Philips-MX-5100-VR-Service-Manual(1) 电路图 维修手册.pdf
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1、CLASS 1 LASER PRODUCT Service Manual Service ServiceService ServiceService MX5100VR/00/02/05 Copyright 2003 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by
2、any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Published by KC 0339 Service AudioPrinted in The NetherlandsSubject to modification GB 3139 785 30490 DVD-VCR Receiver Version 1.0 CONTENTS Section 1: Main Section Adjustment Procedure Schematic Di
3、agrams and CBAs (PC Boards) Exploded Views Electrical when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) Caution: 1. Do not s
4、upply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 2. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage t
5、he foil of each pin or the solder lands under the IC when removing it. Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 1-3-2NOTE_1-3
6、With Soldering Iron: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2)Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire t
7、o which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) (3)Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and
8、 heat up. Then remove (glue will be melted). (Fig. S-1-6) (4)Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6) With Iron Wire: (1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC
9、, you can remove it easily. (Fig. S-1-3) (2)Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3)While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown i
10、n Fig. S-1-5 (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6)
11、 Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering
12、 Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 1-3-3NOTE_1-3 2. Installation (1)Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA s
13、o you can install a replacement flat pack-IC more easily. (2)The “ I ” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) (3)Solder all pins o
14、f the flat pack-IC. Be sure that none of the pins have solder bridges. Instructions for Handling Semi-conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electro- static charge during unpacking or repair work. 1. Ground for Human Body Be sure t
15、o wear a grounding band (1M) that is prop- erly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1M) on the workbench or other surface, where the semi-conductors are to be pla
16、ced. Because the static electricity charge on cloth- ing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing. Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-7 Presolder CBA Flat Pack-IC Fig. S-1-8 CBA CBA Grounding
17、Band Conductive Sheet or Copper Plate 1M 1M 1-4-1E9015PFS PREPARATION FOR SERVICING How to Enter the Service Mode About Optical Sensors Caution: An optical sensor system is used for the Tape Start and End Sensors on this equipment. Carefully read and follow the instructions below. Otherwise the unit
18、 may operate erratically. What to do for preparation Insert a tape into the Deck Mechanism Assembly and press the PLAY button. The tape will be loaded into the Deck Mechanism Assembly. Make sure the power is on, connect TP501 (SENSOR INHIBITION) to GND. This will stop the function of Tape Start Sens
19、or, Tape End Sensor and Reel Sensors. (If these TPs are connected before plugging in the unit, the function of the sensors will stay valid.) See Fig. 1. Note: Because the Tape End Sensors are inactive, do not run a tape all the way to the start or the end of the tape to avoid tape damage. TP501 S-IN
20、H Q504 Q503 Fig. 1 1-5-1E9015IB OPERATING CONTROLS AND FUNCTIONS MX5100VR/00 1-5-2E9015IB 1-5-3E9015IB 1-5-4E9016IB MX5100VR/05 1-5-5E9016IB 1-5-6E9016IB 1-5-7E9017IB MX5100VR/02 1-5-8E9017IB 1-5-9E9017IB 1-6-1E9515SNA SIGNAL NAME ABBREVIATIONS Signal NameFunction -FLFIP Drive Power Supply 2CH2 Chan
21、nel Audio Signal 33/36MDA Converter Clock 6CHDolby Digital 5.1ch Audio Signal 8POUT-1/2 Control SCART 1 8Pin Level by using 8POUT-1 and 8POUT-2 A-COMAudio Head Common A-INAudio Signal Input A-MODEHi-Fi Tape Detection Signal A-MUTE-H Audio Mute Control Signal (Mute = “H”) A-OUTAudio Signal Output A-P
22、B/REC Normal Audio Play Back/Record Signal AC INAC Power Supply Input ADAC Advanced Digital audio Acoustic Coding AE-HAudio Erase Head AFC Automatic Frequency Control Signal AGCIF AGC Control Signal AL+12V Always +12V with AC Plug Connected AL+2.35V Always +2.35V with AC Plug Connected AL+20.5V/ +12
23、V Always +15V/+12V with AC Plug Connected AL+4V Always +4V with AC Plug Connected AL+5V Always +5V with AC Plug Connected AL+9V Always +9V with AC Plug Connected AL-30V Always -30V with AC Plug Connected AMPCCTL AMP Connected Terminal AMPVccAMPVcc AMPVREF inV-Ref for CTL AMP AMPVREF OUT V-Ref for CT
24、L AMP ASPECTAspect Switching Signal AVcc A/D Converter Power Input/ Standard Voltage Input C-CONTCapstan Motor Control Signal C-F/R Capstan Motor FWD/REV Control Signal (FWD=”L”/REV=”H”) C-FG Capstan Motor Rotation Detection Pulse C-POW-SWCapstan Power Switching Signal C-ROTA Color Phase Rotary Chan
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