Ten-Tec_1330_guide_K7QO.pdf

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1、K7QOs TT13XX Assembly Notes Version 1.0 January 20, 2009 by Chuck Adams, K7QO 2 Contents 1Introduction5 2Tools7 3Phase 1.0 - Keying and DC Input Circuits37 4Phase 2.0 - VFO and Buffer and RF Amplifier Circuits97 5Phase 3.0 - Transmit Mixer and 10.1MHz Filter Circuits159 6Phase 4.0 - 14.318MHz Receiv

2、er IF Stages179 7Phase 5.0 - Receiver BFO and Audio Amp Stages227 8Phase 6.0 - Audio Preamp/Filter and AGC247 9Phase 7.0 - Transmit Driver, RF Amp and Output Filter279 10 Final Assembly319 11 RG-174 Coax Preparation329 3 4CONTENTS Chapter 1 Introduction This is a manual showing a multitude of photog

3、raphs during the construction of the TenTec 1330 30-meter transceiver.It is not meant to be a replacement of the manual, but to be used as a visual aid for any builder of the rig. If there is a question about a step, the TenTec manual takes priority over what I did. The construction of any kit is no

4、t a timed exam.There is no need to rush the construction process.The extra time spent in double checking your work before committing to the installation of a part will be rewarded with not having to come back and correct any mistakes. Ill take a few photographs and explain how I do soldering and you

5、 should note that solder will, most of the time, flow through the hole in the printed circuit board and join the component lead to the solder pad on the component side of the board.This also means that if you have to come back and remove a part you will have to do a little more work and use more car

6、e in doing so.But the resulting work looks like the soldering was done by a commercial wave soldering machine. Enjoy the kit and I hope that this work on my part will help you do a better job and give you excellent results. 5 6CHAPTER 1. INTRODUCTION Chapter 2 Tools The tools required to build this

7、kit are rather simple and inexpensive. There is not need for soldering stations costing more than the kit and you can get just as good results as the next person. You will need the following. Solder Iron. Electronic Solder. Diagonal Cutters. Chain-Nose Pliars. Lead Bender (Optional). Magnifying Glas

8、s or Loupe. Hobby Knife. Wire Stripper. 7 8CHAPTER 2. TOOLS Figure 2.1: Soldering Iron used in this Manual. The soldering iron above is one purchased at a local Home Depot in the tools department.It cost less than $15.00 at the time of purchase and hopefully the cost hasnt gone up. It does not take

9、an expensive soldering station to do an excellent construction job on this kit. 9 Figure 2.2: Diagonal Cutters. Here are a pair of diagonal cutters purchased from Sears and carry the Craftsman brand.These are great for cutting leads after they have been soldered. Do not use these for anything else b

10、uy electronic construction and cut nothing but wires of components.Do not cut steel wire with them or they will be damaged. 10CHAPTER 2. TOOLS Figure 2.3: Chain-Nose Pliars. The above are chain-nose pliars obtained from a bead store.The kind of bead store that has a variety of beads for making brace

11、lets for teenagers. These are smaller than needle-nose pliars and they are used mainly by jewelsmiths for working on decorative chains and necklaces that require small areas of contact for metal work. They are not that expensive either. 11 Figure 2.4: Kester Solder. Use solder intended only for elec

12、tronic assembly.My preference is for tin and lead based solder with some silver content. 12CHAPTER 2. TOOLS Figure 2.5: Lead Bender. A lead bender allows you to bend the component leads on resistors to the same length.Most of the resistors are set with 0.4 spacing. 13 Figure 2.6: Wash Cloth. Most bu

13、ilders clean their soldering iron tip with a wet sponge between solder applications.I choose to just swipe the tip across a heavy duty washcloth.It does not lower the iron temperature and is very cheap. 14CHAPTER 2. TOOLS Figure 2.7: Exacto Hobby Knife. 15 Figure 2.8: Ten Power Loupe. I found this m

14、agnification lens at a dollar store.I use it to double check solder connections and for possible shorts on the board.And for parts identification for transistors and very small parts that are marked with laser etchings that are very difficult to see. 16CHAPTER 2. TOOLS Figure 2.9: Shrink Wrapped Tra

15、nsceiver and Manual. The above shows the kit and manual removed from the shipping carton. 17 Figure 2.10: Construction Manual. 18CHAPTER 2. TOOLS Figure 2.11: Corrections to Manual. 19 Figure 2.12: Kit Supplement Manual. A large page called the kit supplement manual contains diagrams for each phase

16、of the building process.This page will keep you from having to page back and forth in the construction manual to look at parts locations. If you dont mind, you may use a highlighter to high light parts as they are installed.This adds to the time it takes to finish the kit, but I find that it is usef

17、ul to help concentration and to avoid as many errors as possible. 20CHAPTER 2. TOOLS Figure 2.13: Case Cover Removed. The components are shipped in bags and are in the case.I recommend that you do not remove parts from the bags until you need them.This will keep you from losing them and getting conf

18、used. 21 Figure 2.14: Shielded Inductors, Wire and Hardware. 22CHAPTER 2. TOOLS Figure 2.15: Resistors. 23 Figure 2.16: Electrolytic Capacitors. 24CHAPTER 2. TOOLS Figure 2.17: Electrolytic Capacitors. 25 Figure 2.18: Disc and Mylar Capacitors. 26CHAPTER 2. TOOLS Figure 2.19: Integrated Circuits. 27

19、 Figure 2.20: Diodes and Transistors. These are in the same bag as the integrated circuits.I just turned the bag over for this photograph. 28CHAPTER 2. TOOLS Figure 2.21: Hardware and Crystals. 29 Figure 2.22: Knobs and Mounting Hardware. 30CHAPTER 2. TOOLS Figure 2.23: Printed Circuit Board. This i

20、s the side that will have the components after they are installed. 31 Figure 2.24: Upper Left Hand Quadrant. 32CHAPTER 2. TOOLS Figure 2.25: Upper Right Hand Quadrant. 33 Figure 2.26: Lower Right Hand Quadrant. 34CHAPTER 2. TOOLS Figure 2.27: Lower Left Hand Quadrant. 35 Figure 2.28: Bottom of Print

21、ed Circuit Board. This is the side that we will apply solder to and heat to install the parts one at a time. 36CHAPTER 2. TOOLS Figure 2.29: 2N2124 Transistors. I mark the bags with part numbers, either with a small label as shown above or a magic marker pen.Keeps me from making a mistake and speeds

22、 up the process of parts selection by not having to use the magnifier over and over. Chapter 3 Phase 1.0 - Keying and DC Input Circuits Phase 1.0 will install the parts needed for the transceiver keying and DC input circuits.Here is the schematic for the section being built. The schematic is slightl

23、y different from the TenTec manual visually, but it is the same circuit. Figure 3.1: Phase 1.0 Schematic. 37 38CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.2: 2N4126 Transistors. 39 Figure 3.3: Closeup of 2N4126 Transistors. 40CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figur

24、e 3.4: 2N4126 Transistor Removed. 41 Figure 3.5: 2N4126 Transistor in Place. Place the transistor in the proper holes and hold it in place and then bend the two outer leads about 45 degrees to hold in place as shown in the next slide.I do not bend them further, just in case I later need to remove th

25、e part. 42CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.6: Bend outside leads 45 degrees. 43 Figure 3.7: 0.5cm Solder Markings. You might want to experiment with your first soldering by marking 1/2 cm lengths on the solder.Then, while following the soldering instructions in the manual

26、, use about 1 cm to make the first soldering joint.I use about 1cm and I use what I call the 3-second rule.I heat the lead and pad about 3 seconds while applying a small amount of solder (the 1cm). Beginners tend to use too much and it doesnt help and using too much can cause more problems than it s

27、olves. 44CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.8: One Soldered Lead of Transistor. Here is the soldered lead using the technique described. 45 Figure 3.9: Component Side of Board. Here is what the top side of the board looks like.The reason for the solder on the top side is ma

28、inly due (I think) the use of solder with 2 per-cent silver and when heating the lead and pad, make sure that you not cover too much of the hole so that the solder can wick through to the other side.You do not have to have this good a soldering connection and it takes a lot of practice and a lot of

29、time to do this. And a warning.If you get this kind of soldering connection, remember it may take a lot of work to undo it, so double check parts values and location and dont lose your concentration. 46CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.10: Cut Leads. 47 Figure 3.11: Compon

30、ent Side. You can see the right-hand connection did not quite wick through like the other two, but it is not an issue, so move on to the next part. 48CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.12: Top View. 49 Figure 3.13: Side View. I like to have parts vertical and aligned with t

31、he silk screened outline on the board. 50CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.14: Highlighted Q1. It helps me to highlight parts as I go along to keep track and later make the next part location easier to find. 51 Figure 3.15: 2N5087 Transistor. This transistor does not have

32、its leads formed as the 2N2124 did.Dont try to bend the leads to the same form.Just insert the leads into the printed circuit board and gently (very gently) push it into place as shown in the next slide.It will easily move down until about 2mm or so and the tension will increase.Go no further as you

33、 may damage the part. 52CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.16: Side View. Here it is in place. 53 Figure 3.17: 45 Degree Bends. 54CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.18: 1-2 Q16 Soldered Leads. 55 Figure 3.19: 1-3 Q17 Soldered in Place. 56CHAPTER 3.

34、 PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.20: Top View of Q1, Q16 and Q17. 57 Figure 3.21: 1N4148 Diodes. 58CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.22: 1N4148 and D11 Outline. I use the lead bender to bend the leads to this shape.It takes the end part of the bender to d

35、o this above the hole to get the right length, or you can just use the chain-nose pliars to gently bend the leads. 59 Figure 3.23: 1-4 D11 Installed. 60CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.24: 1-5 D12 1N4148 Diode. 61 Figure 3.25: 10F Capacitors. 62CHAPTER 3. PHASE 1.0 - KEYI

36、NG AND DC INPUT CIRCUITS Figure 3.26: Positive (+) and Negative (-) Leads. On the tape side of the strip you can see the short vs.long length of the lead.The positive lead (+) is the longer lead and you can also see the band on the negative side (-) with the negative sign. When you cut the cap from

37、the strip you wont have the length indicator, so observe the markings on the cap.The negative lead goes into the hole with the circular pad.The positive lead goes in to the hole on the pc board with the square pad. 63 Figure 3.27: 10F Cap Cut From Strip. Note the negative marking on the case to indi

38、cate the lead that is the negative lead of the capacitor. 64CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.28: 1-7 C81 Installed. 65 Figure 3.29: Side View of C81. 66CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.30: C92 Location. C92 is located just below the diode and t

39、he left circular outline. Note the circular and square pads. 67 Figure 3.31: 1-8 C92 Installed. 68CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.32: Side View C92. 69 Figure 3.33: Highlighted Supplemental Diagram. 70CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.34: 4.7F

40、Caps. 71 Figure 3.35: 1-9 C1 Installed. C1 is the right hand electrolytic cap. 72CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.36: 3.3F Electrolytic Cap. 73 Figure 3.37: 1-10 C80 Installed. 74CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.38: 1.5K Resistors. 75 Figure 3.

41、39: 1.5K Resistors Marked. 76CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.40: 1-11 R1. 77 Figure 3.41: 1-12 R2. 78CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.42: 1-13 R3. 79 Figure 3.43: 1-14 R50. 80CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.44: 1-1

42、5 R51. 81 Figure 3.45: 1-16 R52. 82CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.46: 1-17 R53. 83 Figure 3.47: 1-18 R54. 84CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.48: 0 Ohm Resistors. These resistors will be used in place of wires to connect one path to another.Sa

43、ves time in making up insulated wires and cutting them to length. 85 Figure 3.49: 1-19 JMP1. 86CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.50: 1-20 JMP2. 87 Figure 3.51: 1-20 JMP3. 88CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.52: 1-20 JMP4. 89 Figure 3.53: Bag of 0

44、.01F Disc Caps. 90CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.54: 1-23 C2. 91 Figure 3.55: 1-24 C79. 92CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.56: 1-25 C82. 93 Figure 3.57: L20 Location. 94CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.58: 1-28 0 O

45、hm Resistor for L20. 95 Figure 3.59: 1-31 +12V Input Location. In order to prevent damage, if the power supply should be connected backwards, I use either a 1N4001 diode or a Schottky diode (1N5817 or similar) to prevent current flow if reverse polarity is applied.If you ever hook up the power sourc

46、e backwards, you will do damage to parts of the transceiver and will have to replace the parts.It is worth the extra effort to do this.Note the direction of the diode. If you dont have the parts, then follow the instructions with the kit and just be careful when it comes to applying power to the rig

47、. 96CHAPTER 3. PHASE 1.0 - KEYING AND DC INPUT CIRCUITS Figure 3.60: 1-32 -12V Input Location. Chapter 4 Phase 2.0 - VFO and Buffer and RF Amplifier Circuits In this section we will build the variable frequency oscillator, an RF buffer, RF amplifier and RF filter circuits.The variable frequency osci

48、llator controls the operating frequency of the transceiver and is the heart of the rig.It must be stable, i.e.not vary over time and must be free of harmonics to meet standards set by the FCC for on the air operation. The TenTec manual describes the operation of the circuit and I will go into detail

49、s here. 97 98CHAPTER 4. PHASE 2.0 - VFO AND BUFFER AND RF AMPLIFIER CIRCUITS Figure 4.1: 2-3 R59 560 Ohms. 99 Figure 4.2: 2-4 R22. 100 CHAPTER 4. PHASE 2.0 - VFO AND BUFFER AND RF AMPLIFIER CIRCUITS Figure 4.3: 2-5 R66. 101 Figure 4.4: 2-6 R24 1.5K. 102 CHAPTER 4. PHASE 2.0 - VFO AND BUFFER AND RF AMPLIFIER CIRCUITS Figure 4.5: 2-7 R25 1.5K. 103 Figure 4.6: 2-8 R17 2.2K. 104 CHAPTER 4. PHASE 2.0 - VFO AND BUFFER AND RF AMPLIFIER CIRCUITS Figure 4.7: 2-9 R58 2.2K. 105 Figure 4.8: 2-1