RCA-RTD300-cs-sm 电路图 维修手册.pdf
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1、3.1Removal of the FRONT LOADING Assy (Fig. 3.1) a. Unscrew the 2 screw holding the F/L. b. Separate the F/L ASSY from the MAIN BASE settling down point by lifting the rear part of F/L(Screw hole). 3.2 Disassembly of FRONT LOADING Assy (FIg. 3.23.5) a. Remove the one WASHER for holding the door opene
2、r and separtate F/L Assembly by moving the DOOR OPENER in the direction of arrow. b. Remove the 2 screw holding the TOP PLATE and sepa- rate the CASSETT HOLDER ASSY by moving the FL BRKT L and FL BRKT R in the direction of arrow (Fig. 3.2) 3. DISASSEMBLY AND REPLACEMENT NOTE: REMOVE THE FRONT LOADIN
3、G ASSY IN EJECT MODE Fig. 3.1 Diassembly of the FRONT LOADING ASSY Fig. 3.2 Diassembly of the FRONT LOADING ASSY RadioFans.CN 收音机爱 好者资料库 c. Separate the LOADING LEVER ASSY by pressing the connection point from the CASSETTE HOLDER ASSY.(Fig. 3.3) d. Remove the SAFETY SPRING connecting the SAFETY LEVE
4、R and CASSETTE HOLDER PLATE.(Fig. 3.3) e. Remove the RELEASE SPRING connecting the RELEASE LEVER and SAFETY LEVER.(Fig3.3) 3. 3 Disassembly of DRUM Assy (Fig. 3.5) a. Turn over the DECK MECHANISM and holding the DRUM TOTAL ASSY with hands , remove the 3 screw holding the drum total assembly with mai
5、n base. b. Separatet the DRUM TOTAL ASSY from the deck pay- ing attention there is no damage on the surface of VIDEO HEAD and DRUM. c. Assembly step is the reverse way of diassembly. DISASSEMBLY AND REPLACEMENT (CONTINUED) CAUTION: Assemble the FRONT LOADING ASSY in the reverse step of diassembly. C
6、onfirm that two bosses on the left side of the CASSETTE HOLDER ASSY are inserted in the groove on the left side of the top plate. Insert two bosses on the right side of the CASSETTE HOLDER ASSY into the groove of the F/L BRACKET R.(Fig. 3.4) FIg. 3.3 Disassembly of the CASSETTE HOLDER Assy FIg. 3.4
7、Assembly of the FL Assy CAUTION: After the assembly of the DRUM TOTAL ASSY, check out if DECK mecahnism operate smoothly and adjustment of tape transmission section is OK. FIg. 3.5 Diassembly of DRUM ASSY RadioFans.CN 收音机爱 好者资料库 3. 4. Disassembly of LOADING RACK, LOADING ASSY, S/T SLANT POLE ASSY (F
8、ig. 3.6, 3.7) a. Turn out the DECK MECHANISM and remove the LOADING RACK after unscrewing the SCREW . b. Disintegrate the R LOADING AS # and L LOADING AS $ . c. Disintegrate the S SLANT POLE AS %and T SLANT POLE AS by moving those part in arrow dircetion. 3. 5. Disassembly of the A/C HEAD ASSY (Fig.
9、 3.8) a. Remove the CONNECTOR from the AC HEAD ASSY, Watch out that there is no damage in the HEAD connecting PIN. b. Separate the AC HEAD ASSY !after unscrewing the- screw # DISASSEMBLY AND REPLACEMENT (CONTINUED) CAUTION: Take care GUIDE ROLLER of S/T SLANT POLE AS and SLANT POLE not to be stained
10、 with grease during assembly. Refer to Fig. 3.7 in assembly. FIg. 3.6 Disassembly of the LOADING RACK, LOADING ASSY and the SLANT POLE ASSY FIg. 3.7 Assembly of the L/R LOADING AS and the LOADING RACK CAUTION: After the assembly, adjust the tape transmissionsec- tion by refering to the chapter 5. Af
11、ter the adjustment of the tape transmission section, paint the 3 adjustment screw with locking paint. FIg. 3.8 Disassembly of the AC HEAD ASSY RadioFans.CN 收音机爱 好者资料库 3. 6. Disassembly of the LC BRKT ASSY, PINCH LEVER TOTAL ASSY (Fig. 3.9) a. Separate the LC BRKT Assy after removing the 3 screws !.
12、b. Separate the LC BRKT Assy from the DECK MECHANISM. c. Disintegrate the PINCH LEVER TOTAL Assy #. 3. 7. Disassembly of the CAM GEAR, RELAY LEVER, FL RACK (Fig. 3.9) a. Separate the CAM GEAR %from the MAINBASE. b. Separate the RELAY LEVER from the MAINBASE. c. Separate the FL RACK NTSC colorResolut
13、ion (VCR): Over 220 lines (Standard recording) Antenna: 75 ohm input impedanceResolution (DVD): Over 500 lines (DVD Disc PLAY) Video Signal Level: 1Vp-p (140 IRE standard)Audio (VCR): Over 68dB(Hi-Fi),over 40dB(Mono) Video output (common use of DVD and VCR):Audio (DVD): 100dB VIDEO output terminal,A
14、udio dynamic range: 70dB 1Vp-p (140 IRE standard) Video output (DVD only):S-VIDEO output (75 ohm In load Y: 1Vp-p, C:0.286Vp-p) COMPONENT Progressive output (75 ohm In load Y:1Vp-p, Pb:0.7Vp-p Pr:0.7Vp-p) Note: Specifications are subject to change without notice. CLEANING AND LUBRICATION FIXTURE ITE
15、MDESCRIPTION Path Adj FixtureUse for X-position adjust/Tape path alignment Special DriverUse for X-position adjust/Tape path alignment THE SERVICE FIXTURE Path Adj FixtureSpecial Driver AC Millivolt Meter Sensitivity: 1.0mVAC400VAC Dual-Trace Triggered Oscilloscopewith LoCap (X10) and Direct Probes.
16、 Response: DC20MHz Sensitivity: 5mV/div. Max. Sweep Rate: 0.1sec./div. Frequency Counter7 digits Sensitivity: 25mV-5V Range: 50Hz100MHz DVM Range: 0.1VDC1000VD Accuracy: 0.5% NTSC Video Signal GeneratorMust provide 1V p-p negative sync video across a 75 ohm load and produce standard NTSC 75% saturat
17、ed color bars with a 100% white window. DC Power Supply Range: 0-50V, 2A well filtered. Temperature Controlled Soldering StationGrounded tip (Tip temperature: 500F-600F). Note: 500 F Maximum for leadless components. AC VariacContinuously variable. TEST EQUIPMENT REQUIREMENTS 1. Preparation for repla
18、cement a. Soldering Iron Use a pencil-type soldering iron that uses less than 30 watts. b.Solder Eutectic solder (Tin 63%, Lead 37%) is recommended. c. Soldering time Do not apply heat more than 4 seconds. d.Preheating Leadless capacitor must be preheated before installation. (130C150C, for about tw
19、o minutes). 2. Removing the leadless component (Resistors, Capacitors) Grasp the leadless component body with tweezers and alter- nately apply heat to both electrodes. When the solder on both electrodes is melted, remove leadless component with a twist- ing motion. LEADLESS (CHIP) COMPONENT REMOVAL
20、INSTRUCTION Note: a. Leadless component must not be reused after removal. b.Excessive mechanical stress and rubbing of the compo- nent electrode must be avoided. Note: a. Do not attempt to lift the component off the board until the component is completely disconnected from the board by a twisting ac
21、tion. b.Take care not to break the copper foil on printed board. The following procedures are recommended for the replacement of the leadless components used in this unit. Chip Tweezers Soldering lron PATH FIXTURE CONNECTION/TEST POINT IDENTIFICATION Refer to the adjustment of the tape transporting
22、system. Connect to PT01 !pin-pin of the MAIN CIRCUIT BOARD. CTL pulse test point GND S/W pulse test point ENVE pulse test point ! 3. Installing the Leadless (chip) Component a. Presolder the contact points of the circuit board. b. Press the part downward with tweezers and solder both electrodes as s
23、hown below. 4. Removing of Flat ICs (Recommended procedure) a. For removing solder chips from ICs pins, use a solder remover or a wiry solder absorber. b. Heat the ICs tips evenly by moving the chip IC replacing tool around them, and detach the ICs leads with a tool in the way of using a lever. c. D
24、o not reuse ICs removed once (Discard them) Note: Do not glue the replacement leadless component to the circuit board. Soldering lron Presolder Chip IC replacing tool Soldering lron Solder Tweezers LEADLESS (CHIP) COMPONENT IDENTIFICATION 1. Check the followings before S.M.D Troubleshooting Cracked
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