Marantz-BD-7004-Service-Manual 电路图 维修手册.pdf
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1、Service ManualBLU-RAY DISC Player BD7004 /U1B BD7004 S0053-1V02DM/DG1004Copyright 2010 D when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (F
2、ig. S-1-6) CAUTION: 1.The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC. 2.Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occu
3、r. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2) Top View OutIn Bottom View Input 5 10 Pin 1 Pin 1 FFC Cable Connector CBA * Be careful to avoid a short circuit. Fig. S-1-1 10 3.The flat pack-IC on the CBA is affixed with glue, so be careful not to break o
4、r damage the foil of each pin or the solder lands under the IC when removing it. With Soldering Iron: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) 2.Li
5、ft each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4) 3.Bottom of the flat pack-IC is fixed with glue to the CBA; when removing ent
6、ire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Hot-air Flat Pack-IC Desoldering Machine CBA Flat Pack-IC Tweezers Masking Tape Fig. S-1-2 Flat
7、 Pack-IC Desoldering Braid Soldering Iron Fig. S-1-3 Fine Tip Soldering Iron Sharp Pin Fig. S-1-4 11 With Iron Wire: 1.Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (F
8、ig. S-1-3) 2.Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. 3.While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5. 4.Bottom of the fl
9、at pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 5.Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, c
10、are must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied. 2. Installation 1.Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on th
11、e CBA so you can install a replacement flat pack-IC more easily. 2.The “” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the pin 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.) 3.Solder all
12、pins of the flat pack-IC. Be sure that none of the pins have solder bridges. To Solid Mounting Point Soldering Iron Iron Wire or Hot Air Blower Fig. S-1-5 Fine Tip Soldering Iron CBA Flat Pack-IC Tweezers Fig. S-1-6 Example : Pin 1 of the Flat Pack-IC is indicated by a mark. Fig. S-1-7 Presolder CBA
13、 Flat Pack-IC Fig. S-1-8 12 1-4-4BDN_SN Instructions for Handling Semi- conductors Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work. 1. Ground for Human Body Be sure to wear a grounding band (1 M) th
14、at is properly grounded to remove any static electricity that may be charged on the body. 2. Ground for Workbench Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electric
15、ity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing. CBA Grounding Band Conductive Sheet or Copper Plate 1M 1M CBA 13 7.CABINETDISASSEMBLYINSTRUCTIONS 1-5-1E5KB0DC CABINET DISASSEMBLY INSTRUCTIONS 1. Disassembly Fl
16、owchart This flowchart indicates the disassembly steps to gain access to item(s) to be serviced. When reassembling, follow the steps in reverse order. Bend, route, and dress the cables as they were originally. 2. Disassembly Method Note: (1) Identification (location) No. of parts in the figures (2)
17、Name of the part (3) Figure Number for reference (4) Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered. P = Spring, L = Locking Tab, S = Screw, CN = Connector * = Unhook, Unlock, Release, Unplug, or Desolder e.g. 2(S-2) = two Screws (S-2), 2(L-2
18、) = two Locking Tabs (L-2) (5) Refer to “Reference Notes.” About tightening screws When tightening screws, tighten them with the following torque. ID/ Loc. No. Part Removal Fig. No. Remove/*Unhook/ Unlock/Release/ Unplug/Desolder Note 1Top CoverD1 9(S-1)- 2Tray PanelD2 -1 3 Front Assembly D2 *5(L-1)
19、, *3(L-2), 2(S-2), 3(S-3), 10(S-4), *CN2002 2 4 Front A CBA D2 *CN3001- 5 Front B CBA D2 - 6 Front Bracket D3 7(S-5), (S-6)- 7SD CBAD3 2(S-7), *CN5001- 8Rear PanelD4 5(S-8), (S-9), 2(S-10), (S-11), (S-12), 11(S-13), 2(S-14), 2(S-15), *CN1006 - 3 Front Assembly 1 Top Cover 2 Tray Panel 8 Rear Panel 1
20、3 Video CBA 14 AV PCB Bracket 16 Loader Bracket 9 Motor DC Fan 10 Inlet CBA 11 RS232C CBA 6 Front Bracket 15 BD Main CBA 2-5-8-0-CLEAR Release from Service Mode Press the POWER OFF button to turn off power. Screen saver/Auto Power Off in Service Mode These functions are not performed in Service Mode
21、. After entering, Fig. k appears on the screen and Fig. l appears on the VFD. Fig. k Service Mode (Main Menu) Fig. I Service Mode Available button in service mode Note:Press the number key to select items. Or, press the cursor button (up/down) to select items and press ENTER button. Buttoncondition
22、ENTEREnter the next level POWERTurn the power off (when the service mode is completed) 17Enter the selected item (next level) OTHERNot available INDICATIONDESCRIPTIONREMARK F/W NameModel NameE5K*D, etc. RegionBD region - DVD regionA-1, etc. Release Ver.Release versionD.jpp, etc. SERVICE MODE 1: MECH
23、A TEST 2: VFD/LED TEST 3: ERROR RATE MEASURE 4: LD TEST 5: CHANNEL TEST 6: SD CARD TEST 7: DEFAULT SETTING F/W Name :* Region :*-* Release Ver. :*.* ADSP1/2 Ver. :-/- PLD Ver. :- FPGA Ver. :- I/P Scaler Ver.:- * Firmware Version differs depending on the models, and this indication is one example. 23
24、 12.TRAYLOCKMODE 1-8-1E5KB0TL TRAY LOCK MODE Tray Lock Mode prevents the tray opening or closing to prevent disc theft in demo mode. Enter this mode using the following procedure. 1.Confirm that the TV Monitor is connected. 2.With playback stopped, press SETUP, TOP MENU, 3, AUDIO, 0 and SETUP button
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