sony_MDCC-2000_service_manual 维修电路图.pdf
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1、MDCC-2000 US ModelSERVICE MANUAL MD CONFER-CORDER Sony Corporation Personal Audio Company Shinagawa Tec Service Manual Production Group 9-873-111-12 2001G1600-1 2001.7 SPECIFICATIONS Ver 1.1 2001. 07 US and foreign patents licensed from Dolby Laboratories Licensing Corporation Laser diode properties
2、 Material: GaAlAs Wavelength: 780 nm Emission duration: Continuous Laser output: Less than 44.6 W (This output is the value measured at a distance of about 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.) Revolutions 400 rpm to 1800 rpm (CLV) Error correction Advanced C
3、ross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1 kHz Coding ATRAC 3 (Adaptive TRansform Acoustic Coding 3) Modulation system EFM (Eight to Fourteen Modulation) Number of channels 2 or 4 monaural channels Frequency response 5010,000 Hz Speaker Approx. 5.0 cm (2 inches) dia. Power out
4、put 600 mW (at 10% distortion) Input MIC: Canon XLR-3-31 type 0.44 mV (-65 dB) LINE IN 1-4: mini jack 0.49 V (-4 dB) Output EAR (minijack) for 8300 earphones LINE OUT 1,2 (minijack) 0.22 V (-11 dB) load inpedance 47 k ADA (minijack) 0.22 V (-11 dB) load inpedance 10 k PA (minijack) 0.22 V (-11 dB) l
5、oad inpedance 47 k PC (9 pin D-sub) DISPLAY (modular) Other connector CONTROL UNIT connector REMOTE jack Power requirements 12 V DC DC IN 12V jack accepts the supplied AC power adaptor for use on 120 V AC, 60 Hz Dimensions Approx. 320 x 280 x 118 mm (w/h/d) (1258 x 1118 x 434 inches) including proje
6、cting parts and controls Mass Approx. 4.5 kg (9 lb 15 oz) Accessories supplied AC power adaptor (1) AC power cord (1) Sony CR2032 lithium battery (1) MiniDisc (2) Design and specifications are subject to change without notice. Model Name Using Similar MechanismNEW MD Mechanism TypeCCMD-2000 Optical
7、Pick-up Mechanism TypeKMS-250A 收音机爱好者资料库 Ra d i o Fa n s .CN 2 MDCC-2000 1. GENERAL 3 2. DISASSEMBLY 2-1.Cabinet (Upper) Section6 2-2.Switch Section 7 2-3.LCD Section 7 2-4.I/O Section 8 2-5.Volume Section 8 2-6.Main Board 9 2-7.Connector Section 9 2-8.Door 10 2-9.MD Board 10 2-10. Base Unit Section
8、 11 2-11. BUM-F1 Board 11 2-12. REC/PB Head Assy (HR901) Section 12 2-13. Holder Assy, Cartridge Section 12 2-14. Holder Assy, Cartridge Installation 13 2-15. Optical Pick-up (KMS-250A) Section 13 3. TEST MODE 14 4. ELECTRICAL ADJUSTMENTS 27 5. DIAGRAMS 5-1.Circuit Boards Location 29 5-2.Block Diagr
9、ams MD Section 30 I/O Section 31 FIFO Section 32 CPU Section 33 LCD Section 34 5-3.Printed Wiring Board MD Section 35 5-4.Schematic Diagram MD Section (1/4) 36 5-5.Schematic Diagram MD Section (2/4) 37 5-6.Schematic Diagram MD Section (3/4) 38 5-7.Schematic Diagram MD Section (4/4) 39 5-8.Schematic
10、Diagram BUM Section 40 5-9.Printed Wiring Board BUM Section 41 5-10. Schematic Diagram Main Section (1/12) 42 5-11. Schematic Diagram Main Section (2/12) 43 5-12. Schematic Diagram Main Section (3/12) 44 5-13. Schematic Diagram Main Section (4/12) 45 5-14. Schematic Diagram Main Section (5/12) 46 TA
11、BLE OF CONTENTS 5-15. Schematic Diagram Main Section (6/12) 47 5-16. Schematic Diagram Main Section (7/12) 48 5-17. Schematic Diagram Main Section (8/12) 49 5-18. Schematic Diagram Main Section (9/12) 50 5-19. Schematic Diagram Main Section (10/12) 51 5-20. Schematic Diagram Main Section (11/12) 52
12、5-21. Schematic Diagram Main Section (12/12) 53 5-22. Printed Wiring Board Main Section 54 Main Section (1/4) 55 Main Section (2/4) 56 Main Section (3/4) 57 Main Section (4/4) 58 5-23. Printed Wiring Board Mute Section 59 5-24. Schematic Diagram AUDIO Section 60 5-25. Printed Wiring Board Audio Sect
13、ion 61 5-26. Schematic Diagram Level Meter Section 62 5-27. Printed Wiring Board Level Meter Section 63 5-28. Schematic Diagram LCD Section 64 5-29. Printed Wiring Board LCD Section 65 5-30. Schematic Diagram Switch Section 66 5-31. Printed Wiring Board Switch Section 67 5-32. Schematic Diagram Foot
14、 Switch Section 68 5-33. Printed Wiring Board Foot Switch Section 69 5-34. Schematic Diagram Volume/Serial I/O Section 70 5-35. Printed Wiring Board Volume/Serial I/O Section 71 5-36. Schematic Diagram Line Selector Section 72 5-37. Printed Wiring Board Line Selector Section 73 5-38. IC Pin Function
15、 Description 74 5-39. IC Block Diagrams 77 6. EXPLODED VIEWS 6-1.Cabinet Section 85 6-2.Key Section 86 6-3.LCD Section 87 6-4.Connector Section 88 6-5.MD Mechanism Section (CCMD-2000) (Deck-A/Deck-B) 89 7. ELECTRICAL PARTS LIST 90 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR
16、DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing Keep the temperature of the solderin
17、g iron around 270C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that t
18、he minus side of a tantalum capacitor may be dam- aged by heat. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 MDCC-2000 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR B
19、ASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the p
20、rinted matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. Unlead
21、ed solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following cha
22、racteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350C. Caution: The
23、printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder
24、 It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. 收音机爱好者资料库 Ra d i o Fa n s .CN 4 MDCC-2000 SECTION 1 GENERAL 4 Introduction Location and Function of Controls For details, refer to the pages indicated in ( ). 1 Built-in speaker 2 LCD CONTRAST control A
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