Philips-MCB-700-Service-Manual(1) 电路图 维修手册.pdf
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1、Version 1.0 MCB700/05 3141 785 31120 DAB Micro System Published by SL 0632 Service Audio Subject to modification Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted
2、, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Handling chip components . 1-1 Service tools . 1-1 Leadfree and safety information . 1-2 Technical specification . 2-1 Service measurement setup . 2-2 Preparations and Controls
3、.3-1.3-3 Disassembly Instruction .4-1.4-2 Software Checking . 5-1 Block diagram. 6-1 Wiring diagram . 6-2 VFD / Key Board Assembly circuit diagram . 7-1 layout diagram . 7-2 CD Block circuit diagram . 8-1 layout diagram .8-2 to 8-3 DAB Tuner board circuit diagram. . 9-1 layout diagram . 9-2 CD / MPE
4、G board circuit diagram .10-1.10-4 AMP Block circuit diagram. .11-1 layout diagram .11-2 to 11-3 Exploded view diagram . 12-1 Mechanical partslist .12-2.12-3 Electrical partslist .13-1.13-2 TABLE OF CONTENTS CLASS 1 LASER PRODUCT RadioFans.CN 收音机爱 好者资料库 1 - 1 HANDLING CHIP COMPONENTS RadioFans.CN 收音
5、机爱 好者资料库 1 - 2 INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from 1.1.2005 onwards. IDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N: Bottom line of typeplate gives a 14
6、-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So from 0501 onwards = from 1 Jan 2005 onwards Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always us
7、e SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of y
8、our solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able oTo reach at least a solder-temperature of 40 oTo stabilize the
9、 adjusted temperature at the solder-tip oTo exchange solder-tips for different applications. Adjust your solder tool so that a temperature around is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400otherwise wear-out of
10、 tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-
11、free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased a
12、t external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack
13、including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets p
14、roduced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you find more information to: BGA-de-/solderin
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