Philips-HTS-3300-Service-Manual(1) 电路图 维修手册.pdf
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1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31172 HTS3300/98/93/55/51/12/05DVD Receiver CLASS 1 LASER PRODUCT 1 Technical Specifi cations and Connection Facilities 2 2 Measurements Setup, Service Aid fr Reparaturen sind Original-Ersatzteile zu v
2、erwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before
3、 returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. EN 7HTS3300Measurements Setup, Service Aid & Lead Free Requirements2. 2.1 Lead Free Requirements Pb(Lead) Fre
4、e Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules: Important note: In fact also products of year 2004 must be treated in this way as long as you avoid m
5、ixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free s
6、older-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o
7、To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating- time of the solder-jo
8、int should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible b
9、ut PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead- free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in th
10、e Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of
11、 doubt) - lead free BGA-ICs will be delivered in so-called dry- packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL- level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity
12、Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing chang
13、es. On our website www.atyourservice.ce.P you fi nd more information to: ? BGA-de-/soldering (+ baking instructions) ? Heating-profi les of BGAs and other ICs used in Philips-sets You will fi nd this and more technical information within the “magazine”, chapter “workshop news”. For additional questi
14、ons please contact your local repair-helpdesk. EN 8HTS33003.Dismantling Instructions & Service Positions D Figure 3-4 C E 3.2 Dismantling of the Tuner Module, MONO Board, Front Board, PSU Module 1) Loosen 1 screw A (see Figure 3-3) to remove the Tuner Module (pos 1040). 2) Loosen 9 screws B (see Fig
15、ure 3-3) and 4 screws (see Figure 3-4) to remove MONO Board. 3) Release 4 snap hooks to remove Front Board. - 1 snap hook each on the left & right side (pos 161). - 2 snap hooks on the bottom side (pos 161). 4) Loosen 4 screws E (see Figure 3-4) to remove the PSU Module. 3. Dismantling Instructions
16、3.1 Dismantling of the DVD Loader 1) The tray can be manually open by inserting a minus screw drive and push the lever in the direction as shown in Figure 3-1 to unlock the tray before sliding it out. Figure 3-1 2) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 3-2. Figure
17、 3-2 3) Loosen 5 screws to remove the Front Top.(pos 240) - 1 screw each on the left & right side (pos 272) - 3 screws behind 4) Loosen 4 screws C (see Figure 3-4) to remove the DVD Loader. BB B A Figure 3-3 EN 9HTS33003.Dismantling Instructions & Service Positions 3.3 Service Positions Mono Board T
18、hick Insulation Sheet Front Board Thick Insulation Sheet PSU Board DVD Loader EN 10HTS33004.Service Test Program 4. Service Test Program TESTActivated withACTION EEPROM FORMAT TEST to Exit Load default data. Display shows “NEW”. Caution! All presets from the customer will be lost! ROTARY ENCODER TES
19、T Volume Knob Display shows value for 2 seconds. Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached. LEAVE SERVICE TEST PROGRAM Disconnect mains cord LX8300SA & LX8320SA & LX8500W_Service Test Program_dd wk0429 To start service test program open the tray
20、with remote control or front panel key, while plugging in the mains cord press 2, 5 8 on remote control, the tray will close by itself and the set will display shown “S-Vxx-yy” Display shows “SERVICE” followed by ROM version “S-Vxx-yy” S refers to Service Mode V refers to Version xx refers to Softwa
21、re version number of BEA (counting up from 01 to 99) yy refers to Software version number of Front uP (counting up from 01 to 99) 4.1 Display Test Purpose: This test is used to check the driving circuits, the display and whether there are any short-circuits, open-circuits or any other defects. Playe
22、r: Following display patterns are used to test the display and its connections to P. Pattern 1: Default: All display control pins are ON - to check the open-circuits Pattern 2: Alternate display control pins are on (Test Pattern: 0 x55) - to check the short-circuits on Data port Receiver: Following
23、display patterns are used to test the display and its connections to P. Pattern 1: Default: All display control pins are ON - to check the open-circuits Pattern 2: Alternate display control pins are on (Test Pattern: 0 x55) - to check the short-circuits on Data port key DisplayTest triggered? n y Ac
24、tivate and display Pattern1 key DisplayTest triggered? n y Activate and display Pattern2 Main Menu Display Test key triggered? n y EN 11HTS33004.Service Test Program 4.1.1 Reprogramming of DVD version Matrix After repair, the customer setting and region code may be lost. Reprogramming will put the s
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