Sony-BDPS500-bdp-sm 电路图 维修手册.pdf
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1、SERVICE MANUALUS Model Canadian Model AEP Model UK Model Russian Model Australian Model BDP-S500 RMT-B101A/B101P SPECIFICATIONS Ver. 1.1 2008.1 System Laser: Semiconductor laser Outputs (Jack name: Jack type/Output level/ Load impedance) AUDIO OUT L/R: Phono jack/2 Vrms/10 kilohms DIGITAL OUT (OPTIC
2、AL): Optical output jack/18 dBm (wave length 660 nm) DIGITAL OUT (COAXIAL): Phono jack/0.5 Vp-p/75 ohms 5.1CH OUTPUT: Phono jack/2 Vrms/10 kilohms HDMI OUT: HDMI 19-pin standard connector COMPONENT VIDEO OUT(Y, PB, PR): Phono jack/Y: 1.0 Vp-p/PB, PR: progressive or interlace = 0.7 Vp-p/75 ohms VIDEO
3、: Phono jack/1.0 Vp-p/75 ohms S VIDEO: 4-pin mini DIN/Y: 1.0 Vp-p, C: 0.286 Vp-p/75 ohms General Power requirements: 120 V AC, 60 Hz (US, Canadian) 220-240 V AC, 50/60 Hz (Except US, Canadian) Power consumption: 33 W Dimensions (approx.): 430 99.2 361 mm (17 4 14 1/4 in.) (width/height/depth) incl.
4、projecting parts Mass (approx.): 4.8 kg (10 3/4 lb) Operating temperature: 5 C to 35 C (41F to 95F) Operating humidity: 25 % to 80 % Supplied accessories Specifications and design are subject to change without notice. Video cord (phono plug 1) (1) Stereo audio cord (phono plug 2) (1) Power cord (1)
5、Remote commander (remote) (1) Size AA (R6) batteries (2) GNU License Information (English only) (1) (Except US, Canadian) BLU-RAY DISC PLAYER TM RadioFans.CN 收音机爱 好者资料库 2 WARNING! WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM E
6、MISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJECTIVE LENS ON THE OPTICAL PICK-UP BLOCK. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. SAFETY-RELATED COMPO
7、NENT WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Fig. A.Using an AC
8、voltmeter to check AC leakage. 1.5 k0.15 F AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 mi- c
9、roamperes). Leakage current can be measured by any one of three methods. 1.A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2.A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable
10、for this job. 3.Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indica- tion is 0.75V, so analog meters must have an accurate low- voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly a
11、ll battery operated digital multimeters that have a 2V AC range are suit- able. (See Fig. A) 1.Check the area of your repair for unsoldered or poorly-sol- dered connections. Check the entire board surface for solder splashes and bridges. 2.Check the interboard wiring to ensure that no wires are “pin
12、ched” or contact high-wattage resistors. 3.Look for unauthorized replacement parts, particularly transis- tors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4.Look for parts which, though functioning, show obvious signs of deterioratio
13、n. Point them out to the customer and recom- mend their replacement. 5.Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer. 6.Check the B+ voltage to see it is at the values specified. 7.Check the antenna terminals, metal trim, “metallized” kn
14、obs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer: CAUTION: The use of optical instrument with this product will
15、 increase eye hazard. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded
16、solder has the following characteristics. Unleaded solder melts at a temperature about 40C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set
17、to about 350C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
18、 Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. ATTENTION AU COMPOSANT AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT D
19、E FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SONY. This label is located on the laser protective housing inside the enclosure. This appliance is classified as a CLASS1 LASER product. The CLASS1 LASE
20、R PRODUCT MARKING is located on the laser protective housing inside the enclosure. RadioFans.CN 收音机爱 好者资料库 3 TABLE OF CONTENTS SectionTitlePageSectionTitlePage SERVICE NOTE 1.DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION) . 4 2.TEST DISC . 4 3.POSITION OF COUNTERMEASURE PARTS
21、 . 17 1.GENERAL Getting Started . 1-2 Basic Operations . 1-5 Watching Movie Files . 1-8 Listening to Music Files. 1-9 Viewing Photo Files. 1-10 Changing the Initial Settings . 1-11 Additional Information . 1-13 2.DISASSEMBLY AND REASSEMBLY 2-1.Disassembly Flow . 2-1 2-2.Upper Case . 2-1 2-3.Front Di
22、splay Block Assy. 2-2 2-4.Tray Cover Assy . 2-2 2-5.BD Drive (Service Use) . 2-3 2-6.MAIN Board . 2-3 2-7.AU-258 Board . 2-4 2-8.Power Block . 2-4 2-9.Circuit Boards Location . 2-5 3.BLOCK DIAGRAMS 3-1.Main Block Diagram . 3-1 3-2.Audio Block Diagram . 3-3 3-3.FL/FR Block Diagram . 3-5 3-4.Power 1 B
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