Philips-HTS-3021-Service-Manual(1) 电路图 维修手册.pdf

《Philips-HTS-3021-Service-Manual(1) 电路图 维修手册.pdf》由会员分享，可在线阅读，更多相关《Philips-HTS-3021-Service-Manual(1) 电路图 维修手册.pdf（51页珍藏版）》请在收音机爱好者资料库上搜索。

1、 1 - 1 DVD Home Theater System Service HTS3021/98/94 TABLE OF CONTENTS Chapter LASER BEAM SAFETY PRECAUTIONS.1-2 STANDARD NOTES FOR SERVICING.1-3 SAFETY AND IMPORTANT NOTICE.1-7 LOCATION OF PCB BOARDSVERSION VARIATION .2-1 REMOTE CONTROL.2-2 OPERATING CONTROLS AND FUNCTIONS .2-3 SPECIFICATIONS .3-1

2、MEASUREMENT SETUP. 3-2 . SYSTEM,REGION CODE,ETC.SETTING PRODURE.3-3 RETURN UNIT TEST FLOW.3-4 MAIN UNIT REPAIR CHART.3-5 DISASSEMBLY INSTRUCTIONS .4 BLOCK WIRING DIAGRAM.5 AMPLIFIER BOARDLED + KEY BOARD DECODE BOARDPOWER BOARD.6 MECHANICAL EXPLODE VIEWPART LIST.10 REVISION LIST.11 Copyright 2009 Phi

3、lips Consumer Electronics B.V. Eindhoven, The Netherlands All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Publishe

4、d by LM0909 Service Audio Printed in The Netherlands Subject to modification Version 1.0 GB 3139 785 3483 0 Service Manual . . RadioFans.CN 收音机爱好者资料库 LASER BEAM SAFETY PRECAUTIONS This DVD player uses a pickup that emits a laser beam. Do not look directly at the laser beam coming from the pickup or

5、allow it to strike against your skin. The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser beam. CAUTION: Use of controls and a

6、djustments, or doing procedures other than those specified herein, may result in hazardous radiation exposure. CAUTION LASER RADIATION WHEN OPEN. DO NOT STARE INTO BEAM. Location: Top of DVD mechanism. Page 1 of 51 1 - 2 RadioFans.CN 收音机爱好者资料库 STANDARD NOTES FOR SERVICING Circuit Board Indications 1

7、. The output pin of the 3 pin Reg u lato r ICs i s indicated a s shown. 2. For othe r ICs, pin 1 a n d every fifth pin are indicated a s shown. 3. The 1st pin of every male con n ec tor i s indicated a s shown. Instructions for Connectors 1. When you connect or disconnect the FFC (Flexible Foil Conn

8、ector) cable, be sure to first disconnect the AC cord. 2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle. Pb (Lead) Free Solder When soldering, be sure to use the Pb free solder. IDENTIFICATION: Regardless of special logo (not always indicated) On

9、e must treat all sets from 1.1.2005 onwards, according next rules. Important note: In fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-

10、free technology some rules have to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your solder-equipment. In general use of solder paste within works

11、hops should be avoided because paste is not easy to store and to handle. Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able To reach at least a solder-temperature of 400C, To stabilize the adjusted temperature at the solder-tip To exchange solder-tips f

12、or different applications. Adjust your solder tool so that a temperature around 360C - 380C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and flux-fluid will be d

13、estroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid, clean carefully the sold

14、er-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12nc-recognizable solderin

15、g temperature profile of the specific BGA (for desoldering always use highest lead-free Page 3 of 51 1 - 3 RadioFans.CN 收音机爱好者资料库 temperature profile, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the IC agains

16、t moisture. After opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be baked dry. This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spar

17、e-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you find more information to: BGA-de-/soldering (+ baking instructions) Heating-profiles of BGAs and other ICs used in Philips-sets. You will find this and mor

18、e technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. How to Remove / Install Flat Pack-IC 1. Removal With Hot-Air Flat Pack-IC Desoldering Machine: 1. Prepare the hot-air flat pack-IC desoldering machine, then app

19、ly hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1) 2. Remove the flat pack-IC with tweezers while applying the hot air. 3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat u

20、p. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2. Do not suppl

21、y hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) 3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the f

22、oil of each pin or the solder lands under the IC when removing it. With Soldering Iron: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Lift each lead

23、 of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 1 - 4 3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire f

24、lat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. Wh

25、en you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solde

26、r melts so as to lift the IC leads from the CBA contact pads as shown in Fig.S-1-5. 4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5.

27、 Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Insta

28、llation 1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily. 2. The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning

29、for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges. 1 - 5 2. Ground for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the wor

30、kbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing. Instructions for Handling Semiconductors Electrostatic breakdown

31、of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body. 1 - 6 Safety and

32、important notice Warning Risk of overheating! Never install the Home Theater System in a confi ned space. Always leave a space of at least 4 inches around the Home Theater System for ventilation. Ensure curtains or other objects never cover the ventilation slots on the Home Theater System. Never pla

33、ce the Home Theater System, remote control or batteries near naked fl ames or other heat sources, including direct sunlight. Only use this Home Theater System indoors. Keep this Home Theater System away from water, moisture and liquid-fi lled objects. Never place this Home Theater System on other el

34、ectrical equipment. Keep away from this Home Theater System during lightning storms. Where the mains plug or an appliance coupler is used as the disconnect device, the disconnect device shall remain readily operable. Visible and invisible laser radiation when open. Avoid exposure to beam. Recycle no

35、tice This electronic equipment contains a large number of materials that can be recycled or reused if disassembled by a specialized company. If you are disposing of an old machine, please take it to a recycling center. Please observe the local regulations regarding disposal of packaging materials, e

36、xhausted batteries and old equipment. Copyright notice This product incorporates copyright protection technology that is protected by method claims of certain U.S. patents and other intellectual property rights owned by Macrovision Corporation and other rights owners. Use of this copyright protectio

37、n technology must be authorised by Macrovision Corporation, and is intended for home and other limited viewing uses only unless otherwise authorised by Macrovision Corporation. Reverse engineering or disassembly is prohibited. About Progressive Scan Consumers should note that not all high defi nitio

38、n television sets are fully compatible with this product and may cause artifacts to be displayed in the picture. In case of 525 or 625 progressive scan picture problems, it is recommended that the user switch the connection to the standard defi nition output. If there are questions regarding our TV

39、set compatibility with this model 525p and 625p DVD player, please contact our customer service center. 1 - 7 LOCATION OF PCB BOARDS LED BOARD VERSION VARIATION: Type/Versions Features Output Power-200W Voltage(110V-240V) SERVICE SCNARIO MATRIX: Type/Versions Board in used /94 HTS3021 /98 HTS3021 /9

40、4 /98 DECODE BOARD KEY BOARD AMP BOARD POWER BOARD DECODE board C C POWER board C C AMP board C C LED board C C KEY board C C *C=Component Level Repair 2 - 1 (Open/Close ) Opens or closes the disc compartment. Source buttons AUDIO SOURCE : Selects an audio input source. RADIO : Switches to FM band.

41、USB : Switches to the USB source. DISC : Switches to the disc source. SETUP Accesses or exits the setup menu. (Navigation buttons ) Navigates through the menus. Press left and right for fast backward or forward search. In radio mode, press up and down to tune the radio frequency. In radio mode, pres

42、s left or right to start auto search. INFO For discs, displays information about the current status or the disc. For slideshows, displays a thumbnail view of photo fi les. (Play/Pause ) Starts, pauses or resumes disc play. In radio mode, automatically tunes radio stations during fi rst-time setup. (Stop ) Stops disc play. In radio mode, erases the current preset radio station. SURR (Surround Sound) Switches to supported surround sound or stereo sound. AUDIO SYNC Selects an audio language or channel on a disc. Press and hold to access th