Sony-RCDW3-cd-sm 电路图 维修手册.pdf

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1、RCD-W3 US Model Canadian Model AEP Model UK Model COMPACT DISC RECORDER SERVICE MANUAL SPECIFICATIONS 9-874-117-02 2002J0200-1 2002.10 Ver 1.1 2002.10 Model Name Using Similar Machanism RCD-W1 CD Mechanism TypeCDM-700(CD-RW) Optical Pick-up TypeKRS-220C Model Name Using Similar Mechanism RCD-W1 CD M

2、echanism TypeCDM-700(CDP) CD-R CDP DECK A (the CD player section) SystemCompact disc and digital audio system LaserSemiconductor laser ( =780 nm) Emission duration: continuous Frequency response20 Hz 20,000 Hz (0.5 dB) Signal-to-noise ratioMore than 100 dB Dynamic rangeMore than 95 dB DECK B (the CD

3、-R and CD-RW recording section) SystemCompact disc digital audio system LaserSemiconductor laser ( =780 nm) Emission duration: continuous Playable discsCD, CD-R, CD-RW Recordable discsCD-R, CD-RW (for music use) Frequency response20 to 20,000 Hz 0.5 dB Signal-to-noise ratioOver 100 dB during playbac

4、k Dynamic rangeMore than 95 dB during playback Inputs ANALOG IN (Phono jacks)impedance 47 kilohms Rated input 330 mVrms Minimum input 125 mVrms DIGITAL OPTICAL IN (Square optical connector jack)Optical wavelength 660 nm General Power requirements U.S.A. and Canada120 V AC, 60 Hz Other countries110 2

5、40 V AC, 50/60 Hz Power consumption20 W Dimensions (approx.) (w/h/d) incl. projecting parts and control 430 x 108 x 368 mm Mass (approx.)4.6 kg Supplied accessories Audio connecting cord (2) Remote commander (remote) (1) Size AA (R6) batteries (2). Design and specifications are subject to change wit

6、hout notice. Outputs ANALOG OUT (Phono jacks)Rated output 2 Vrms (at 50 kilohms) Load impedance over 10 kilohms OPTICAL DIGITAL OUT (Square optical connector jack)Wavelength 660 nm Output level -18 dBm PHONES (Phone jacks)28 mW, 32 ohms Sony Corporation Home Audio Company Pubulished by Sony Engineer

7、ing Corporation RadioFans.CN 收音机爱 好者资料库 2 RCD-W3 SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for

8、AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leak- age current can be measured by any one of three meth

9、ods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by m

10、eans of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a pas- sive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are

11、 suitable. (See Fig. A) SAFETY-RELATED COMPONENT WARNING ! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPL

12、EMENTS PUBLISHED BY SONY. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of soldering iron around 270C during repairing. Do not touch the s

13、oldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. ATTENTION AU COMPOSAN

14、T AYANT RAPPORT LA SCURIT! LES COMPOSANTS IDENTIFIS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHMATIQUES ET LA LISTE DES PICES SONT CRITIQUES POUR LA SCURIT DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PICES SONY DONT LES NUMROS SONT DONNS DANS CE MANUEL OU DANS LES SUPPLMENTS PUBLIS PAR SO

15、NY. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electros

16、tatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective s

17、urface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra

18、- diation exposure. The Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. Fig. A. Using an AC voltmeter to check AC leakage. 0.15F To Exposed Metal Parts on Set 1.5k AC voltmeter (0.75V) Earth Ground RadioFans.CN 收音机爱 好者资料库 3 RCD-W3 TABLE OF CONTENTS 1

19、. SERVICING NOTE. 4 2. GENERAL. 8 3. DISASSEMBLY 3-1. Top Case. 9 3-2. Tray Door, Front Panel Assy. 10 3-3. HP board, FL board, VOL board. 10 3-4. Back Panel . 11 3-5. Audio Board . 11 3-6. Power Board . 12 3-7. CDP Deck assy (Deck A), CD-R Deck Assy (Deck B) . 12 3-8. BD-P Board (Deck A) . 13 3-9.

20、CDP Mechanism Assy (Deck A). 13 3-10.Spindle Motor Assy, Optical Pick-Up Block (Deck A). 14 3-11.BD-R Board. 14 3-12.CD-R Mechanism Assy (Deck B) . 15 4. ELECTRICAL ADJUSTMENT . 16 5. DIAGRAMS 5-1. Circuit Boards Location. 21 5-2. Block diagrams CD-R Section (1/2) . 23 Block diagrams CD-R Section (2

21、/2) . 24 Block diagrams CDP Section . 25 Block diagrams Audio Section . 26 Block diagrams Power Section . 27 5-3. Printed Wiring Board BD-R Section (Side A) . 28 Printed Wiring Board BD-R Section (Side B) . 29 5-4. Schematic Diagram BD-R Section (1/6) . 30 5-5. Schematic Diagram BD-R Section (2/6) .

22、 31 5-6. Schematic Diagram BD-R Section (3/6) . 32 5-7. Schematic Diagram BD-R Section (4/6) . 33 5-8. Schematic Diagram BD-R Section (5/6) . 34 5-9. Schematic Diagram BD-R Section (6/6) . 35 5-10. Printed Wiring Board Audio Section . 36 5-11. Schematic Diagram Audio Section . 37 5-12. Printed Wirin

23、g Board Panel Section . 38 5-13. Schematic Diagram Panel Section . 39 5-14. Printed Wiring Board Power Section . 40 5-15. Schematic Diagram Power Section . 41 5-16. Printed Wiring Board BD-P Section . 42 5-17. Schematic Diagram BD-P Section . 42 5-18. IC Pin Functions Description . 43 5-19. IC Block

24、 Diagrams. 48 6. EXPLODED VIEWS 6-1. Front Panel Section . 52 6-2. Chassis Section . 53 6-3. CD Play Section (Deck A) . 54 6-4. CD Record Section (Deck B). 55 7. ELECTRICAL PARTS LIST.56 Error Messages The following table explains the error messages that appear in the display. MessageExplanation CHE

25、CK DISC A record-related button has been pressed when a finalized disc is in the DECK B. A record-related button has been pressed when a standard CD is in the DECK B. DATA DISCA non-audio CD-ROM or a CDVideo disc has been placed in the machine. DISC ERROR An unfinalized disc has been placed in the D

26、ECK A. There is a problem with the disc. A DVD disc has been placed in the unit. DISC FULLThere is not enough time left on the disc to complete a planned recording. ERRORThere is a problem with the tray. FAILEDA dubbing has not been completed properly. FULLMore than 20 tracks have been programmed. N

27、O AUDIOA record-related button has been pressed when a non-audio disc is in the DECK B. RadioFans.CN 收音机爱 好者资料库 4 RCD-W3 SECTION 1 SERVICING NOTE NOTES REGARDING HANDLING OF THE PICK-UP 1. Notes for transport and storage 1) The pick-up should always be left in its conductive bag until immediately pr

28、ior to use. 2) The pick-up should never be subjected to external pressure or impact. 2. Repair notes 1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials. 2) The pick-up should always be handled correctly and carefully , taking care to avoid externa

29、l pressure and impact. If it is subjected to pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board. 3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installatio

30、n screws should absolutely never be touched. 4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged. 5) Cleaning the lens surface If there is dust on the lens surf

31、ace, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton swab should be used, taking care not to distort this. 6) Never attempt to disassemble the pick-up. Spring by excess pre

32、ssure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up. Storage in conductive bag N

33、EVER look directly at the laser beam, and dont let contact fingers or other exposed skin. Magnet How to hold the pick-up Conductive Sheet Cotton swab Pressure Pressure Drop impact 5 RCD-W3 NOTES REGARDING COMPACT DISC PLAYER REPAIRS 1. Preparations 1) Compact disc players incorporate a great many IC

34、s as well as the pick-up (laser diode). These compo- nents are sensitive to, and easily affected by, static electricity. If such static is high voltage, components can be damaged, and for that reason components should be handled with care. 2) The pick-up is composed of many optical components and ot

35、her high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnetism is present, or where there is excessive dust. 2. Notes for repair 1) Before replacing a component part, first disconnect the power supply lead wi

36、re from the unit 2) All equipment, measuring instruments and tools must be grounded. 3) The workbench should be covered with a conductive sheet and grounded. When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of dam

37、age by static electricity.) 4) To prevent AC leakage, the metal part of the soldering iron should be grounded. 5) Workers should be grounded by an armband (1M) 6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in

38、the clothing to escape from the armband. 7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin. Resistor (1M) Conductive Sheet Resistor (1M) Armband 6 RCD-W3 Electrostatically Sensitive Devices (ESD) Some semiconductor (solid state) devices can be damaged easily by

39、 static electricity. Such components com- monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir- cuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of

40、 component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist s

41、trap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur- face such as aluminum foil, to prevent electrostatic charge buildup or exposure

42、 of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ESD devices. 5. Do not use freon-propelled c

43、hemicals. These can generate electrical charges sufficient to damage ESD devices. 6. Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials). 7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will by installed. CAUTION : BE SURE NO