Jvc-KDSH-1000-Service-Manual(1) 电路图 维修手册.pdf

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1、SERVICE MANUAL COPYRIGHT 2006 Victor Company of Japan, Limited No.MA255 2006/3 CD RECEIVER MA25520063 KD-SH1000J,KD-SH1000E, KD-SH1000EX,KD-SH1000EY, KD-SH1000EU,KD-SH1000U, KD-SH1000UN,KD-SH1000UT, KD-SH1000UH Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)

2、TABLE OF CONTENTS 1PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 2SPECIFIC SERVICE INSTRUCTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3、 . . . . . . . 1-7 3DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8 4ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4、. . . . . . . . . . . . . . . . 1-23 5TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27 RadioFans.CN 收音机爱 好者资料库 1-2 (No.MA255) SPECIFICATION AUDIO AMPLIFIER SECTION Power Output (for J)20 W RMS 4 Cha

5、nnels at 4 and or = 1% THD+N Signal to Noise Ratio(for J)80 dBA (reference: 1 W into 4 ) Maximum Power OutputFront/Rear50 W per channel Continuous Power Output (RMS)Front/Rear19 W per channel into 4 , 40 Hz to 20 000 Hz at no more than 0.8% total harmonic distortion Load Impedance4 (4 to 8 allowance

6、) Equalizer Control Range FrequenciesGraphic EQ63 Hz, 125 Hz, 250 Hz, 500 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 12.5 kHz (9 bands) Parametric EQ3 bands (Band 1/2/3): 20 Hz, 25 Hz, 31.5 Hz, 40 Hz, 50 Hz, 63 Hz, 80 Hz, 100 Hz, 125 Hz, 160 Hz, 200 Hz, 250 Hz, 315 Hz, 400 Hz, 500 Hz, 630 Hz, 800 Hz, 1 kHz, 1.

7、2 kHz, 1.6 kHz, 2 kHz, 2.5 kHz, 3.2 kHz, 4 kHz, 5 kHz, 6.3 kHz, 8 kHz, 10 kHz, 12.5 kHz, 16 kHz, 20 kHz (31 frequencies) Level10 dB Frequency Response40 Hz to 20 000 Hz Level/ImpedanceLine-In1.5 V/20 k load (full scale) Line-Out5.0 V/20 k load (full scale) Output Impedance1 k Subwoofer-Out Level/Imp

8、edance2.0 V/20 k load (full scale) Other TerminalsLINE IN, CD changer TUNER SECTION Frequency RangeFM (for J)87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz) 87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz) FM87.5 MHz to 108.0 MHz AM (for J)530 kHz to 1 710 kHz (with channel i

9、nterval set to 10 kHz) 531 kHz to 1 602 kHz (with channel interval set to 9 kHz) AM (for asia)531 kHz to 1 602 kHz AM (for europe)(MW) 522 kHz to 1 620 kHz (LW) 144 kHz to 279 kHz FM TunerUsable Sensitivity11.3 dBf (1.0 V/75 ) 50 dB Quieting Sensitivity16.3 dBf (1.8 V/75 ) Alternate Channel Selectiv

10、ity (400 kHz) 65 dB Frequency Response40 Hz to 15 000 Hz Stereo Separation30 dB AM TunerSensitivity/Selectivity20 V/65 dB MW Tuner (for europe)Sensitivity/Selectivity20 V/65 dB LW Tuner (for europe)Sensitivity50 V RadioFans.CN 收音机爱 好者资料库 (No.MA255)1-3 Design and specifications are subject to change

11、without notice. CD PLAYER SECTION TypeCompact disc player Signal Detection SystemNon-contact optical pickup (semiconductor laser) Number of Channels2 channels (stereo) Frequency Response5 Hz to 20 000 Hz Dynamic Range98 dB Signal-to-Noise Ratio102 dB Wow and FlutterLess than measurable limit MP3Bit

12、Rate32 kbps - 320 kbps Sampling FrequencyMPEG-1: 48 kHz, 44.1 kHz, 33 kHz MPEG-2: 24 kHz, 22.05 kHz, 16 kHz WMABit Rate8 kbps - 320 kbps Sampling Frequency48 kHz, 44.1 kHz, 32 kHz SD CARD FormatFAT 12/16 Storage8 MB - 512 MB Playable Audio FormatMP3/WMA MP3Bit Rate8 kbps - 320 kbps Sampling Frequenc

13、yMPEG-1: 48 kHz, 44.1 kHz, 33 kHz WMABit RateMPEG-2: 24 kHz, 22.05 kHz, 16 kHz Sampling Frequency8 kbps - 192 kbps 48 kHz, 44.1 kHz, 32 kHz USB MEMORY FormatFAT 12/16/32 StorageLess than 4 GB (1 partition type) Playable Audio FormatMP3/WMA Max. CurrentLess than 500 mA MP3Bit Rate32 kbps - 320 kbps S

14、ampling FrequencyMPEG-1: 48 kHz, 44.1 kHz, 32 kHz MPEG-2: 24 kHz, 22.05 kHz, 16 kHz MPEG-2.5: 12 kHz, 11.025 kHz, 8 kHz WMABit Rate5 kbps - 320 kbps Sampling Frequency8 kHz - 48 kHz GENERAL Power RequirementDC 14.4 V (11 V to 16 V allowance) Grounding SystemNegative ground Allowable Operating Temper

15、ature0C to +40C (32F to 104F) Dimensions (W H D) Installation Size (approx.)182 mm 52 mm 162 mm (7-3/16 2-1/16 6-7/16) Panel Size (approx.)188 mm 58 mm 11 mm (7-7/16 2-5/16 7/16) Mass (approx.)1.7 kg (3.8 lbs) (excluding accessories) RadioFans.CN 收音机爱 好者资料库 1-4 (No.MA255) SECTION 1 PRECAUTIONS 1.1Sa

16、fety Precautions ! Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system. ! Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check. (No.

17、MA255)1-5 1.2Preventing static electricity Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs. 1.2.1 Grounding to prev

18、ent damage by static electricity Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as laser products. Be careful to use proper grounding in the area where repairs are being performed. (1) Ground the workbench Ground the workbench by laying conductive ma

19、terial (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it. (2) Ground yourself Use an anti-static wrist strap to release any static electricity built up in your body. (3) Handling the optical pickup In order to maintain quality during transp

20、ort and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.) Do not use a tester to check the condition of the laser diode in the optical pickup. The testers int

21、ernal power source can easily destroy the laser diode. 1.3Handling the traverse unit (optical pickup) (1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit. (2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the

22、 optical pickup. For specific details, refer to the replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a time when attaching it to the connector. (3) Handle the flexible cable carefully as it may break when subjected to str

23、ong force. (4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it. 1.4Attention when traverse unit is decomposed *Please refer to Disassembly method in the text for the pickup unit. Apply solder to the short land before the flexible wire is disconnected

24、 from the connector on the pickup unit. (If the flexible wire is disconnected without applying solder, the pickup may be destroyed by static electricity.) In the assembly, be sure to remove solder from the short land after connecting the flexible wire. 1M (caption) Anti-static wrist strap Conductive

25、 material (conductive sheet) or iron plate CN601 Short sectionsFlexible wire Mechanism control board 1-6 (No.MA255) 1.5Important for laser products 1.CLASS 1 LASER PRODUCT 2.DANGER : Invisible laser radiation when open and inter lock failed or defeated. Avoid direct exposure to beam. 3.CAUTION : The

26、re are no serviceable parts inside the Laser Unit. Do not disassemble the Laser Unit. Replace the complete Laser Unit if it malfunctions. 4.CAUTION : The CD,MD and DVD player uses invisible laser radiation and is equipped with safety switches which prevent emission of radiation when the drawer is op

27、en and the safety interlocks have failed or are defeated. It is dangerous to defeat the safety switches. 5.CAUTION : If safety switches malfunction, the laser is able to function. 6.CAUTION : Use of controls, adjustments or performance of procedures other than those specified here in may result in h

28、azardous radiation exposure. REPRODUCTION AND POSITION OF LABELS ! Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check. WARNING LABEL CAUTION : Visible and Invisible laser radiation when open and interlock failed or defeated. AVOID DIRECT EX

29、POSURE TO BEAM. (e) VARNING : Synlig och osynling laserstrlning nr den ppnas och sprren r urkopplad. Betrakta ej strlen. (s) VARO : Avattaessa ja suojalukitus ohitettuna tai viallisena olet alttiina nkyvlle ja nkymttmlle lasersteilylle. Vlt steen kohdistumista suoraan itseesi. (f) ADVARSEL : Synlig

30、og usynlig laserstrling nr maskinen er ben eller interlocken fejeler. Undg direkte eksponering til strling. (d) CLASS 1 LASER PRODUCT (No.MA255)1-7 SECTION 2 SPECIFIC SERVICE INSTRUCTIONS This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS. 1-8 (No.MA255) SECTION 3 DISASSEMBLY 3.1Mai

31、n body section 3.1.1Removing the front panel assembly (See Fig.1) (1) Push the detach button in the lower right part of the front panel assembly. (2) Remove the front panel assembly. Fig.1 3.1.2Removing the heat sink (See Fig.2) Reference: Remove the front panel assembly as required. (1) From the le

32、ft side of the main body, remove the two screws A and two screws B attaching the heat sink. (2) Remove the heat sink from the main body. Fig.2 Detach button Front panel assembly Heat sink AAB (No.MA255)1-9 3.1.3Removing the top chassis assembly (See Fig.3 to 6) Prior to performing the following proc

33、edures, remove the heat sink. Reference: Remove the front panel assembly as required. (1) From the bottom side of the main body, remove the two screws C attaching the top chassis assembly to the bottom chassis assembly. (See Fig.3) (2) Remove the two screws E attaching the IC heat sink from left sid

34、e of the main body. (See Fig.5) (3) From the both and rear sides of the main body, remove the four screws D attaching the top chassis assembly to the bottom chassis assembly. (See Fig.4 to 6) (4) Lift the top chassis assembly in the direction of the arrow, disconnect the connector CN503 on the mecha

35、nism con- trol board from the connector CN721 on the main board. (See Fig.4 to 6) (5) Take out the top chassis assembly from the bottom chassis assembly. Fig.3 Fig.4 Fig.5 Fig.6 Top chassis assembly C C Bottom chassis assembly Bottom chassis assembly Top chassis assembly D CN503 CN721 Main board Mec

36、hanism control board D E E Bottom chassis assembly Main board IC heat sink Top chassis assembly Mechanism control board Top chassis assembly Bottom chassis assemblyRear bracket D D 1-10 (No.MA255) 3.1.4Removing the front chassis assembly (See Fig 7, 8) Prior performing the following procedure, remov

37、e the front panel assembly, heat sink and top chassis assembly. (1) From the both sides of the top chassis assembly, remove the two screws F attaching the front chassis assembly. (2) Remove the front chassis assembly from the top chassis assembly. Fig.7 Fig.8 3.1.5Removing the CD mechanism assembly

38、(See Fig.9) Prior performing the following procedures, remove the front panel assembly, heat sink and top chassis assembly. Reference: Remove the front chassis assembly as required. (1) From the inside of the top chassis assembly, remove the three screws G attaching the CD mechanism assembly. (2) Re

39、lease the mecha heat sink from the slots a on the mech- anism control board and remove the mecha heat sink from the main body. (3) Take out the CD mechanism assembly from the top chas- sis. Fig.9 Top chassis assembly Front chassis assembly F Top chassis assembly Front chassis assembly F Top chassis

40、Mecha heat sink G GG CD mechanism assembly a Mechanism control board (No.MA255)1-11 3.1.6Removing the main board (See Fig.10, 11) Prior to performing the following procedures, remove the front panel assembly, heat sink and top chassis assembly. (1) From the rear side of the bottom chassis assembly,

41、remove the two screws H attaching the rear bracket to the bottom chassis assembly. (See Fig.10) (2) From the top side of the bottom chassis assembly, remove the tow screws J attaching the main board to the bottom chassis assembly. (See Fig.11) (3) Release the stopper of the connector CN701 on the ma

42、in board in an upward direction, disconnect the card wire from the connector CN701. (See Fig.11) (4) Disconnect the wire from the connector CN962 on the main board. (See Fig.11) (5) Disconnect the wire from connector CN961 on the main board. (See Fig.11) Reference: After connecting the wires, fix th

43、e wires with the wire holders. (6) Take out the main board from the bottom chassis assem- bly. Fig.10 Fig.11 3.1.7Removing the rear bracket (See Fig.12) Prior to performing the following procedures, remove the front panel assembly, heat sink, top chassis assembly and main board. (1) Remove the one s

44、crew K (European version is two screws) and two screws L attaching the wires to the rear bracket. (2) Remove the two screws M attaching the wire bracket to the rear bracket. (3) From the rear side of the main board, remove the wires from the rear bracket in the direction of the arrow. Reference: Aft

45、er attaching the rear bracket to the main board, pass the wires through the wire bracket and insert them into the slots of the rear bracket. Fig.12 Bottom chassis assembly Rear bracket H CN962 CN701 Stopper Bottom chassis assembly J J CN961Main board Card wire Front door mechanism assembly LM Rear b

46、racket KK (only europian version) 1-12 (No.MA255) 3.1.8Removing the front door mechanism assembly (See Fig.13) Prior to perform the following procedures, remove the front panel assembly, heat sink, top chassis assembly and main board. (1) From the top side of the bottom chassis assembly, remove the

47、one screw N attaching the FPC guide to the bottom chassis. (2) Remove the five screws P attaching the front door mecha- nism assembly to the bottom chassis. Reference: When attaching the screws N and P, apply a locking agent them. (3) Take out the front door mechanism assembly from the bot- tom chas

48、sis. Fig.13 3.1.9Removing the switch board (See Fig.14 to 16) Prior to performing the following procedures, remove the front panel assembly. (1) From the rear side of the front panel assembly, remove the five screws Q attaching the rear cover to the front panel as- sembly, (See Fig.14) (2) Release t

49、he nine joints b of the front panel assembly and remove the rear cover. (See Fig.15) (3) Take out the switch board from the font panel assembly. (See Fig.16) Note: When removing the rear cover assembly and switch board, be careful not to lose the spring. Fig.14 Fig.15 Fig.16 Bottom chassis P P N FPC guide Front door mechanism assembly Q Rear cover assembly Q Q Rear cover assembly Joints bJoints b Joints b Switch board Front panel assembly Spring (No.MA255)1-13 3.2CD mechanism assembly section Remove th