Philips-BDP-7500-B-2-Service-Manual(1) 电路图 维修手册.pdf
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1、Published by KC-LQ 1027 AVMPrinted in the Netherlands BDP7500B2 Subject to modifi cationEN Blue-Ray Disc Player ContentsPageContents Page Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retri
2、eval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Version 1.1 1 Technical Specification and Connection Facilities and Version variation 2 Laser Beam Safety Precautions.2-1 3 Important Safety Precaution
3、s . 3-1 to 3-2 4 Safety Check After Servicing . 4-1 6 Standard Notes For Servicing . .6-1 7 Special Information BGA IC when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC f
4、rom the CBA using tweezers. (Fig. S-1-6) CAUTION: 1.The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2.Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because dam
5、age to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Fig. S-1-1 3.The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it. With
6、Soldering Iron: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2.Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which
7、 solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 3.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up
8、. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can re
9、move it easily. (Fig. S-1-3) 2.Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3.While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
10、4.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note:When using a
11、soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 Flat
12、 Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 7-2 7-3 2. Installation 1.Using desoldering braid, remove the s
13、older from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. 2.The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners
14、 of the flat pack-IC. (See Fig. S-1-8.) 3.Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Instructions for Handling Semi- Special Information BGA IC ?:?,? 1 2 3 4 5 6 C59 1uF R508.2K TP38 R443K TP8 C33 1200pF/J L10 NC Q8 2N3906 2 13 R33100 R7433 D16 1N4148 12
15、+ CE33 CD11X/10UF16V/D5H11 + CE43 CD11X/10UF16V/D5H11 U6 DRV602 1 2 3 4 5 6 78 9 10 11 12 13 14 +INR -INR OUR SGND EN PVSS CNCP PVDD PGND NC OUTL -INL +INL + CE28 CD11X/10UF16V/D5H11 C9 220pF/J R2747R R10100 R383K R9247R R123 10K R73K R9147R C44 1uF R6947 R98.2K C56 82pF/J R121 4.7K C10 1200pF/J R71
16、100 C36 220pF/J C611uF Q3 2N3904 2 13 R39100 TP31 C35 1200pF/J CB3 0.1uF CB10 0.1uF +CE14 CD11X/10UF16V/D5H11 R101 10R/0.5W R458.2K L1FB + CE40 CD11X/10UF16V/D5H11 C32 220pF/J R2947R CB12 0.1uF L18FB C13 220pF/J R153K TP5 L11 NC TP2 Q1 2N3904 2 13 D19 1N4148 12 TP32 R36100 C14 1200pF/J R70100 R6247R
17、 R105 10K L4FB C58 33pF/J R116 0 C15 33pF/J +CE27 CD11X/22UF16V/D5H11 U11 CX1117H-ADJ SOT223 1 3 4 2 ADJ IN OUT2 OUT1 R7651K + CE16 CD11X/10UF16V/D5H11 PCM1754 U1 1 2 3 4 5 6 710 11 12 13 14 15 16 89 BCK DATA LRCK DGND NC VCC VoutLVCOM ZEROA TEST DEMP MUTE FMT SCK VoutRAGND C57 33pF/J L13FB +CE29 CD
18、11X/10UF16V/D5H11 L5FB R8910K R2100 +CE48 CD11X/220UF16V/D6H12 R94 4.7R R5711K P3 AV2-8.4-13D AV2-8.4-13D 1 2 3 CB7 0.1uF L14FB R106 2K2 PCM1754 U5 1 2 3 4 5 6 710 11 12 13 14 15 16 89 BCK DATA LRCK DGND NC VCC VoutLVCOM ZEROA TEST DEMP MUTE FMT SCK VoutRAGND TP12 C19 1uF R863K R813K R478.2K C16 33p
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