Aiwa-CXLDB30-cs-sm 电路图 维修手册.pdf

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1、SERVICE MANUAL Sony Corporation Personal Audio Group Published by Sony Engineering Corporation AEP Model CX-LDB30/LDB50 UK Model CX-LDB30 E Model CX-LDB30/LDB50 MICRO HI-FI COMPONENT SYSTEM 9-879-476-02 2005D16-1 2005.04 Ver. 1.1 2005.04 SPECIFICATIONS CX-LDB30/LDB50 CX-LDB30/LDB50 are the Amplifier

2、, CD player, Tape Deck and Tuner section in XR-DB30/DB50. Continued on next page Model Name Using Similar MechanismNEW CDCD Mechanism TypeCDM80BV-F4BD81 SectionBase Unit NameBU-F4BD81B Optical Pick-up NameKSM-215CFP/C2NP TAPEModel Name Using Similar MechanismCX-LEM330 SectionTape Transport Mechanism

3、 TypeCMAL5Z220A CX-LDB50 European model: DIN power output (rated): 60 + 60 W (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 80 + 80 W (6 ohms at 1 kHz, 10% THD) Music power output (reference): 200 + 200 W (6 ohms at 1 kHz, 10% THD) Other models: The following measured at AC 220 240

4、V, 50/60 Hz DIN power output (rated): 60 + 60 W (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 80 + 80 W (6 ohms at 1 kHz, 10% THD) CX-LDB30 European model: DIN power output (rated): 45 + 45 W (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 60 + 60 W (6 ohms at 1 kHz

5、, 10% THD) Music power output (reference): 140 + 140 W (6 ohms at 1 kHz, 10% THD) Other models: The following measured at AC 220 240 V, 50/60 Hz DIN power output (rated): 45 + 45 W (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 60 + 60 W (6 ohms at 1 kHz, 10% THD) Inputs AUDIO IN (R

6、CA pin jacks): Sensitivity 700 mV, impedance 47 kilohms Outputs PHONES (stereo mini jack): accepts headphones with an impedance of 32 ohms or more SPEAKER:accepts impedance of 6 ohms CD player section SystemCompact disc and digital audio system Laser Diode PropertiesEmission duration: continuous Las

7、er Output*: Less than 44.6 W * This output is the value measurement at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture RadioFans.CN 收音机爱 好者资料库 2 CX-LDB30/LDB50 SAFETY-RELATED COMPONENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH M

8、ARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Frequency response20 Hz 20 kHz Signal-to-noise ratioMore than 90 dB Dynamic rangeMore

9、than 90 dB Tape deck section Recording system4-track 2-channel stereo Frequency response100 10,000 Hz, using Sony TYPE I cassettes Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range87.5 108.0 MHz (50-kHz step) AntennaFM lead antenna Antenna terminals75 ohms unbalanced

10、 Intermediate frequency10.7 MHz AM tuner section Tuning range European model:531 1,602 kHz (with the tuning interval set at 9 kHz) Other models:530 1,710 kHz (with the tuning interval set at 10 kHz) 531 1,602 kHz (with the tuning interval set at 9 kHz) AntennaAM loop antenna, external antenna termin

11、al Intermediate frequency450 kHz General Power requirements European model:AC 230 V, 50/60 Hz Other models:AC 120, 220 or 230 240 V, 50/60 Hz Adjustable with voltage selector Power consumption XR-DB50 European model:85 W 0.3 W (in Power Saving mode) Other models:85 W XR-DB30 European model:70 W 0.3

12、W (in Power Saving mode) Other models:70 W Dimensions (w/h/d) excl. speakers: Approx. 190 x 277 x 269 mm Mass excl. speakers CX-LDB50:5.4 kg CX-LDB30:5.1 kg Design and specifications are subject to change without notice. Standby power consumption: 0.3 W Halogenated flame retardants are not used in t

13、he certain printed wiring boards. Lead-free solder is used for soldering certain parts. Halogenated flame retardants are not used in cabinets. RadioFans.CN 收音机爱 好者资料库 3 CX-LDB30/LDB50 TABLE OF CONTENTS 1.SERVICING NOTES.4 2.GENERAL.5 3.DISASSEMBLY 3-1.Disassembly Flow .7 3-2.Side Panel (L)(R), Top P

14、anel, Back Panel.8 3-3.CD Mechanism Section.8 3-4.Front Panel Section .9 3-5.Power Transformer .9 3-6.MAIN Board. 10 3-7.PANEL Board, CD EJECT Board, JACK Board . 10 3-8.Cassette Deck Mechanism. 11 3-9.Cassette Panel. 11 3-10. CD Mechanism Deck (CDM80BV-F4BD81) . 12 3-11. Chassis (Top) . 12 3-12. Le

15、ver (Loading R/L). 13 3-13. Disc Stop Lever, Disc Sensor Lever . 14 3-14. DRIVER Board . 14 3-15. BD Board. 15 3-16. Optical Pick-up (KSM-215CFP/C2NP) . 15 3-17. Base Unit (BU-F4BD81B) . 16 3-18. Lever (BU Lock) . 16 3-19. Close Lever. 17 3-20. DIR Lever, Gear (IDL-B) . 17 3-21. Gear (IDL-C) . 18 4.

16、TEST MODE. 19 5.MECHANICAL ADJUSTMENTS. 20 6.ELECTRICAL ADJUSTMENTS. 20 7.DIAGRAMS 7-1.Block Diagram BD Section . 25 7-2.Block Diagram MAIN Section . 26 7-3.Printed Wiring Board BD Board . 27 7-4.Schematic Diagram BD Board . 28 7-5.Printed Wiring Board DRIVER Board, JACK Board . 29 7-6.Schematic Dia

17、gram DRIVER Board, JACK Board . 30 7-7.Printed Wiring Board MAIN Section (1/2) . 31 7-8.Printed Wiring Board MAIN Section (2/2) . 32 7-9.Schematic Diagram MAIN Section (1/5) . 33 7-10. Schematic Diagram MAIN Section (2/5) . 34 7-11. Schematic Diagram MAIN Section (3/5) . 35 7-12. Schematic Diagram M

18、AIN Section (4/5) . 36 7-13. Schematic Diagram MAIN Section (5/5) . 37 7-14. Printed Wiring Board PANEL Board . 38 7-15. Schematic Diagram PANEL Board . 39 7-16. Printed Wiring Board PT Board . 40 7-17. Schematic Diagram PT Board . 41 8.EXPLODED VIEWS 8-1.Panel Section . 47 8-2.Front Panel Section .

19、 48 8-3.Chassis Section. 49 8-4.CD Mechanism Deck Section 1 (CDM80BV-F4BD81) . 50 8-5.CD Mechanism Deck Section 2 (CDM80BV-F4BD81) . 51 8-6.CD Mechanism Deck Section 3 (CDM80BV-F4BD81) . 52 8-7.Base Unit Section . 53 9.ELECTRICAL PARTS LIST. 54 RadioFans.CN 收音机爱 好者资料库 4 CX-LDB30/LDB50 SECTION 1 SERV

20、ICING NOTES The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in th

21、e printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-

22、 up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveforms is output three times. NOTES ON HANDLING

23、 THE OPTICAL PICK-UP BLOCK OR BASE UNIT Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C during repairing.

24、 Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra

25、diation exposure. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solde

26、r has the following characteristics. Unleaded solder melts at a temperature about 40 C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to a

27、bout 350 C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. U

28、sable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRO

29、DUCT MARKING is located on the exterior. 5 CX-LDB30/LDB50 SECTION 2 GENERAL This section is extracted from instruction manual. Main unit AUDIO IN w; (17, 23, 27) AUDIO IN jack qs (19, 23) BASS control 7 (17) CD SYNC qk (16) Disc slot 9 DISPLAY 3 (15, 21, 22) Display window 4 FOLDER +/ qg (10, 11, 16

30、) i-Bass 5 (17) PHONES jack qd PLAY MODE ql (10, 11, 16, 26) Remote sensor 2 TREBLE control 6 (17) TUNER/BAND w; (12, 14, 17) TUNING +/ qf (12, 14) TUNING MODE ql (12, 14) VOLUME control q; (18, 25) ?/1 (power) 1 (7, 14, 27) Z CD (eject) 8 (8, 9) Z PUSH qa (16) ./ (go back/go forward) qf (10) m/M (r

31、ewind/fast forward) qf (8, 10, 14, 16) x (stop) qh (10, 13, 16) z REC PAUSE/START qj (16) TAPE/N (play) w; (16) CD/NX (play pause) w; (10) List of button locations and reference pages How to use this page Use this page to find the location of buttons and other parts of the system that are mentioned

32、in the text. Illustration number r DISPLAY ws (15, 21) RR Name of button/partReference page ALPHABETICAL ORDER A O P Z BUTTON DESCRIPTIONS HHS sjJ 1 w; ql 2345 67 8 9 q; qa qs qkqjqhqg qf qd 6 CX-LDB30/LDB50 Remote control CD qh (9, 11, 13, 16, 17) CLEAR qd (12) CLOCK/TIMER SELECT 2 (19, 20, 25) CLO

33、CK/TIMER SET 3 (8, 18, 19) DISPLAY ql (15, 21, 22) ENTER 9 (8, 11, 13, 18, 19) EQ qs (17) FM MODE 4 (15, 27) FOLDER +/ qa (10, 11, 16) FUNCTION 6 (8, 9, 11, 12, 14, 16, 17, 23, 27) PLAY MODE qk (10, 11, 16, 26, 28) REPEAT 4 (11) SLEEP w; (18) TAPE qg (16, 17) TUNER/BAND 5 (12, 14, 17) TUNER MEMORY q

34、j (13) TUNING MODE qk (12, 14) VOLUME +/ q; (18, 25) ?/1 (power) 1 (7, 14, 19) m/M (rewind/fast forward) 7 (10, 14, 16) X (pause) 8 (10, 16) x (stop) 8 (10, 16) N (play) 8 (10, 16) /+(tuning) qf (12, 17) ./ (go back/go forward) qf (8, 10, 18) ALPHABETICAL ORDER A OP Z BUTTON DESCRIPTIONS 4 5 6 7 8 9

35、 0 3 2 1 qa qd qs ql qk qj qh qg qf w; Use buttons on the remote for the operation. 1Press ?/1 to turn on the system. 2Press CLOCK/TIMER SET. 3Press . or repeatedly to set the hour. 4Press ENTER. 5Press . or repeatedly to set the minute. 6Press ENTER. The clock starts working. To adjust the clock 1P

36、ress CLOCK/TIMER SET. 2Press . or until CLOCK SET? appears, then press ENTER. 3Do the same procedures as step 3 to 6 above. Notes The clock settings are canceled when you disconnect the power cord or if a power failure occurs. You cannot set the clock in Power Saving Mode (page 21). Setting the cloc

37、k 7 CX-LDB30/LDB50 SECTION 3 DISASSEMBLY 3-1.DISASSEMBLY FLOW 3-3.CD MECHANISM SECTION (Page 8) 3-10.CD MECHANISM DECK (CDM80BV-F4BD81) (Page 12) 3-7.PANEL BOARD, CD EJECT BOARD, JACK BOARD (Page 10) 3-4.FRONT PANEL SECTION (Page 9) 3-8.CASSETTE DECK MECHANISM (Page 11) 3-6.MAIN BOARD (Page 10) 3-5.

38、POWER TRANSFORMER (Page 9) 3-9.CASSETTE PANEL (Page 11) 3-2.SIDE PANEL (L) (R), TOP PANEL, BACK PANEL (Page 8) SET 3-11.CHASSIS (TOP) (Page 12) 3-14.DRIVER BOARD (Page 14) 3-17.BASE UNIT (BU-F4BD81B) (Page 16) 3-13.DISC STOP LEVER, DISC SENSOR LEVER (Page 14) 3-15.BD BOARD (Page 15) 3-16.OPTICAL PIC

39、K-UP (KSM-215CFP/C2NP) (Page 15) 3-18.LEVER (BU LOCK) (Page 16) 3-19.CLOSE LEVER (Page 17) 3-20. DIR LEVER, GEAR (IDL-B) (Page 17) 3-21. GEAR (IDL-C) (Page 18) 3-12.LEVER (LOADING R/L) (Page 13) This set can be disassembled in the order shown below. 8 CX-LDB30/LDB50 Note: Follow the disassembly proc

40、edure in the numerical order given. qgconnector 2p(CN292) 1four screws (+BVTP3 10) 4six screws (+BVTP3 10) qstwo screws (+BVTP3 10) qdtwo screws (+BVTP3 10) qfsix screws (+BVTP3 10) q;screw (+BVTP3 10) 3side panel (L) qatop panel qhback panel 7screw (QT2+3 10) 8screw (QT2+3 10) 9screw (QT2+3 10) 5th

41、ree claws 2three claws 6side panel (R) 7CD mechanism section 2wire (flat type) 15core (CN602) 1wire (flat type) 27core (CN902) 3screw (QT2+3 10) 4two screws (QT2+3 10) 5claw 6connector 7p(CN701) 3-2.SIDE PANEL (L)(R), TOP PANEL, BACK PANEL 3-3.CD MECHANISM SECTION 9 CX-LDB30/LDB50 3wire (flat type)

42、7core (CN905) 2wire (flat type) 8core (CN901) 4connector 7p (CNA302) 1wire (flat type) 19core (CN904) 7screw (QT2+3 10) 8screw (QT2+3 10) 5screw (+B3) 9two claws 0front panel section 6two tapping screws (B3) 1tapping screw (B3) 6tapping screw (B3) 3tuner (FM/AM) 9four screws qapower transformer 0 4c

43、onnector 8p (CN002) 5connector 2p (CN001) 2wire (flat type) 15core qsplate (PT shield) 8holder (pwb PT) 7two claws 3-4.FRONT PANEL SECTION 3-5.POWER TRANSFORMER 10 CX-LDB30/LDB50 5tapping screw (B3) 6two tapping screws (B3) 7two tapping screws (B3) 8two tapping screws (B3) 3screw (+BV3) 2two screws (+BV3) 9heat sink (main) 0MAIN board clamp 1connector 8p (CN002) 4wire (flat t