Philips-MCD-129-Service-Manual(1) 电路图 维修手册.pdf

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1、MCD109/55/98 MCD129/93/98 Copyright 2006 Philips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise witho

2、ut the prior permission of Philips. Published by SL 0635 Service Audio Printed in The Netherlands Subject to modification DVD Micro Theatre Version 1.1 CLASS 1 LASER PRODUCT 3141 785 31031 TABLE OF CONTENTS Page Location of PC Boards fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheits

3、bauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before returning set to cus

4、tomer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. 1 - 7 INFORMATION ABOUT LEAD-FREE SOLDERING Philips CE is producing lead-free sets from 1.1.2005 onwards. IDENTIFICATION: Regardle

5、ss of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Example S/N: Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12 So from 0501 onwards = from 1 Jan 2005 onwards I

6、mportant note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a r

7、epair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. U

8、se only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able oTo reach at least a solder-temperature of 40 oTo stabilize the adjusted temperature at the solder-tip oTo exchange solder-tips for different applications. Adjust your solder tool so that a temperature

9、around is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix o

10、f lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-sol

11、der with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profile of the specific BGA

12、 (for de-soldering always use the lead-free temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag,

13、the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available

14、till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets You will find this and more technical information wit

15、hin the magazine, chapter workshop news. For additional questions please contact your local repair-helpdesk. SERVICE INSTRUCTION 1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug. 2. Set the AC Power switch to the on position (keep the AC Power cord unplugged!)

16、. 3. Measure the resistance value between the pins of the AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be larger than 4.5 Mohm (For U.S. it should be between 4.2 Mohm and 12 Mohm). 4. Switch off the set, and remove the wire between the tw

17、o pins of the AC Power plug. Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points: Route the wire trees correctly and fix them with the mounted cable clamps. Check the insulation of the AC Power lead f

18、or external damage. Check the strain relief of the AC Power cord for proper function. Check the electrical DC resistance between the AC Power Plug and the secondary side (only for sets which have a AC Power isolated power supply): Check the cabinet for defects, to avoid touching of any inner parts b

19、y the customer. 1 - 8 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? CONNECTIONS 1 - 9 ? ? ? ? ? ? ? ? ? ? ? ?

20、? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 1? ? 2? ? ? ? ? ? ? ? ? ? 3? ? 4? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? CONNECTIONS 1 - 10 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 1? ? 2? ? ? 3 ? ? ? 4?B ? 5 ? ? ? ? ? ? ? 9 ? 6? ? 7? ? 8? ? 9? ? ? 0? ? !? ? 4 3 2 0 9 ! 5 6 1 8 7 CONNECTIONS 1 - 11 ? ? 1B

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