SONY mz-e33 维修电路图.pdf
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1、MZ-E33 SERVICE MANUAL PORTABLE MINIDISC PLAYER SPECIFICATIONS US Model Canadian Model AEP Model E Model Model Name Using Similar MechanismMZ-E55 MD Mechanism TypeMT-MZE55-150 Optical Pick-up Mechanism TypeODX-1A/1B US and foreign patents licensed from Dolby Laboratories Licensing Corporation. System
2、 Audio playing system MiniDisc digital audio system Laser diode properties Material : GaAlAs Wavelength : =790 nm Emission duration : continuous Laser output : less than 44.6 W* * This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up block w
3、ith 7 mm aperture. Revolutions 400 rpm to 900 rpm (CLV) Error correction Advanced Cross Interleave Reed Solomon Code (ACIRC) Sampling frequency 44.1kHz Coding Adaptive TRansform Acoustic Coding (ATRAC) Modulation system EFM (Eight to Fourteen Modulation) Number of channels 2 stereo channels 1 monaur
4、al channel Frequency response 20 to 20,000 Hz 3 dB Wow and Flutter Below measurable limit Outputs Headphones : stereo mini-jack, maximum output level 5mW+5mW, load impedance 16 ohm General Power requirements One LR6 (size AA) alkaline battery (not supplied) Ni-MH rechargeable battery NH-9WM/NH-14WM
5、(not supplied) R-6 sized Ni-MH rechargeable battery NH-MDAA (supplied) Sony AC Power Adaptor AC-MZR55 (supplied) connected at the DC IN 3V jack Battery operation time BatteriesPlayback LR6 (SG) (size AA)Approx. 9.5 hours Sony alkaline battery R-6 sized Ni-MHApprox. 8 hours rechargeable battery NH-MD
6、AA Chewing gum typeApprox. 7 hours Ni-MH rechargeable battery NH-14WM Chewing gum typeApprox. 6.5 hours Ni-MH rechargeable battery NH-9WM (N) Dimensions Approx. 80 17.3 92 mm (w/h/d) (3 1/4 11/16 3 5/8 in.) not including projecting parts and controls MICROFILM Continued on next page Ver 1.1 1999. 01
7、 收音机爱好者资料库 Ra d i o Fa n s .CN 2 1.SERVICING NOTE. 3 2.GENERAL. 4 3.DISASSEMBLY 3-1. Bottom Panel Assy . 5 3-2. Upper Panel Assy . 5 3-3. Main Board . 6 3-4. MD Assy . 6 3-5. OP Service Assy. 6 4.TEST MODE. 7 5.ELECTRICAL ADJUSTMENTS. 11 6.DIAGRAMS 6-1. IC Pin Description. 13 6-2. Block Diagram . 15
8、 6-3. Printed Wiring Board . 18 6-4. Schematic Diagram . 21 7.EXPLODED VIEWS 7-1. Panel Section . 29 7-2. Main Board Section . 30 7-3. Mechanism Deck Section. 31 8.ELECTRICAL PARTS LIST. 32 TABLE OF CONTENTS Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270C duri
9、ng repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tant
10、alum capacitor may be dam- aged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES O
11、R EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. “MD WALKMAN” is a trademark of Sony Corporation. This MiniDisc player is classi- fied as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior. Mass Approx. 113 g (4.0 oz.) the player only
12、 Approx. 155 g (5.5 oz.) incl. a premastered MD and a Sony alkaline LR6 (SG) battery Supplied accessories AC power adaptor AC-MZR55 (1) R-6 sized Ni-MH rechargeable battery NH-MDAA (1) Rechargeable battery carrying case (1) Headphones with a remote control MDR-A34SP + RM-MZE33 (1) (US model) MDR-E80
13、5SP + RM-MZE33 (1) (Canadian, AEP, E model) MDR-E838SP + RM-MZE33 (1) (Hong Kong model) Carrying pouch (1) Design and specifications are subject to change without notice. SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE
14、 PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHMATIQUES ET LA L
15、ISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. 收音机爱好者资料库 Ra d i o Fa n s .CN 3 SECTION 1 SERVICING NOTE 1. When repairing this device with the power o
16、n, if you remo ve the main board, this de vice stops working. In this case, you w ork without the device stopping by fastening the hook of the DOOR OPEN/CLOSE switch (S801) with tape. S801 2. The electrical components differ accor ding to the version of the system control IC (IC801). When replacing
17、the IC801, chec k its model name and add or remo ve D1001 and/or R1001 as shown belo w. For detailed information, see the Printed Wiring Boar d on pa ge 18 and the Schematic Diagram on page 21. RU6815MF-0004 (V er. 3.0) . Add D1001 and R1001 RU6815MF-0005 (V er. 3.2) and later . Remo ve D1001 and R1
18、001 收音机爱好者资料库 Ra d i o Fa n s .CN 4 SECTION 2 GENERAL This section is extracted from instruction manual. 5 SECTION 3 DISASSEMBLY 3-1. BOTTOM PANEL ASSY Note : When installing, fit the knobs and switches. 3-2. UPPER PANEL ASSY The equipment can be removed using the following procedure. Bottom panel a
19、ssyMain board Upper panel assyMain boardMD assyOP service assy Note : Follow the disassembly procedure in the numerical order given. 1 precision pan screw (M1.4) 2 precision pan screw (M1.4) 3 precision pan screw (M1.4) 4 bottom panel assy knobs switches 2 precision pan screw (M1.4) 4 upper panel as
20、sy 3 precision pan screw (M1.4) 1 button (OPEN) 6 3-5. OP SERVICE ASSY3-4. MD ASSY 1 claw 2 claw 3 MD assy 1 precision screw 3 main shaft 2 OP service assy 3-3. MAIN BOARD 5 toothed lock screw 3 precision pan screw (M1.4) 4 step screw (MD) 2 precision pan screw (M1.4) 1 battery case lid 9 MAIN board
21、 6 7 CN501 8 CN551 7 Servo mode 0 0 0 Offset adjustment 0 1 0 Laser power adjustment 0 2 0 011 to 013? *1 021 to 024? *1 231 p key p key p key p key ” key ” key ” key ” key ” key +, keys+, keys (See page 8) *1 Repeatedly press ” key to change the mode. (Refer to the following list for a description
22、of each mode.) ” key ” key p key p key p key p key VOL + key VOL key (Start ?) Overall adjustment mode (Auto?) Adjustment mode (Manu ?) Servo mode 0 0 0 Audio mode 1 0 0 Servo mode 3 0 0 +, keys +, keys +, keys Display when test mode is set Displays of the LCD on the remote commander are shown in pa
23、rentheses. V 1 . 0 0 0 ROM version display LCD on remote commander SECTION 4 TEST MODE Outline In this set, overall adjustment mode is made availab le by enter - ing test mode to perform automatic adjustment of CD and MO. In the overall adjustment mode, the disc is determined whether it is CD or MO
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