Philips-MCM-298-Service-Manual(1) 电路图 维修手册.pdf
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1、 MCM298/37/55 Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior
2、 permission of Philips. Published by SL 0629 Service Audio Printed in The Netherlands Subject to modification Micro System Version 1.0 CLASS 1 LASER PRODUCT 3141 785 31140 TABLE OF CONTENTS Page Location of PC Boards fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheitsbauteile sind dur
3、ch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before returning set to customer perform a l
4、eakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. 1-7 INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from 1.1.2005 onwards. IDENTIFICATION: Regardless of special logo
5、(not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N: Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So from 0501 onwards = from 1 Jan 2005 onwards Important note: In f
6、act also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lea
7、d-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate so
8、lder tools applicable for lead-free solder alloy. The solder tool must be able oTo reach at least a solder-temperature of 40 oTo stabilize the adjusted temperature at the solder-tip oTo exchange solder-tips for different applications. Adjust your solder tool so that a temperature around is reached a
9、nd stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder
10、alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder
11、 alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering
12、always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly
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