, 60 Hz Dimensions Approx. 320 x 280 x 118 mm (w/h/d) (1258 x 1118 x 434 inches) including projecting parts and controls Mass Approx. 3.7 kg (8 lb 3 oz) Accessories supplied AC power adaptor (1) AC power cord (1) Design and specifications are subject to change without notic
6、e. 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MDCT-1000 1. GENERAL 4 2. DISASSEMBLY 2-1.Cabinet(Upper) Section 6 2-2.Switch Section 7 2-3.LCD Section 7 2-4.MD Section 8 2-5.Volume Section 8 2-6.Main Board 9 2-7.Door 10 2-8.MD Board 10 2-9.Base Unit Section 11 2-10. BUM-F1 Board 11 2-11. REC/PB Head Assy (HR901
7、) Section 12 2-12. Holder Assy, Cartridge Section 12 2-13. Holder Assy, Cartridge Installation 13 2-14. Optical Pick-Up (KMS-250A) Section 13 3. TEST MODE 14 4. ELECTRICAL ADJUSTMENTS 26 5. DIAGRAMS 5-1.Circuit Boards Location 27 5-2.Block Diagrams 28 MD Section 28 I/O Section 29 FIFO Section 30 CPU
8、 Section 31 LCD Section 32 5-3.Printed Wiring Board MD Section 33 5-4.Schematic Diagram MD Section (1/4) 34 5-5.Schematic Diagram MD Section (2/4) 35 5-6.Schematic Diagram MD Section (3/4) 36 5-7.Schematic Diagram MD Section (4/4) 37 5-8.Schematic Diagram BUM Section 38 5-9.Printed Wiring Board BUM
9、Section 39 TABLE OF CONTENTS 5-10. Schematic Diagram Main Section (1/11) 40 5-11. Schematic Diagram Main Section (2/11) 41 5-12. Schematic Diagram Main Section (3/11) 42 5-13. Schematic Diagram Main Section (4/11) 43 5-14. Schematic Diagram Main Section (5/11) 44 5-15. Schematic Diagram Main Section
10、 (6/11) 45 5-16. Schematic Diagram Main Section (7/11) 46 5-17. Schematic Diagram Main Section (8/11) 47 5-18. Schematic Diagram Main Section (9/11) 48 5-19. Schematic Diagram Main Section (10/11) 49 5-20. Schematic Diagram Main Section (11/11) 50 5-21. Printed Wiring Board Main Section 51 Main Sect
11、ion (1/4) 52 Main Section (2/4) 53 Main Section (3/4) 54 Main Section (4/4) 55 5-22. Schematic Diagram Audio Section 56 5-23. Printed Wiring Board Audio Section 57 5-24. Schematic Diagram Level Meter Section 58 5-25. Printed Wiring Board Level Meter Section 59 5-26. Schematic Diagram LCD Section 60
12、5-27. Printed Wiring Board LCD Section 61 5-28. Schematic Diagram Switch Section 62 5-29. Printed Wiring Board Switch Section 63 5-30. Schematic Diagram Foot Switch Section 64 5-31. Printed Wiring Board Foot Switch Section 65 5-32. IC Pin Function Description 66 5-37. IC Block Diagrams 69 6. EXPLODE
13、D VIEWS 6-1.Cabinet Section 76 6-2.Key Section 77 6-3.LCD Section 78 6-4.MD Mechanism Section (CCMD-2000) 79 7. ELECTRICAL PARTS LIST 80 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OP
14、ERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C during repairing. Do not touch the soldering iron on the same conductor of
15、the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adj
16、ustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated
17、by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASE
18、R DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MDCT-1000 Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) in
19、dicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Or
20、dinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be c
21、areful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary sold
22、er. 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MDCT-1000 SECTION 1 GENERALThis section is extracted from instruction manual. Location and Function of Controls For details, refer to the pages indicated in ( ). 1 LCD display 2 3 Built-in speaker MONITOR VOL control 4 LCD CONTRAST control Adjusts the contrast of
23、the display. 5 MONITOR select buttons (ALL/1/2/3/4) (8) 6 STANDBY switch 7 MD insertion slot 8 Z EJECT button 9 FUNCTION button q; DISP MODE button (10) qa Arrow buttons qs ENTER button qd Jog dial qf x STOP button qg m REW/BS button qh u PLAY/PAUSE button qj M FF/FS button Left side Rear qk CONTROL
24、 UNIT connector (11) ql EAR jack (8) w; DC IN 12V jack (7) 5 MDCT-1000 1 Status display (17) Indicates the disc inserted in or the status of deck as follows: BLANK: a blank disc NO DISC: no disc PB ONLY: a commercially available recorded disc (for playback only) PROTECTED: a protected disc RECORDED:
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