Panasonic-SABT228P-htss-sm 电路图 维修手册.pdf

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1、 Panasonic Corporation 2010. All rights reserved. Unauthorized copying and distribution is a violation of law. PSG1002042AE A6 Blu-ray Disc Home Theater Sound System Model No.SA-BT228P Volume 1 Product Color: (K).Black Type TABLE OF CONTENTS Notes: This model is based on SA-BT230/330P/PC-K (Volume 1

2、). Please refer to the original service man- ual (Order no. PSG1001003CE). Notes: 1) These models BD Drive/Main P.C.B. Module are - RFKNBT230P 2) Please refer to the original service manual for: Speaker system SB-PT480P-K, Order No. PSG0912003CE. Caution: Pairing of BD Drive and Main P.C.B. as “BD D

3、rive & Main P.C.B. Assembly” have to be replaced together. If either BD Drive or Main P.C.B. is changed, BD Drive unit has to carry out re-adjustment due to alignment data for BD Drive Unit is stored in the Main P.C.B. RadioFans.CN 收音机爱 好者资料库 2 PAGEPAGE 1 Notes:-3 2 Safety Precautions -4 2.1. GENERA

4、L GUIDELINES -4 2.2. Before Repair and Adjustment-4 2.3. Protection Circuitry-5 2.4. Safety Parts Information-5 3 Warning -6 3.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devices-6 3.2. Precaution of Laser Diode -7 3.3. Service caution based on Legal restrictions-8

5、 3.4. Handling Precautions for BD Drive -9 4 Service Navigation-10 4.1. Service Information-10 4.2. Caution for Replacing Parts - 11 5 Specifications-12 6 Location of Controls and Components-14 6.1. Remote Control Key Button Operations-14 6.2. Main Unit Key Button Operations -15 6.3. Using BD-LIVE B

6、ONUSVIEW in BD-Video-16 6.4. Using the iPod -17 6.5. Speaker Connections -19 6.6. Disc Playability -20 6.7. SD Information-22 6.8. File Extension Type Support (MP3/JPEG/ AVCHD/MPEG2 files)-23 7 Block Diagram -25 7.1. Main(System Control)-25 7.2. Main(Audio)-26 7.3. Digital Audio-28 7.4. Power Supply

7、(Main Section)-29 8 Schematic Diagram-31 8.1. Main(Micon/Tuner) Circuit -31 8.2. Panel Circuit-38 8.3. D-Amp Circuit -39 8.4. SMPS Circuit-43 8.5. Power, Power Button & AC Inlet Circuit -45 8.6. iPod/iPhone & Optical In Circuit-46 9 Printed Circuit Board -47 9.1. Main P.C.B. -47 9.2. Panel, Power, P

8、ower Button & AC Inlet P.C.B.-49 9.3. D-Amp P.C.B. -50 9.4. SMPS P.C.B. -51 9.5. iPod/iPhone & Optical In P.C.B. -52 10 Exploded View and Replacement Parts List-53 10.1. Exploded View and Mechanical replacement Part List-53 10.2. Electrical Replacement Part List -59 RadioFans.CN 收音机爱 好者资料库 3 1Notes:

9、 This service manual contains technical information which will allow service personnels to understand and service this model. If the circuit is changed or modified, this information will be followed by supplement service manual to be filled with the original service manual. 1) The base for this mode

10、l is SA-BT230/330P/PC-K. You can refer to the original service manual (SA-BT230/330P/PC-K Order no. PSG1001003CE). As such this service manual does not contain the following information as below:- Self-Diagnostic and Special Mode Setting Service Fixture & Tools Disassembly and Assembly Instructions

11、Service Position Voltage & Waveform Chart Illustration of ICs, Transistor and Diode Wiring Connection Diagram Schematic Diagram Notes Terminal Function of ICs RadioFans.CN 收音机爱 好者资料库 4 2Safety Precautions 2.1.GENERAL GUIDELINES 1. When servicing, observe the original lead dress. If a short circuit i

12、s found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed. 3. After servicing, carry out the following leakage current checks to pr

13、event the customer from being exposed to shock hazards. 2.1.1.LEAKAGE CURRENT COLD CHECK 1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipm

14、ent such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be 2.1.2.LEAKAGE CURRENT HOT CHECK 1. Plug the AC c

15、ord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, wi

16、th 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 vol

17、ts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked

18、before it is returned to the customer. Figure 1 2.2.Before Repair and Adjustment Disconnect AC power to discharge unit AC Capacitors as such (C5700, C5701, C5702, C5703, C5705, C5706) through a 10 , 10 W resistor to ground. Caution: DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instan

19、ce), as this may destroy solid state devices. After repairs are completed, restore power gradually using a variac, to avoid overcurrent. Current consumption at AC 120 V, 60 Hz in NO SIGNAL mode volume minimal should be 900 mA. 2.2.1.Caution for fuse replacement 5 2.3.Protection Circuitry The protect

20、ion circuitry may have operated if either of the following conditions are noticed: No sound is heard when the power is turned on. Sound stops during a performance. The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are “s

21、horted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used. If this occurs, follow the procedure outlines below: 1. Turn off the power. 2. Determine the cause of the problem and correct it. 3. Turn on the power once again after one minute. Note

22、: When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again. 2.4.Safety Parts Information Safety Parts List: There are special components used in this equipment which are important for safety. These parts are marked by () in the Schemat

23、ic Diagrams & Replacement Parts List. It is essential that these critical parts should be replaced with manufacturers specified parts to prevent shock, fire or other hazards. Do not modify the original design without permission of manufacturer. SafetyRef. No.Part No.Part Name & DescriptionRemarks 2R

24、EXX1030BLACK WIRE (AC-SMPS) 3REXX1031RED WIRE (AC-SMPS) 20RGRX1001P-A1REAR PANEL 29RKMX1002-K1TOP CABINET 49RFKNBT230PBD DRIVE / MAIN P.C.B ASSY 101VQL1V70-JLASER CAUTION LABEL A2K2CB2CB00021AC CORD A3VQT2T10O/I BOOK PCB1RFKNBT228PMAIN P.C.B. PCB4REPX0803KSMPS P.C.B / AC INLET P.C.B.(RTL) DZ5701ERZV

25、10V511CSZNR L5702G0B612H00002LINE FILTER L5703G0B932H00002LINE FILTER T5701ETS42BM1GGACTRANSFORMER T5751ETS19AB2A6AGSUB TRANSFORMER T6100G4D1A0000142SWITCHING TRANSFORMER PC5702B3PBA0000402PHOTO COUPLER PC5720B3PBA0000402PHOTO COUPLER PC5799B3PBA0000402PHOTO COUPLER F1K5D802APA008FUSE RY701K6B1AEA00

26、003RELAY TH5702D4CAA2R20001THERMISTOR P5701K2AB2B000007AC INLET C5700F1BAF10200201000pF C5701F0CAF104A1050.1uF C5702F0CAF104A1050.1uF C5703F0CAF104A1050.1uF C5705F1BAF22200232200pF C5706F1BAF471A013470pF 6 3Warning 3.1.Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive (ES) Devic

27、es Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec- trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The f

28、ollowing techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,

29、obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi- num f

30、oil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical

31、charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devi

32、ces are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara- ble conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into wh

33、ich the device will be installed. Caution: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or t

34、he lifting of your foot from a carpeted floor can generate static electricity (ESD) suf- ficient to damage an ES device). 7 3.2.Precaution of Laser Diode Caution: This product utilizes a laser diode with the unit turned “on”, invisible laser radiation is emitted from the pickup lens. Wavelength: 405

35、 nm (BD)/650 nm (DVD)/790 nm (CD) Maximum output radiation power from pickup: 100 W/VDE Laser radiation from the pickup unit is safety level, but be sure the followings: 1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous. 2. Do not adjust the variable resist

36、or on the pickup unit. It was already adjusted. 3. Do not look at the focus lens using optical instruments. 4. Recommend not to look at pickup lens for a long time. 8 3.3.Service caution based on Legal restrictions 3.3.1.General description about Lead Free Solder (PbF) The lead free solder has been

37、used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of ti

38、n (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86F) more than that of the normal solder. Definition of PCB Lead Free Solder being used Service caution for repair work using Lead Free Solder (PbF) The lead free solder has to be used w

39、hen repairing the equipment for which the lead free solder is used. (Definition: The letter of “PbF” is printed on the PCB using the lead free solder.) To put lead free solder, it should be well molten and mixed with the original lead free solder. Remove the remaining lead free solder on the PCB cle

40、anly for soldering of the new IC. Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the lead free solder. Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 35030

41、degrees C (66286F). Recommended Lead Free Solder (Service Parts Route.) The following 3 types of lead free solder are available through the service parts route. RFKZ03D01K-(0.3mm 100g Reel) RFKZ06D01K-(0.6mm 100g Reel) RFKZ10D01K-(1.0mm 100g Reel) Note * Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%

42、, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3% The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure) 9 3.4.Handling Precautions for BD Drive The laser diode in the optical pickup unit may break down due to static el

43、ectricity of clothes or human body. Special care must be taken avoid caution to electrostatic breakdown when servicing and handling the laser diode in the traverse unit. Figure 1 3.4.1.Grounding for electrostatic breakdown prevention Some devices such as the DVD player use the optical pickup (laser

44、diode) and the optical pickup will be damaged by static electric- ity in the working environment. Proceed servicing works under the working environment where grounding works is completed. 3.4.1.1.Worktable grounding 1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet. 3.4.1.2.Human body grounding 1. Use the anti-static wrist strap to discharge the static electricity form your body. Figure 2 10 4Service Navigation 4.1.Service Information