Philips-DVP-3050-V-Service-Manual(1) 电路图 维修手册.pdf
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1、Contents Chapter Adjustment Procedures Schematic Diagrams and CBAs Exploded Views Mechanical and Electrical Parts Lists Sec. 1: Survey of versions: Published by FU-KC 0524 Service AV Systems Printed in The Netherlands Subject to modification Version 1.0 /75 PAL DVD + VCR CombiDVP3050V/75 c Copyright
2、 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.
3、 CLASS 1 LASER PRODUCT KLASSE 1 LASER PRODUKT KLASS 1 LASER APPARAT CLASSE 1 PRODUIT LASER GB 3139 785 31020 Service Manual ServiceService ServiceService Service RadioFans.CN 收音机爱 好者资料库 MAIN SECTION DVD PLAYER when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-I
4、C and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1.The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2.Do
5、not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Fig. S-1-1 1-3-3DVDN_PC_SN 3.The flat pack-IC on the CBA is affixed with glue, so be c
6、areful not to break or damage the foil of each pin or the solder lands under the IC when removing it. With Soldering Iron: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easi
7、ly. (Fig. S-1-3) 2.Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 3.Bottom of the flat pack-IC is fixed with glue to the C
8、BA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1.Using desoldering braid, remove the solder from all pins
9、 of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2.Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3.While heating the pins using a fine tip soldering iron or hot air blower, pull up
10、 the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5. 4.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be me
11、lted). (Fig. S-1-6) 5.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force
12、 is applied. Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Solderi
13、ng Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 1-3-4DVDN_PC_SN 2. Installation 1.Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. 2.The “” mark on the flat pack-IC indicates pin 1. (See Fig. S
14、-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3.Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. Instructions for Handling Semi- conductors Electrostat
15、ic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body. 2. G
16、round for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid co
17、ntacting semi-conductors with your clothing. Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-7 Presolder CBA Flat Pack-IC Fig. S-1-8 CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M CBA 1-4-1H9923FIS FUNCTION INDICATOR SYMBOLS Note: If a mechanical malfunction occurs, t
18、he power is turned off. When the power comes on again after that by pressing STANDBY-ON button, an error message is displayed on the TV screen for 5 seconds. TV screen When reel or capstan mechanism is not functioning correctly When tape loading mechanism is not functioning cor- rectly When cassette
19、 loading mechanism is not functioning correctly When the drum is not working properly P-ON Power safety detection MODEINDICATOR ACTIVE When reel or capstan mechanism is not functioning correctly “A R” is displayed on a TV screen. (Refer to Fig. 1.) When tape loading mechanism is not func- tioning co
20、rrectly “A T” is displayed on a TV screen. (Refer to Fig. 2.) When cassette loading mechanism is not functioning correctly “A C” is displayed on a TV screen. (Refer to Fig. 3.) When the drum is not working properly “A D” is displayed on a TV screen. (Refer to Fig. 4.) P-ON Power safety detection “A
21、P” is displayed on a TV screen. (Refer to Fig. 5.) A R Fig. 1 A T Fig. 2 A C Fig. 3 Fig. 4 A D A P Fig. 5 1-5-1H9924PFS PREPARATION FOR SERVICING How to Enter the Service Mode About Optical Sensors Caution: An optical sensor system is used for the Tape Start and End Sensors on this equipment. Carefu
22、lly read and follow the instructions below. Otherwise the unit may operate erratically. What to do for preparation Insert a tape into the Deck Mechanism Assembly and press the PLAY button. The tape will be loaded into the Deck Mechanism Assembly. Make sure the power is on, connect TP501 (S-INH) to G
23、ND. This will stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs are connected before plugging in the unit, the function of the sensors will stay valid.) See Fig. 1. Note: Because the Tape End Sensors are inactive, do not run a tape all the way to the start or th
24、e end of the tape to avoid tape damage. Q504 Q503 TP501 S-INH Fig. 1 1-6-1H9923IB OPERATING CONTROLS AND FUNCTIONS 1-6-2H9923IB 1-7-1H9923SNA SIGNAL NAME ABBREVIATIONS Signal NameFunction -FLFIP Drive Power Supply A-COMAudio Head Common AUDIO-INAudio Signal Input AUDIO(L)-INAudio(L) Signal Input AUD
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