Philips-MCD-785-Service-Manual(1) 电路图 维修手册.pdf

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1、Published by SW-KM 1212 AVMPrinted in the Netherlands MCD785/51 Subject to modi cationEN Micro Audio System ContentsPageContentsPage Copyright 2012 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval

2、system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips. Version 1.0 1 Technical Specification and Connection Facilities 2 Laser Beam Safety Precautions. 2-1 3 Important Safety Precautions . 3-1 to 3-2 4 Safety Ch

3、eck After Servicing . 4-1 6 Standard Notes For Servicing,Lead Free Requirements 2.1.2 Styling, Forms and Functions MCD780 can be placed on a tabletop which should have a form factor and footprint that can be easily be located in a 2nd room such as in the bedroom or small study room. 2.1.3 External I

4、/O Connections 587DCM l edoM Stroke Version 51 Europe no i geR iPod dock with Authentication chip NA USB Port MP3 Link Port (3.5mm audio jack) Aux In Port (RCA cinch) Tuner Socket (for FM) HDMI output port SPDIF/Coaxial Port AV Port (R/L/CVBS) RCAx3 Video Port (Y/U/V) RCAx3 NA RadioFans.CN 收音机爱 好者资料

5、库 Technical Specification and Connection Facilities 1-3 S-Video port NA Headphone Port (3.5mm audio jack) M-Boy port(3.5mm headphone jact) NA 2.1.4 ACCESSORIES 857DCM l edoM Stroke Version /51 Region Europe Power Cord 1.8M AV cable(Y color) 1.5M Audio cable (3.5mm audio) 0.5M Tuner Antenna 1.5M pigt

6、ail Speaker cable 3M USB cable NA Remote Control 40keys Battery 2xAAA 2.1.5 Controls, Local Display and LED Indications Control keys on the set are: 1. Standby-On 2. Eject 3. Play/Pause 4. Next 5. Pre 6. Source (Disc, USB, Dock, FM, Aux, MP3) 7. Stop 8. Volume Knob There is local display VFD. 3 dim

7、level. There are only LEDs for indications. Standby LED colour: Red in Standby mode, and Two Blue LED for . 2.2 Mechanical General Information The product appearances and functions are defined in their respective MUS. Product management approves the MUS and it is a leading document where product app

8、earance is applicable. Please refer to Sh560 for mechanical information. Technical Specification and Connection Facilities 1-4 2.3 Safety Standards Where applicable: For /12 (EU), /05 (UK), /51 (Russia) EN/IEC 60065 7th Edition For /37 (US, Canada) UL 60065 For /55 (LATAM), /78 (Brazil) IEC 60065 7t

9、h Edition For /98 (AP), /69 (Singapore), /75 (Australia) IEC 60065 7th Edition For /93 (China) GB 8898 (IEC 60065 7th Edition) For /61 (Korea) K 60065 6th Edition For /96 (Taiwan) CNS 14408 (IEC 60065 7th Edition) 2.4 EMC Requirements Where applicable: For /12 (EU), /05 (UK), /51 (Russia) EN55013: 2

10、001, EN55020: 2002 For /37 (US, Canada) FCC15 For /55 (LATAM), /78 (Brazil) CISPR13 For /98 (AP), /69 (Singapore), /75 (Australia) CISPR13 For /61 (Korea) CISPR13/20 For /93 (China) GB 13837 (CISPR13) For /96 (Taiwan) CNS 13439 (CISPR13) 2.5 ESD Requirements The product shall withstand electro stati

11、c discharges on all user accessible parts of the product. Reference: IEC61000-4-2. For contact discharges: Level General (kV) USA (kV) Requirement 1 0-2 0-3 No deviations allowed. 2 2-4 3-4 Short perceptible deviations allowed. 3 8 8 Components damage not allowed. For air discharge: Level General (k

12、V) USA (kV) Requirement 1 0-4 0-6 No deviations allowed. 2 4-8 6-8 Short perceptible deviations allowed. 3 8 15-18 Components damage not allowed. General requirement: 1. 10 arcs for positive and negative polarity for unit “on” and “off” for 1kV incremental steps. 2. Component or mechanical damage is

13、 not allowed. No loss of fixed stored data (stored in EEPROMs). 3. Hang-ups and malfunctions are allowed, as long as the customer can “recover” from the hang-up by pressing the Standby or ON/OFF button of the set. 4. Failures that disappear only by unplugging the AC mains cord and/or power sources a

14、re not acceptable. Technical Specification and Connection Facilities 1-5 2.6 Environmental Condition The environmental condition requirements and test method is according to UAN-D1590. Ambient temperature : max. 40 C - all climates Apparatus acc. to spec. : +5 to + 35 C Vibration test (acc. IEC 60 0

15、68/2/6) : operational vibration test to be proceeded in operating position of the set. 2.7 Quality PQR-class: class ? according to BLC A when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release

16、the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) CAUTION: 1.The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2.Do not supply hot air to the chip parts around the flat pack-IC for over 6 s

17、econds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Fig. S-1-1 Standard Notes for Servicing, Lead Free Requirements when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and

18、 heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, yo

19、u can remove it easily. (Fig. S-1-3) 2.Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3.While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig.

20、 S-1-5. 4.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note:When

21、using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-

22、1-2 Flat Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 6-3 Standard Notes for Servicing, Lead Free Requirement

23、s IOA Gxyz_D1# Gxyz_D2# V1.12009.02.171),Modify CE31 from 47uF to 220uF for power noise improve; 2),Add 100 ohm resistance R160 and R161 to XI and XO nets for tune DPD performance; 3),Delete Q11 for costdown; 4),change L8 from 100uH to FB/200ohm. Play DVD 2),TMDS siganl length must less than 5cm; 3)

24、,Differential impedance must control at 100 ohm. HDMI_CLK HDMI_SDA CEC R41933/NC 12 D4 ESD/NC D24 NC R11847K R1330/NC R104 0R R122 220 R1290/NC 12 D6 ESD/NC R85 75/NC 2 13 Q19 2N3906 R119 47K R115 27K R106 75/NC L30FB/0603 C34 47pF/NC 12 D8 ESD/NC L23 1.8uH/SMD/NC R112 4.7K D18 NC D16 NC D23 NC S1A

25、2 S2A 3 S1B 5 S2B 6 S1C 11 S2C 10 S1D 14 S2D 13 IN 1 /EN 15 VDD 16 DD 12 DC 9 DB 7 DA 4 GND 8 U6 PT2328/NC SSOP16 R1280/NC C39 47pF/NC D17 NC R81 75/NC D26 NC L32FB/0603 12 D11 SS14(5819) L26 1.8uH/SMD/NC C300.1uF/NC C32 47pF/NC R120100K CB46 0.1uF R1320/NC R123 33/NC R79 100/NC C31 330pF/NC 1 2 3 4

26、 5 P6 GPIF32T/NC GPIF32T D15 NC R89 75/NC D22 NC R111 1.8K D19 NC D28 NC R1161K 1 2 CON5 AV1-8.4-14D(Black? AV1-8.4-8D C40 10PF L29FB/0603 C38 47pF/NC 1 R109 1.8K + CE28 100uF/16V + 2 5 1 3 4 6 P2 AV3-8.4-14D/NC AV3-8.4-14D C35 47pF/NC R1171K R114 18K R4180/NC L28FB C33 47pF/NC L31FB/0603 C37 47pF/N

27、C CB44 0.1uF R113 4.7K R1310/NC R990 D25 NC 1 2 CON6 AV1-8.4-14D(Yellow) AV1-8.4-8D 1 2 3 4 CON2 CON2.0-4/NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 2221 2023 J1 HDMI TYPE-A L33 FB/0603 D21 NC C36 47pF/NC R12133/NC L38FB/0603/NC D20 NC 2 13 Q20 2N3906 D27 NC R1300/NC 2 13 Q21 2N3904 R78100/N

28、C L24 1.8uH/SMD/NC + CE29 CD11X/47UF16V/D5H7/NC + TP44 L27 1.8uH/SMD/NC Decoder Board - Circuit Diagram 4 12-1212-12 Decoder Board - Layout Diagram 12-1312-13 Exploded View PCB1 PCB2 S005 S008 S007 S001 S004 S002、S003 Standby Button S006 ALU. Front Panel Spring Filter Lens PCB3 Bottom cover Screw Screw Screw Plastic Foot Rubber Foot PCB7 Screw Screw Screw Screw S009 Back cover PCB6 PCB5 DVDM Dust cover Aluminual Top Cover 13-113-1 Revision List Revision List Version 1.0 * Initial Release 14-1