Philips-HTS-5500-C-Service-Manual(1) 电路图 维修手册.pdf
《Philips-HTS-5500-C-Service-Manual(1) 电路图 维修手册.pdf》由会员分享,可在线阅读,更多相关《Philips-HTS-5500-C-Service-Manual(1) 电路图 维修手册.pdf(56页珍藏版)》请在收音机爱好者资料库上搜索。
1、Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31200 HTS5500C/37/55DVD Player CLASS 1 LASER PRODUCT 1 Technical Specifi cations and Connection Facilities 2 Location of PC Boards 2 Technical Specifi cations 3 Measurement Setup 4 Service Aids 5 Lead
2、Free Requirements 7 2 Dismantling instructions fr Reparaturen sind Original-Ersatzteile zu verwenden. Sicherheitsbauteile sind durch das Symbol ! markiert. I Le norme di sicurezza esigono che lapparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a
3、quelli specificati. Componenty di sicurezza sono marcati con ! GB After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed 0.5mA. Technical Specifi
4、 cations and Connection Facilities EN 7HTS5500C/37/55 Technical Specifi cations and Connection Facilities1. Lead Free Requirements Pb(Lead) Free Solder When soldering , be sure to use the pb free solder. INDENTIFICATION: Regardless of special logo (not always indicated) one must treat all sets from
5、1 Jan 2005 onwards, according next rules: Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this. Due to lead-free technology some rules have
6、 to be respected by the workshop during a repair: Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because
7、paste is not easy to store and to handle. Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different application
8、s. Adjust your solder tool so that a temperature around 360C 380C is reached and stabilized at the solder joint. Heating- time of the solder-joint should not exceed 4 sec. Avoid temperatures above 400C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear
9、-out of tips switch off un-used equipment, or reduce heat. Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead- free,
10、clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies. Special information for BGA-ICs: - always use the 12
11、nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt) - lead free BGA-ICs will be delivered in so-called dry- packaging (sealed pack including a silica gel pack) to protect the IC against moisture. After
12、 opening, dependent of MSL- level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all. For sets produced before 1.1.2005 (except products of 2004), containing leaded
13、solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes. On our website www.atyourservice.ce.P you fi nd more information to: ? BGA-de-/soldering (+ baking instructions) ? Heating-profi les of BGAs and other IC
14、s used in Philips-sets You will fi nd this and more technical information within the “magazine”, chapter “workshop news”. For additional questions please contact your local repair-helpdesk. EN 8HTS5500C/37/552. 2.1 Dismantling of the SD5.5_5dis changer 1) The tray can be manually open by inserting a
15、 minus screw drive and push the lever in the direction as shown in Figure 1 to unlock the tray before sliding it out. 2) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 2. Figure 1 3) Loosen 7 screws to remove the Front Top.(pos 240) - 2 screw each on the left & right side
16、(pos 272) - 3 screws A behind 4) Loosen 6 screws G (see Figure 4a and 4b) to remove the SD5.5_5dis changer. Figure 2 2. Dismantling Instructions Push lever in direction shown to open the tray manually 2.2 Dismantling of the Tuner Module, AV Board, SD6.3 ,Front Board, PSU Module 1) Loosen 2 screw B (
17、see Figure 3a) to remove the Tuner Module (pos 1040). 2) Loosen 4 screws C (see Figure 3b) to remove AV Board 1. 3) Loosen 4 screws D (see Figure 3c) and 2 screws H (see Figure 4a) to remove AV Board 2. 4) Loosen 2 screws E (see Figure 4a) to remove the PSU Module. 5) Loosen 6 screws I (see Figure 4
18、a) and 4 snap hooks to remove Front Board. - 1 snap hook each on the left & right side (pos 161). - 2 snap hooks on the bottom side (pos 161). Figure 3a Figure 3b Figure 3c D A B C Dismantling Instructions & Service Positions EN 9HTS5500C/37/552.Dismantling Instructions & Service Positions Figure 4a
19、 2.3 Service Positions Figure 5 Figure 7 Figure 4b Figure 6 Figure 8 I E G H F Catch G Insert Thick Insulation Sheet in between the AV Board 1 and 2. AV Board 2 AV Board 1 AV Board 1 Thick Insulation Sheet Thick Insulation Sheet PSU Thick Insulation Sheet Front Board Thick Insulation Sheet SD6.3 AV
20、Board 2 EN 10HTS5500C/37/55 3. Diagnostic Software Service test program To start service test program hold open/close and buttons depressed while plugging in the mains cord Display shows “SERVICE” followed by ROM version “S-Vxx-yy” S refers to Service Mode V refers to Version xx refers to Software v
21、ersion number of BEA (counting up from 01 to 99) yy refers to Software version number of Front uP (counting up from 01 to 99) Hold open/close and buttons depressed till the Display shown “S-Vxx-yy” TESTActivated withACTION EEPROM FORMAT TEST DISC 1 Load default data. Display shows “NEW”. Caution! Al
22、l presets from the customer will be lost! ROTARY ENCODER TEST Volume Knob Display shows value for 2 seconds. Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached. LEAVE SERVICE TEST PROGRAM Disconnect mains cord Main Menu Key “Display Test” triggered? Displ
23、ay Test n Activate and display “Pattern1” y Display Test Following display patterns are used to test the display and its connections to P. Pattern 1: All display control pins are ON All LEDs are ON. - to check for open-circuits Pattern 2: Alternate display control pins are ON (Test Pattern: 0 x55) T
24、he following LEDs are ON: DiscAvailable1 DiscAvailable3 DiscAvailable5 DiscActive2 DiscActive4 - to check for short-circuits (tbd) Key “Display Test” triggered? n y Activate and display “Pattern2” Key “ ” triggered? n y Key “ ” triggered? y n 3.Diagnostic Software EN 11HTS5500C/37/55 Reprogramming o
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- Philips-HTS-5500-C-Service-Manual1 电路图 维修手册 Philips HTS 5500 Service Manual 维修 手册
收音机爱好者资料库所有资源均是用户自行上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作他用。



Marshall-9100-62-02-Schematic电路原理图.pdf


