Philips-HTS-3050-Service-Manual(1) 电路图 维修手册.pdf
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1、Published by KC-TE 0552 AV Systems Printed in he Netherlands Subject to modifi cation EN 3139 785 31790 HTS3050/16DVD Receiver CLASS 1 LASER PRODUCT 1 Technical Specifi cations and Connection Facilities 2 2 Measurements Setup, Service Aid fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicher
2、heitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before returning set t
3、o customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. EN 73139 785 31790Measurements Setup, Service Aid & Lead Free Requirements2. 2.1 Lead Free Requirements Pb(Lead) Free Solder
4、When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing sol
5、der-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-pas
6、te is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach
7、at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating- time of the solder-joint shoul
8、d not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIP
9、S recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead- free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service
10、-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) -
11、 lead free BGA-ICs will be delivered in so-called dry- packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL- level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). T
12、his will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On ou
13、r website www.atyourservice.ce.P you fi nd more information to: ? BGA-de-/soldering (+ baking instructions) ? Heating-profi les of BGAs and other ICs used in Philips-sets You will fi nd this and more technical information within the “magazine”, chapter “workshop news”. For additional questions pleas
14、e contact your local repair-helpdesk. EN 83139 785 317902.Measurements Setup, Service Aid & Lead Free Requirements 2.2 Service Hints CAUTION CHARGED CAPACITORS ON THE SERVO BOARD MAY DAMAGE THE DRIVE ELECTRONICS WHEN CONNECTING A NEW DRIVE.THATS WHY, BESIDES THE SAFETY MEASURES LIKE SWITCH OFF POWER
15、 SUPPLY ESD PROTECTION ADDITIONAL ACTIONS MUST BE TAKEN BY THE REPAIR TECHNICIAN. The following steps have to be done when replacing the defective loader : 1. Dismantling of the loader to access the ESD protection point if necessary. 2. Solder the ESD protection point*. 3. Disconnect fl exfoil cable
16、 from the defective loader. 4. Put a paper clip on the fl exfoil to short-circuit the contacts (fi g.1) 5. Replace the defective loader with a new loader. 6. Remove paperclip from the fl exfoil and connect it to the new loader. 7. Remove solder joint on the ESD protection point. ATTENTION: The laser
17、 diode of this loader is protected against ESD by a solder joint which shortcircuits the laserdiode to ground. For proper functionality of the loader this solder joint must be remove after connection loader to the set. Type 1 Type 2 (ESD protection point is access ble from top of loader) (ESD protec
18、tion point is accessible from bottom of the loader) *Only applicable for defective loader needed to be sent back to supplier for failure analysis and to support backcharging evidence. This is also applicable for all partnership workshops. EN 93139 785 31790Dismantling Instructions & Service Position
19、s2. 3. Mechanical Instructions 3.1 Dismantling of the Front Board, PSU Module & DVD Loader. 1) Release 4 snap hooks to remove the Front Board. - 1 snap hook each on the left & right side - 2 snap hooks on the bottom side 2) Loosen 4 screws A (See Figure 3-1) to remove the PSU Module. Figure 3-1 3) L
20、oosen 4 screws B (See Figure 3-2) to remove the DVD Loader. Figure 3-2 AA B B 3.2 Dismantling of the Tuner Module & Mono Board. 1) Loosen 1 screw C (See Figure 3-3) to remove the Tuner Module. Figure 3-3 2) Loosen 2 screws D and E (See Figure 3-4 & Figure 3-5) to remove the Mono Board. Figure 3-4(AP
21、) Figure 3-4(Europe) Figure 3-5 C D E F EN 103139 785 317903.Dismantling Instructions & Service Positions 3.3 Dismantling of the Amp-module Board 1) Loosen 4 screws F and 2 screws G (See Figure 3-6 & Figure 3-7) to remove Amp-Module Board Figure 3-6 Figure 3-7 G G H EN 113139 785 317903.Dismantling
22、Instructions & Service Positions 3.4 Service Positions Service Position - Amp Module Bd Service Position - Front Panel Service Position - Mono Board Service Position - PSU Module Insulation Sheet Amp Module Bd Insulation Sheet Front Panel Board Insulation Sheet Mono Board Insulation Sheet PSU Module
23、 EN 123139 785 317904.Service Test Program 4. Service Test Program TESTActivated withACTION EEPROM FORMAT TEST to Exit Load default data. Display shows “NEW”. Caution! All presets from the customer will be lost! ROTARY ENCODER TEST Volume Knob Display shows value for 2 seconds. Volume values increas
24、es or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached. LEAVE SERVICE TEST PROGRAM Disconnect mains cord To start service test program open the tray with remote control or front panel key, while plugging in the mains cord press 2, 5 8 on remote control, the tray will close by its
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